LT2015085A - Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys - Google Patents
Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginysInfo
- Publication number
- LT2015085A LT2015085A LT2015085A LT2015085A LT2015085A LT 2015085 A LT2015085 A LT 2015085A LT 2015085 A LT2015085 A LT 2015085A LT 2015085 A LT2015085 A LT 2015085A LT 2015085 A LT2015085 A LT 2015085A
- Authority
- LT
- Lithuania
- Prior art keywords
- laser beam
- intensity profile
- workpiece
- gauss
- optical element
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/072—Armoured glass, i.e. comprising reinforcement
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Išradimas priklauso lazerių sričiai ir yra susijęs su skaidrių terpių apdirbimu ir gali būti panaudotas skaidrių terpių tarp jų stiklų, chemiškai grūdintų stiklų, safyrų bei kitokių kristalinių medžiagų pjaustymui, skaldymui ir kitiems apdirbimo procesams panaudojant ultratrumpųjų impulsų lazerinės spinduliuotės Beselio-Gauso asimetrinio intensyvumo skirstinio pluoštą. Gauso intensyvumo skirstinio ultratrumpųjų impulsų lazerio pluoštą transformuoja į asimetrinio intensyvumo skirstinio Beselio-Gauso pluoštą patalpinant optinį elementą Gauso arba Beselio-Gauso intensyvumo skirtinio pluošto optiniame kelyje, Beselio-Gauso intensyvumo skirstinio pluošto asimetriją keičia parenkant optinio elemento medžiagą ir/arba parametrus ir/arba jo išdėstymą optiniame kelyje taip, kad Beselio-Gauso lazerinės spinduliuotės pluoštas, lokalizuotas apdirbamame ruošinyje, turi pailgą pavidalą tiek pluošto sklidimo kryptimi tiek plokštumoje, statmenoje minėtai lazerinės spinduliuotės pluošto sklidimo krypčiai. Formuojant pjovimo ir/arba skilimo plokštumą, minėtą skaidrios medžiagos ruošinį ir lokalizuotą Beselio-Gauso lazerinės spinduliuotės pluoštą vienas kito atžvilgiu valdomai perkelia taip, kad ruošinyje suformuotos pailgo pavidalo pažaidos sritys išilgai išdėstomos viena po kitos pjovimo ir/arba skilimo plokštumos trajektorijoje.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2015085A LT6428B (lt) | 2015-10-02 | 2015-10-02 | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
| CN201610255377.0A CN106560269B (zh) | 2015-10-02 | 2016-04-22 | 对透明材料进行激光加工的方法和装置 |
| EP16787347.0A EP3356300B1 (en) | 2015-10-02 | 2016-09-30 | Method and device for laser processing of transparent materials |
| KR1020187012424A KR102584490B1 (ko) | 2015-10-02 | 2016-09-30 | 투명한 재료의 레이저 가공 방법 및 장치 |
| US15/761,596 US20180345419A1 (en) | 2015-10-02 | 2016-09-30 | Method and device for laser processing of transparent materials |
| PCT/EP2016/073460 WO2017055576A1 (en) | 2015-10-02 | 2016-09-30 | Method and device for laser processing of transparent materials |
| LTEP16787347.0T LT3356300T (lt) | 2015-10-02 | 2016-09-30 | Skaidrių medžiagų lazerinio apdorojimo būdas ir prietaisas |
| JP2018516757A JP7046798B2 (ja) | 2015-10-02 | 2016-09-30 | 透明材料のレーザ加工方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2015085A LT6428B (lt) | 2015-10-02 | 2015-10-02 | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| LT2015085A true LT2015085A (lt) | 2017-04-10 |
| LT6428B LT6428B (lt) | 2017-07-25 |
Family
ID=55022652
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LT2015085A LT6428B (lt) | 2015-10-02 | 2015-10-02 | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
| LTEP16787347.0T LT3356300T (lt) | 2015-10-02 | 2016-09-30 | Skaidrių medžiagų lazerinio apdorojimo būdas ir prietaisas |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LTEP16787347.0T LT3356300T (lt) | 2015-10-02 | 2016-09-30 | Skaidrių medžiagų lazerinio apdorojimo būdas ir prietaisas |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20180345419A1 (lt) |
| EP (1) | EP3356300B1 (lt) |
| JP (1) | JP7046798B2 (lt) |
| KR (1) | KR102584490B1 (lt) |
| CN (1) | CN106560269B (lt) |
| LT (2) | LT6428B (lt) |
| WO (1) | WO2017055576A1 (lt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12233474B2 (en) | 2020-06-04 | 2025-02-25 | Corning Incorporated | Methods for laser processing transparent workpieces using modified pulse burst profiles |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016138054A1 (en) | 2015-02-27 | 2016-09-01 | Corning Incorporated | Optical assembly having microlouvers |
| DE102017206461B4 (de) | 2017-04-13 | 2019-05-02 | Schott Ag | Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks |
| CN115259646B (zh) | 2017-05-19 | 2024-05-17 | 肖特股份有限公司 | 一种包括玻璃或玻璃陶瓷的组件及用于生产该组件的方法 |
| TW201919805A (zh) * | 2017-08-25 | 2019-06-01 | 美商康寧公司 | 使用遠焦光束調整組件以雷射處理透明工件的設備與方法 |
| US10830943B2 (en) * | 2017-10-31 | 2020-11-10 | Corning Incorporated | Optical fibers and optical systems comprising the same |
| WO2019179603A1 (de) * | 2018-03-20 | 2019-09-26 | Robert Bosch Gmbh | Verfahren und vorrichtung zur prozessorientierten strahlformanpassung und strahlorientierung |
| US11059131B2 (en) | 2018-06-22 | 2021-07-13 | Corning Incorporated | Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer |
| US11075496B2 (en) | 2018-06-28 | 2021-07-27 | Samsung Electronics Co., Ltd. | Laser dicing device, method of laser beam modulation, and method of dicing a substrate |
| DE112019006721T5 (de) * | 2019-03-19 | 2021-10-28 | Murata Manufacturing Co., Ltd. | Optische vorrichtung |
| LT6791B (lt) * | 2019-05-15 | 2020-12-28 | Uab "Altechna R&D" | Skaidrių medžiagų apdirbimo būdas ir įrenginys |
| DE102019121827A1 (de) * | 2019-08-13 | 2021-02-18 | Trumpf Laser- Und Systemtechnik Gmbh | Laserätzen mit variierender Ätzselektivität |
| US10903121B1 (en) * | 2019-08-14 | 2021-01-26 | Applied Materials, Inc. | Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process |
| CN114556163A (zh) * | 2019-08-15 | 2022-05-27 | 康宁股份有限公司 | 结合基材以及通过结合部分离所结合的基材的一部分的方法,例如制造液体透镜阵列以及将阵列分离为独立的液体透镜 |
| CN110539085A (zh) * | 2019-09-11 | 2019-12-06 | 华东师范大学重庆研究院 | 一种飞秒光丝隐切方法及装置 |
| DE102019128362B3 (de) * | 2019-10-21 | 2021-02-18 | Trumpf Laser- Und Systemtechnik Gmbh | Segmentiertes Strahlformungselement und Laserbearbeitungsanlage |
| DE102019129036A1 (de) * | 2019-10-28 | 2021-04-29 | Schott Ag | Verfahren zur Herstellung von Glasscheiben und verfahrensgemäß hergestellte Glasscheibe sowie deren Verwendung |
| KR20210110510A (ko) | 2020-02-28 | 2021-09-08 | 쇼오트 아게 | 유리 부재의 분리 방법 및 유리 서브부재 |
| ES2976069T3 (es) * | 2020-03-06 | 2024-07-22 | Schott Ag | Procedimiento para la preparación y/o realización de la separación de un elemento de sustrato y un elemento parcial de sustrato |
| CN111716015B (zh) * | 2020-05-28 | 2022-06-14 | 大族激光科技产业集团股份有限公司 | 一种激光切割裂纹控制方法及装置 |
| CN113770548A (zh) * | 2020-06-10 | 2021-12-10 | 大族激光科技产业集团股份有限公司 | 激光加工系统、激光加工方法及获得椭圆形光斑的方法 |
| US12440925B2 (en) | 2020-07-15 | 2025-10-14 | Hamamatsu Photonics K.K. | Laser machining apparatus, laser machining method, and method for manufacturing semiconductor member |
| KR102907767B1 (ko) * | 2020-07-15 | 2026-01-06 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공 장치, 및 레이저 가공 방법 |
| KR102375235B1 (ko) | 2020-09-08 | 2022-03-16 | 주식회사 필옵틱스 | 레이저 가공 시스템 및 방법 |
| KR20230065304A (ko) * | 2020-09-09 | 2023-05-11 | 코닝 인코포레이티드 | 투명 작업편의 고각도 레이저 처리를 위한 방법 및 광학 어셈블리 |
| US12006245B2 (en) * | 2020-09-11 | 2024-06-11 | Corning Incorporated | Laser forming non-square edges in transparent workpieces using low intensity airy beams |
| CN112142315A (zh) * | 2020-09-22 | 2020-12-29 | 东莞市盛雄激光先进装备股份有限公司 | 一种厚玻璃的超快激光加工系统及方法 |
| DE102020134195A1 (de) * | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
| DE102020134198A1 (de) * | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
| US12304005B2 (en) | 2021-02-01 | 2025-05-20 | Corning Incorporated | Sacrificial layers to enable laser cutting of textured substrates |
| EP4288235A1 (de) * | 2021-02-02 | 2023-12-13 | Trumpf Laser- und Systemtechnik GmbH | Vorrichtung und verfahren zur laserbearbeitung eines werkstücks |
| CN116867598A (zh) * | 2021-02-02 | 2023-10-10 | 通快激光与系统工程有限公司 | 用于激光加工工件的设备和方法 |
| JP7644828B2 (ja) * | 2021-02-02 | 2025-03-12 | トルンプフ レーザー- ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | ワークピースをレーザ加工するための装置及び方法 |
| CN116829295A (zh) * | 2021-02-02 | 2023-09-29 | 通快激光与系统工程有限公司 | 用于对工件进行激光加工的设备和方法 |
| CN115041815B (zh) * | 2021-02-26 | 2025-10-10 | 深圳市大族半导体装备科技有限公司 | 一种脆性材料的激光加工系统及加工方法 |
| CN117440873A (zh) * | 2021-06-02 | 2024-01-23 | 通快激光与系统工程有限公司 | 用于对工件进行激光加工的方法及设备 |
| DE102021123801A1 (de) | 2021-06-02 | 2022-12-08 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks |
| DE102021120286A1 (de) * | 2021-08-04 | 2023-02-09 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks |
| DE102021123962A1 (de) | 2021-09-16 | 2023-03-16 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks |
| KR20230064664A (ko) | 2021-11-03 | 2023-05-11 | 삼성디스플레이 주식회사 | 광학 시스템 |
| DE102021131811A1 (de) | 2021-12-02 | 2023-06-07 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks |
| CN115582631B (zh) * | 2022-09-23 | 2024-10-08 | 深圳市汇川技术股份有限公司 | 飞行加工方法、装置、激光平面切割设备及介质 |
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- 2016-04-22 CN CN201610255377.0A patent/CN106560269B/zh active Active
- 2016-09-30 KR KR1020187012424A patent/KR102584490B1/ko active Active
- 2016-09-30 EP EP16787347.0A patent/EP3356300B1/en active Active
- 2016-09-30 WO PCT/EP2016/073460 patent/WO2017055576A1/en not_active Ceased
- 2016-09-30 LT LTEP16787347.0T patent/LT3356300T/lt unknown
- 2016-09-30 JP JP2018516757A patent/JP7046798B2/ja active Active
- 2016-09-30 US US15/761,596 patent/US20180345419A1/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12233474B2 (en) | 2020-06-04 | 2025-02-25 | Corning Incorporated | Methods for laser processing transparent workpieces using modified pulse burst profiles |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3356300A1 (en) | 2018-08-08 |
| JP7046798B2 (ja) | 2022-04-04 |
| LT3356300T (lt) | 2019-09-25 |
| KR102584490B1 (ko) | 2023-10-04 |
| CN106560269A (zh) | 2017-04-12 |
| EP3356300B1 (en) | 2019-08-14 |
| CN106560269B (zh) | 2020-02-18 |
| KR20180061331A (ko) | 2018-06-07 |
| JP2018535912A (ja) | 2018-12-06 |
| US20180345419A1 (en) | 2018-12-06 |
| WO2017055576A1 (en) | 2017-04-06 |
| LT6428B (lt) | 2017-07-25 |
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