PL2883648T3 - Urządzenie do cięcia laserem i zastosowanie sposobu cięcia - Google Patents

Urządzenie do cięcia laserem i zastosowanie sposobu cięcia

Info

Publication number
PL2883648T3
PL2883648T3 PL14806156T PL14806156T PL2883648T3 PL 2883648 T3 PL2883648 T3 PL 2883648T3 PL 14806156 T PL14806156 T PL 14806156T PL 14806156 T PL14806156 T PL 14806156T PL 2883648 T3 PL2883648 T3 PL 2883648T3
Authority
PL
Poland
Prior art keywords
method therefor
cutting
laser
laser cutting
cutting apparatus
Prior art date
Application number
PL14806156T
Other languages
English (en)
Inventor
Jin Ho BAN
Chang Bum Ahn
Ki Hong Min
Ji Won Park
Myung Hoon KO
Seung Ho Na
Original Assignee
Lg Chem, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chem, Ltd. filed Critical Lg Chem, Ltd.
Publication of PL2883648T3 publication Critical patent/PL2883648T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Battery Electrode And Active Subsutance (AREA)
PL14806156T 2013-09-25 2014-07-31 Urządzenie do cięcia laserem i zastosowanie sposobu cięcia PL2883648T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130114003A KR101682269B1 (ko) 2013-09-25 2013-09-25 레이저 커팅 장치 및 그 커팅 방법
EP14806156.7A EP2883648B1 (en) 2013-09-25 2014-07-31 Laser cutting apparatus and cutting method therefor
PCT/KR2014/007052 WO2015046738A1 (ko) 2013-09-25 2014-07-31 레이저 커팅 장치 및 그 커팅 방법

Publications (1)

Publication Number Publication Date
PL2883648T3 true PL2883648T3 (pl) 2020-03-31

Family

ID=52743824

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14806156T PL2883648T3 (pl) 2013-09-25 2014-07-31 Urządzenie do cięcia laserem i zastosowanie sposobu cięcia

Country Status (7)

Country Link
EP (1) EP2883648B1 (pl)
JP (1) JP6342480B2 (pl)
KR (1) KR101682269B1 (pl)
CN (1) CN104684678B (pl)
PL (1) PL2883648T3 (pl)
TW (1) TWI574768B (pl)
WO (1) WO2015046738A1 (pl)

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DE102015119938A1 (de) * 2015-11-18 2017-05-18 Messer Cutting Systems Gmbh Verfahren und Vorrichtung zum Erkennen eines drohenden oder erfolgten Schnittabrisses beim thermischen Trennen eines Werkstücks
CN105965155B (zh) * 2016-07-21 2018-01-02 成都福誉科技有限公司 一种均匀控制激光功率的方法及系统
KR102600471B1 (ko) 2016-11-16 2023-11-13 삼성디스플레이 주식회사 레이저 커팅 장치 및 그것을 이용한 레이저 커팅 방법
KR102730884B1 (ko) 2016-12-05 2024-11-19 삼성디스플레이 주식회사 편광판 절단 장치 및 편광판 절단 방법
CN107009024B (zh) * 2017-06-07 2019-05-31 重庆大学 一种激光剥离导爆索时激光切割的功率和速度控制方法
KR20200060569A (ko) 2018-11-21 2020-06-01 주식회사 동희산업 레이저 커팅장치
KR102890825B1 (ko) 2019-04-18 2025-11-27 삼성디스플레이 주식회사 편광필름 및 이를 포함하는 표시장치
CN110405363A (zh) * 2019-08-09 2019-11-05 佛山市镭科智能设备有限公司 一种异型材的加工方法
CN110977022B (zh) * 2019-12-05 2024-06-21 常州大学 废旧电路板高值元件扫描切割装置
CN115348825A (zh) * 2020-03-20 2022-11-15 日本烟草国际股份有限公司 防止在限制区域内未经授权使用气溶胶产生设备的方法及相关联系统
EP3984688A1 (de) * 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, computerprogramm und laserschneidsystem für intelligentes eckenschneiden
KR102904350B1 (ko) * 2021-04-22 2025-12-26 주식회사 엘지화학 전극 조립체 제조 방법 및 전극 조립체 제조 시스템
CN114112311B (zh) * 2021-11-17 2024-12-10 深圳市大族数控科技股份有限公司 激光加工设备的调试方法、装置及存储介质
CN120083018B (zh) * 2025-05-06 2025-09-05 杭州合鑫盛电子科技有限公司 一种用于激光切割转换控制的管理方法与系统

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US5281798A (en) * 1991-12-24 1994-01-25 Maxwell Laboratories, Inc. Method and system for selective removal of material coating from a substrate using a flashlamp
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JP6392514B2 (ja) * 2010-12-30 2018-09-19 スリーエム イノベイティブ プロパティズ カンパニー レーザー切断方法及びこれにより製造された物品
WO2012096053A1 (ja) * 2011-01-11 2012-07-19 旭硝子株式会社 強化ガラス板の切断方法
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JP6018744B2 (ja) * 2011-11-02 2016-11-02 日酸Ｔａｎａｋａ株式会社 レーザ切断方法及びレーザ切断装置
JP5964604B2 (ja) * 2012-02-09 2016-08-03 株式会社ディスコ レーザー加工装置
JP6034030B2 (ja) * 2012-03-09 2016-11-30 株式会社ディスコ レーザー加工方法およびレーザー加工装置

Also Published As

Publication number Publication date
EP2883648B1 (en) 2019-09-04
JP2016523713A (ja) 2016-08-12
TW201527023A (zh) 2015-07-16
EP2883648A1 (en) 2015-06-17
KR101682269B1 (ko) 2016-12-05
JP6342480B2 (ja) 2018-06-13
KR20150033994A (ko) 2015-04-02
CN104684678A (zh) 2015-06-03
CN104684678B (zh) 2017-09-19
TWI574768B (zh) 2017-03-21
EP2883648A4 (en) 2016-02-17
WO2015046738A1 (ko) 2015-04-02

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