MY196621A - Method for Introducing at Least One Cutout or Aperture Into a Sheetlike Workpiece - Google Patents

Method for Introducing at Least One Cutout or Aperture Into a Sheetlike Workpiece

Info

Publication number
MY196621A
MY196621A MYPI2017700845A MYPI2017700845A MY196621A MY 196621 A MY196621 A MY 196621A MY PI2017700845 A MYPI2017700845 A MY PI2017700845A MY PI2017700845 A MYPI2017700845 A MY PI2017700845A MY 196621 A MY196621 A MY 196621A
Authority
MY
Malaysia
Prior art keywords
workpiece
cutout
aperture
laser radiation
introducing
Prior art date
Application number
MYPI2017700845A
Other languages
English (en)
Inventor
Norbert Ambrosius
Roman Ostholt
Original Assignee
Lpkf Laser & Electronics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54072638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY196621(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from DE102014113339.0A external-priority patent/DE102014113339A1/de
Application filed by Lpkf Laser & Electronics Ag filed Critical Lpkf Laser & Electronics Ag
Publication of MY196621A publication Critical patent/MY196621A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Ceramic Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Lead Frames For Integrated Circuits (AREA)
MYPI2017700845A 2014-09-16 2015-08-07 Method for Introducing at Least One Cutout or Aperture Into a Sheetlike Workpiece MY196621A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014113339.0A DE102014113339A1 (de) 2014-09-16 2014-09-16 Verfahren zur Erzeugung von Ausnehmungen in einem Material
DE102014116291 2014-11-07
PCT/DE2015/100333 WO2016041544A1 (de) 2014-09-16 2015-08-07 Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück

Publications (1)

Publication Number Publication Date
MY196621A true MY196621A (en) 2023-04-23

Family

ID=54072638

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017700845A MY196621A (en) 2014-09-16 2015-08-07 Method for Introducing at Least One Cutout or Aperture Into a Sheetlike Workpiece

Country Status (11)

Country Link
US (2) US11610784B2 (https=)
EP (2) EP4061101A1 (https=)
JP (2) JP6782692B2 (https=)
KR (6) KR20170044143A (https=)
CN (1) CN107006128B (https=)
ES (1) ES2923764T5 (https=)
LT (1) LT3195706T (https=)
MY (1) MY196621A (https=)
SG (2) SG10201902331XA (https=)
TW (1) TWI616939B (https=)
WO (1) WO2016041544A1 (https=)

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DE102018100299A1 (de) * 2017-01-27 2018-08-02 Schott Ag Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung
KR20190116378A (ko) 2017-03-06 2019-10-14 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
US11072041B2 (en) 2017-03-06 2021-07-27 Lpkf Laser & Electronics Ag Method for producing a technical mask
DE102018110211A1 (de) * 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
TWI678342B (zh) * 2018-11-09 2019-12-01 財團法人工業技術研究院 形成導角的切割方法
DE102020100848B4 (de) 2019-01-29 2023-07-27 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Mikrostrukturierung eines Glassubstrats mittels Laserstrahlung
DE102019201347B3 (de) * 2019-02-01 2020-06-18 Lpkf Laser & Electronics Ag Herstellung von metallischen Leiterbahnen an Glas
KR20210124384A (ko) * 2019-02-08 2021-10-14 코닝 인코포레이티드 펄스형 레이저 빔 초점 라인 및 증기 에칭을 사용하여 투명 워크피스를 레이저 가공하는 방법
DE102019121827A1 (de) * 2019-08-13 2021-02-18 Trumpf Laser- Und Systemtechnik Gmbh Laserätzen mit variierender Ätzselektivität
CN113594014B (zh) * 2020-04-30 2024-04-12 中微半导体设备(上海)股份有限公司 零部件、等离子体反应装置及零部件加工方法
DE102020114195A1 (de) 2020-05-27 2021-12-02 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zum Einbringen einer Ausnehmung in ein Substrat
DE102020118939A1 (de) * 2020-07-17 2022-01-20 Schott Ag Glaswafer und Glaselement für Drucksensoren
CN111799169B (zh) * 2020-07-17 2024-05-28 绍兴同芯成集成电路有限公司 一种飞秒激光结合hf湿蚀刻加工tgv的工艺
DE102020120370B3 (de) 2020-08-03 2022-02-03 Infineon Technologies Ag Mems-sensor mit partikelfilter und verfahren zu seiner herstellung
KR20220019158A (ko) 2020-08-06 2022-02-16 삼성디스플레이 주식회사 윈도우 및 이를 포함하는 표시장치
EP4011846A1 (en) 2020-12-09 2022-06-15 Schott Ag Method of structuring a glass element and structured glass element produced thereby
DE102021204675B4 (de) 2021-05-07 2023-05-17 Lpkf Laser & Electronics Se Vorrichtung und Verfahren zur Zellkultivierung
CN113510364B (zh) * 2021-07-28 2022-11-25 广东工业大学 一种基于激光辅助溶解的三维空腔结构的成型方法
EP4296244A1 (de) 2022-06-21 2023-12-27 LPKF Laser & Electronics SE Substratträger aus glas zur bearbeitung eines substrats und ein verfahren zu dessen herstellung
DE102022127259B4 (de) 2022-10-18 2026-02-12 Lpkf Laser & Electronics Aktiengesellschaft Verfahren sowie Vorrichtung zur Abbildung eines Strahls auf ein Objekt und Verfahren zum Einbringen einer Öffnung in ein Werkstück mittels dieses Verfahrens
DE102023125725A1 (de) * 2023-09-22 2025-03-27 Schott Ag Laser-strukturiertes optisches Element
DE102024105120A1 (de) * 2024-02-23 2025-08-28 Lpkf Laser & Electronics Se Verfahren zur Integration und/oder Bearbeitung wenigstens eines Substrats sowie Substratstapel

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JP4880820B2 (ja) 2001-01-19 2012-02-22 株式会社レーザーシステム レーザ支援加工方法
JP4418282B2 (ja) 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
JP4222296B2 (ja) 2004-11-22 2009-02-12 住友電気工業株式会社 レーザ加工方法とレーザ加工装置
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DE102010025966B4 (de) 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
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JP5508533B2 (ja) * 2010-07-26 2014-06-04 浜松ホトニクス株式会社 光吸収基板の製造方法、及びそれを製造するための成形型の製造方法
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EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
JP6113529B2 (ja) * 2013-03-05 2017-04-12 株式会社ディスコ ウエーハの加工方法
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US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP2019535619A (ja) * 2016-11-04 2019-12-12 コーニング インコーポレイテッド 微細穿孔板システム、用途、および微細穿孔板システムを作る方法
US11344973B2 (en) * 2018-04-19 2022-05-31 Corning Incorporated Methods for forming holes in substrates

Also Published As

Publication number Publication date
KR20170044143A (ko) 2017-04-24
JP2020185613A (ja) 2020-11-19
JP2017534458A (ja) 2017-11-24
EP3195706B1 (de) 2022-06-01
US20170256422A1 (en) 2017-09-07
US12604743B2 (en) 2026-04-14
SG11201702091WA (en) 2017-04-27
JP7049404B2 (ja) 2022-04-06
JP6782692B2 (ja) 2020-11-11
CN107006128A (zh) 2017-08-01
KR20250133802A (ko) 2025-09-08
TWI616939B (zh) 2018-03-01
US20220223434A1 (en) 2022-07-14
KR102813417B1 (ko) 2025-05-29
WO2016041544A1 (de) 2016-03-24
CN107006128B (zh) 2020-05-19
SG10201902331XA (en) 2019-04-29
KR102851778B1 (ko) 2025-09-01
TW201621986A (zh) 2016-06-16
ES2923764T3 (es) 2022-09-30
ES2923764T5 (en) 2025-10-09
US11610784B2 (en) 2023-03-21
KR20210022773A (ko) 2021-03-03
KR20230084606A (ko) 2023-06-13
KR20250079054A (ko) 2025-06-04
KR20190065480A (ko) 2019-06-11
EP3195706B2 (de) 2025-05-14
EP3195706A1 (de) 2017-07-26
LT3195706T (lt) 2022-08-10
EP4061101A1 (de) 2022-09-21

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