NL1001098C2 - Inrichting voor het zonder vloeimiddel solderen. - Google Patents

Inrichting voor het zonder vloeimiddel solderen. Download PDF

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Publication number
NL1001098C2
NL1001098C2 NL1001098A NL1001098A NL1001098C2 NL 1001098 C2 NL1001098 C2 NL 1001098C2 NL 1001098 A NL1001098 A NL 1001098A NL 1001098 A NL1001098 A NL 1001098A NL 1001098 C2 NL1001098 C2 NL 1001098C2
Authority
NL
Netherlands
Prior art keywords
sonotrode
solder
wave
top surface
soldering
Prior art date
Application number
NL1001098A
Other languages
English (en)
Dutch (nl)
Other versions
NL1001098A1 (nl
Inventor
Ewald Garrecht
Original Assignee
Ersa Loettechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Loettechnik Gmbh filed Critical Ersa Loettechnik Gmbh
Publication of NL1001098A1 publication Critical patent/NL1001098A1/xx
Application granted granted Critical
Publication of NL1001098C2 publication Critical patent/NL1001098C2/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
NL1001098A 1994-08-30 1995-08-30 Inrichting voor het zonder vloeimiddel solderen. NL1001098C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4432402 1994-08-30
DE4432402A DE4432402C2 (de) 1994-08-30 1994-08-30 Schwall-Lötdüse zum flußmittelfreien Löten

Publications (2)

Publication Number Publication Date
NL1001098A1 NL1001098A1 (nl) 1996-02-29
NL1001098C2 true NL1001098C2 (nl) 1997-07-25

Family

ID=6527997

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1001098A NL1001098C2 (nl) 1994-08-30 1995-08-30 Inrichting voor het zonder vloeimiddel solderen.

Country Status (3)

Country Link
US (1) US5762257A (de)
DE (1) DE4432402C2 (de)
NL (1) NL1001098C2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530989C1 (de) * 1995-08-23 1997-03-13 Atotech Deutschland Gmbh Verfahren zum Filmstrippen
DE19541340A1 (de) * 1995-11-06 1997-05-15 Linde Ag Verfahren zum kontinuierlichen, selektiven Löten von Baueinheiten, insbesondere Leiterplatten
JP2875211B2 (ja) * 1996-06-28 1999-03-31 株式会社アルテクス 半田付け用超音波ホーン
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
US6257480B1 (en) * 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
JP2003025063A (ja) * 2001-07-09 2003-01-28 Nihon Dennetsu Keiki Co Ltd 半田付け方法及び半田付け装置
DE10204355A1 (de) * 2002-02-01 2003-08-14 Bosch Gmbh Robert Steuergerät
DE202011107022U1 (de) * 2011-10-21 2012-04-05 Asscon Systemtechnik-Elektronik Gmbh Vorrichtung zum Löten
DE102013100473A1 (de) * 2013-01-17 2014-07-17 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Reinigen einer Lötdüse
DE102013112367A1 (de) * 2013-11-11 2015-05-13 Ersa Gmbh Verfahren und Vorrichtung zum Löten von Leiterplatten
PL3161237T3 (pl) 2014-06-27 2018-12-31 Saint-Gobain Glass France Oszklenie zespolone z elementem dystansowym i sposób wytwarzania takiego oszklenia oraz jego zastosowanie jako oszklenia budynku
WO2015197491A1 (de) 2014-06-27 2015-12-30 Saint-Gobain Glass France Isolierverglasung mit abstandhalter und verfahren zur herstellung
US9427828B2 (en) 2014-08-08 2016-08-30 International Business Machines Corporation Increasing solder hole-fill in a printed circuit board assembly
US10626663B2 (en) 2014-09-25 2020-04-21 Saint-Gobain Glass France Spacer for insulating glazing units
TR201902255T4 (tr) 2014-10-07 2019-03-21 Saint Gobain Elektrik iletme özelliğine sahip kaplamaya ve bunun üzerine lehimlenen metalik bir banda sahip bir cam levhanın imal edilmesi için yöntem; ilgili cam levha.
KR20170109616A (ko) 2015-03-02 2017-09-29 쌩-고벵 글래스 프랑스 절연 글레이징용 유리 섬유-강화 스페이서
US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266136A (en) * 1963-03-29 1966-08-16 Western Electric Co Mass soldering apparatus and method using vibratory energy
US3303983A (en) * 1964-11-12 1967-02-14 Gen Dynamics Corp Ultrasonic soldering apparatus
US3536243A (en) * 1968-01-08 1970-10-27 Branson Instr Ultrasonic soldering apparatus
DE2017862B2 (de) * 1970-04-14 1972-02-03 Siemens AG, 1000 Berlin u. 8000 München Loetbad zum flussmittelfreien verzinnen
US3966110A (en) * 1974-09-23 1976-06-29 Hollis Engineering, Inc. Stabilizer system with ultrasonic soldering
DE3218338A1 (de) * 1982-05-14 1983-11-17 Royonic Elektronik Produktionsmaschinen GmbH, 8057 Eching Loetverfahren und -vorrichtung
DE3218388A1 (de) * 1982-05-15 1983-11-17 Fleißner GmbH & Co, Maschinenfabrik, 6073 Egelsbach Quetschwalzenpaar mit einer durchbiegungsausgleichswalze

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DON SWANSON: "Ultrasonic replaces flux in wave soldering", ELECTRONIC PACKAGING & PRODUCTION, vol. 35, no. 4, April 1995 (1995-04-01), NEWTON, MASS., USA, pages 26, XP000500661 *

Also Published As

Publication number Publication date
DE4432402C2 (de) 1998-07-02
NL1001098A1 (nl) 1996-02-29
US5762257A (en) 1998-06-09
DE4432402A1 (de) 1996-03-07

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PD2B A search report has been drawn up
VD1 Lapsed due to non-payment of the annual fee

Effective date: 20020301