MY7700063A - A method of assembling a semiconductor device - Google Patents

A method of assembling a semiconductor device

Info

Publication number
MY7700063A
MY7700063A MY63/77A MY7700063A MY7700063A MY 7700063 A MY7700063 A MY 7700063A MY 63/77 A MY63/77 A MY 63/77A MY 7700063 A MY7700063 A MY 7700063A MY 7700063 A MY7700063 A MY 7700063A
Authority
MY
Malaysia
Prior art keywords
pad
lead
leads
frame
coplanar
Prior art date
Application number
MY63/77A
Other languages
English (en)
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of MY7700063A publication Critical patent/MY7700063A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
MY63/77A 1971-05-13 1977-12-30 A method of assembling a semiconductor device MY7700063A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14290171A 1971-05-13 1971-05-13

Publications (1)

Publication Number Publication Date
MY7700063A true MY7700063A (en) 1977-12-31

Family

ID=22501734

Family Applications (1)

Application Number Title Priority Date Filing Date
MY63/77A MY7700063A (en) 1971-05-13 1977-12-30 A method of assembling a semiconductor device

Country Status (14)

Country Link
US (1) US3685137A (https=)
JP (1) JPS5121744B1 (https=)
AU (1) AU463288B2 (https=)
BE (1) BE783423A (https=)
CA (1) CA951026A (https=)
DE (1) DE2221886C3 (https=)
ES (3) ES402464A1 (https=)
FR (1) FR2137669B1 (https=)
GB (1) GB1338188A (https=)
HK (1) HK73676A (https=)
IT (1) IT955452B (https=)
MY (1) MY7700063A (https=)
NL (1) NL7206425A (https=)
SE (1) SE384426B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3768986A (en) * 1971-10-08 1973-10-30 Micro Science Ass Laminated lead frame and method of producing same
US3995845A (en) * 1972-12-26 1976-12-07 Rca Corporation Ultrasonic wire bonding chuck
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages
EP0063170A3 (en) * 1981-04-21 1983-08-31 Rockwell International Corporation Pneumatic wire lifter and method
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
US5673845A (en) 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
US5647528A (en) 1996-02-06 1997-07-15 Micron Technology, Inc. Bondhead lead clamp apparatus and method
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
US5890644A (en) * 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6121674A (en) * 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6634538B2 (en) 1998-04-02 2003-10-21 Micron Technology, Inc. Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
US6126062A (en) * 1998-04-02 2000-10-03 Micron Technology, Inc. Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement

Also Published As

Publication number Publication date
FR2137669B1 (https=) 1978-07-21
BE783423A (fr) 1972-09-01
ES406434A1 (es) 1975-07-01
JPS5121744B1 (https=) 1976-07-05
ES402464A1 (es) 1975-12-16
US3685137A (en) 1972-08-22
AU4221672A (en) 1973-11-15
SE384426B (sv) 1976-05-03
DE2221886A1 (de) 1972-11-23
CA951026A (en) 1974-07-09
AU463288B2 (en) 1975-07-24
DE2221886B2 (de) 1980-03-06
FR2137669A1 (https=) 1972-12-29
GB1338188A (en) 1973-11-21
ES406435A1 (es) 1975-07-16
NL7206425A (https=) 1972-11-15
IT955452B (it) 1973-09-29
DE2221886C3 (de) 1980-11-20
HK73676A (en) 1976-12-03

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