PL3159093T3 - Metoda kontroli procesów cięcia laserowego w zakresie wysokiej mocy z przerwaniem procesu cięcia; odpowiednie urządzenia i program komputerowy do obsługi - Google Patents

Metoda kontroli procesów cięcia laserowego w zakresie wysokiej mocy z przerwaniem procesu cięcia; odpowiednie urządzenia i program komputerowy do obsługi

Info

Publication number
PL3159093T3
PL3159093T3 PL15191289T PL15191289T PL3159093T3 PL 3159093 T3 PL3159093 T3 PL 3159093T3 PL 15191289 T PL15191289 T PL 15191289T PL 15191289 T PL15191289 T PL 15191289T PL 3159093 T3 PL3159093 T3 PL 3159093T3
Authority
PL
Poland
Prior art keywords
interruption
controlling
computer program
high energy
corresponding device
Prior art date
Application number
PL15191289T
Other languages
English (en)
Inventor
Andreas Lüdi
Roland Bader
Original Assignee
Bystronic Laser Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bystronic Laser Ag filed Critical Bystronic Laser Ag
Publication of PL3159093T3 publication Critical patent/PL3159093T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)
PL15191289T 2015-10-23 2015-10-23 Metoda kontroli procesów cięcia laserowego w zakresie wysokiej mocy z przerwaniem procesu cięcia; odpowiednie urządzenia i program komputerowy do obsługi PL3159093T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15191289.6A EP3159093B1 (de) 2015-10-23 2015-10-23 Verfahren zur kontrolle von laserschneidvorgängen in hochleistungsbereich mit schneidvorgangunterbrechung entsprechende vorrichtung und computerprogrammprodukt

Publications (1)

Publication Number Publication Date
PL3159093T3 true PL3159093T3 (pl) 2018-12-31

Family

ID=54360900

Family Applications (2)

Application Number Title Priority Date Filing Date
PL18183693T PL3412399T3 (pl) 2015-10-23 2015-10-23 Sposób kontrolowania procesów cięcia laserowego w zakresie dużej mocy z przerywaniem procesu cięcia, odpowiednie urządzenie i produkt w postaci programu komputerowego
PL15191289T PL3159093T3 (pl) 2015-10-23 2015-10-23 Metoda kontroli procesów cięcia laserowego w zakresie wysokiej mocy z przerwaniem procesu cięcia; odpowiednie urządzenia i program komputerowy do obsługi

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PL18183693T PL3412399T3 (pl) 2015-10-23 2015-10-23 Sposób kontrolowania procesów cięcia laserowego w zakresie dużej mocy z przerywaniem procesu cięcia, odpowiednie urządzenie i produkt w postaci programu komputerowego

Country Status (3)

Country Link
US (2) US10675709B2 (pl)
EP (2) EP3412399B1 (pl)
PL (2) PL3412399T3 (pl)

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SE542303C2 (en) * 2017-08-17 2020-04-07 Tepe Munhygienprodukter Ab Method and apparatus for end rounding bristles
JP6767416B2 (ja) * 2018-03-26 2020-10-14 ファナック株式会社 加工条件調整装置及び機械学習装置
DE102018216873A1 (de) * 2018-10-01 2020-04-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks
DE102018217526A1 (de) 2018-10-12 2020-04-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Ermitteln einer Kenngröße eines Bearbeitungsprozesses und Bearbeitungsmaschine
DE102018126069B3 (de) * 2018-10-19 2019-10-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Fertigungssystem und verfahren zum schachteln von teilräumen für eine ansteuerung eines schneidprozesses
US20200189027A1 (en) * 2018-12-07 2020-06-18 Seoul Laser Dieboard System Co., Ltd. Constant kerf dieboard cutting system using laser and vision
EP3671373A1 (de) * 2018-12-19 2020-06-24 Bystronic Laser AG Prognoseverfahren zur prognose eines bearbeitungsergebnisses für ein laserbearbeitungsverfahren
DE102019116735A1 (de) * 2019-06-20 2020-12-24 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Kontrolle und Nacharbeitung eines Werkstückes mit einer lasergeschnittenen geschlossenen Innenkontur
IT201900025093A1 (it) * 2019-12-20 2021-06-20 Adige Spa Procedimento per una lavorazione laser
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CN113333958B (zh) * 2020-02-17 2023-09-22 Nps株式会社 激光加工系统及方法
JP7375634B2 (ja) * 2020-03-16 2023-11-08 村田機械株式会社 レーザ加工システム、及びレーザ加工方法
EP3885069A1 (de) 2020-03-25 2021-09-29 Bystronic Laser AG Qualitätskontrolle eines laserbearbeitungsprozesses mittels maschinellem lernen
CN115413251A (zh) * 2020-03-25 2022-11-29 百超激光有限公司 使用机器学习的激光加工过程的质量控制
CN111843241A (zh) * 2020-08-21 2020-10-30 苏州米尔精密仪器设备有限公司 一种手机柔性屏幕的激光切割方法
CN112529861A (zh) * 2020-12-04 2021-03-19 武汉锐科光纤激光技术股份有限公司 激光切割面条纹的检测方法
DE102021206302A1 (de) 2021-06-18 2022-12-22 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Laserbearbeitung und Laserbearbeitungsanlage sowie Steuereinrichtung hierfür
EP4119284A1 (de) 2021-07-12 2023-01-18 Bystronic Laser AG Kalibrierung eines qualitätsschätzers für ein laserschneidverfahren
DE102021125781A1 (de) 2021-10-05 2023-04-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserschneidverfahren und Laserschneidmaschine
CN113996931A (zh) * 2021-11-12 2022-02-01 中国航空制造技术研究院 一种激光焊接对接拼缝错边自动调整装置和方法
DE102022103745A1 (de) 2022-02-17 2023-08-17 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneidverfahren und Laserschneidmaschine
DE102022108013B3 (de) 2022-04-04 2023-09-14 Pulsar Photonics Gmbh Verfahren und System zum Ausbilden einer Struktur in einem Werkstück durch selektives Laserätzen
DE102023103704A1 (de) 2023-02-15 2024-08-22 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zum analysieren eines geräuschs, verfahren zum trainieren einer künstlichen intelligenz sowie verfahren zum ermitteln einer schnittabrissposition
CN118081120B (zh) * 2024-04-25 2024-08-02 江西兆驰半导体有限公司 一种激光划片机位移参数补偿系统及方法
CN118305472B (zh) * 2024-06-06 2024-08-06 深圳市牧激科技有限公司 一种五轴激光加工设备的切割控制方法及系统

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Also Published As

Publication number Publication date
EP3159093A1 (de) 2017-04-26
EP3412399A1 (de) 2018-12-12
EP3159093B1 (de) 2018-07-18
PL3412399T3 (pl) 2021-10-25
EP3412399B1 (de) 2021-04-28
US20170113300A1 (en) 2017-04-27
US20200254559A1 (en) 2020-08-13
US10675709B2 (en) 2020-06-09
US11224938B2 (en) 2022-01-18

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