MY194463A - Copper foil with carrier and copper-clad laminate - Google Patents

Copper foil with carrier and copper-clad laminate

Info

Publication number
MY194463A
MY194463A MYPI2020000548A MYPI2020000548A MY194463A MY 194463 A MY194463 A MY 194463A MY PI2020000548 A MYPI2020000548 A MY PI2020000548A MY PI2020000548 A MYPI2020000548 A MY PI2020000548A MY 194463 A MY194463 A MY 194463A
Authority
MY
Malaysia
Prior art keywords
carrier
copper
clad laminate
copper foil
ultra
Prior art date
Application number
MYPI2020000548A
Other languages
English (en)
Inventor
Yao-Sheng Lai
Ting-Chun Lai
Jui-Chang Chou
Original Assignee
Chang Chun Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW109101285A external-priority patent/TWI718843B/zh
Application filed by Chang Chun Petrochemical Co Ltd filed Critical Chang Chun Petrochemical Co Ltd
Publication of MY194463A publication Critical patent/MY194463A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
MYPI2020000548A 2019-02-01 2020-01-30 Copper foil with carrier and copper-clad laminate MY194463A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962800263P 2019-02-01 2019-02-01
TW109101285A TWI718843B (zh) 2019-02-01 2020-01-15 附載體銅箔及銅箔基板

Publications (1)

Publication Number Publication Date
MY194463A true MY194463A (en) 2022-11-30

Family

ID=72039149

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020000548A MY194463A (en) 2019-02-01 2020-01-30 Copper foil with carrier and copper-clad laminate

Country Status (3)

Country Link
JP (1) JP6882544B2 (ja)
KR (1) KR102331091B1 (ja)
MY (1) MY194463A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI781818B (zh) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
KR20070017547A (ko) * 2004-06-03 2007-02-12 미쓰이 긴조꾸 고교 가부시키가이샤 표면 처리 동박 및 그 표면 처리 동박을 이용하여 제조한플렉서블 동박 적층판 및 필름 캐리어 테이프
JP6415033B2 (ja) * 2012-09-11 2018-10-31 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法、及び、プリント配線板の製造方法
JP6403969B2 (ja) * 2013-03-29 2018-10-10 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
KR101909352B1 (ko) * 2013-07-24 2018-10-17 제이엑스금속주식회사 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) * 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
US10057984B1 (en) * 2017-02-02 2018-08-21 Chang Chun Petrochemical Co., Ltd. Composite thin copper foil and carrier
US10205170B1 (en) * 2017-12-04 2019-02-12 Chang Chun Petrochemical Co., Ltd. Copper foil for current collector of lithium secondary battery

Also Published As

Publication number Publication date
KR20200096428A (ko) 2020-08-12
KR102331091B1 (ko) 2021-11-25
JP6882544B2 (ja) 2021-06-02
JP2020125542A (ja) 2020-08-20

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