MY176516A - Copper foil provided with carrier, copper-clad laminate, and printed wiring board - Google Patents

Copper foil provided with carrier, copper-clad laminate, and printed wiring board

Info

Publication number
MY176516A
MY176516A MYPI2016701902A MYPI2016701902A MY176516A MY 176516 A MY176516 A MY 176516A MY PI2016701902 A MYPI2016701902 A MY PI2016701902A MY PI2016701902 A MYPI2016701902 A MY PI2016701902A MY 176516 A MY176516 A MY 176516A
Authority
MY
Malaysia
Prior art keywords
carrier
copper
copper foil
foil provided
carboxybenzotriazole
Prior art date
Application number
MYPI2016701902A
Inventor
Takanashi Akitoshi
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY176516A publication Critical patent/MY176516A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2386/00—Specific polymers obtained by polycondensation or polyaddition not provided for in a single one of index codes B32B2363/00 - B32B2383/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A copper foil provided with a carrier includes a carrier foil, a release layer, and an ultra-thin copper foil disposed in this order. The release layer contains 5-carboxybenzotriazole (5CBTA) and/or 4-carboxybenzotriazole (4CBTA) and the ratio of the amount of deposited 5-carboxybenzotriazole to the amount of deposited 4-carboxybenzotriazole i.e., 5CBTA/4CBTA ratio, in the release layer is 3.0 or more. The copper foil provided with a carrier can prevent an increase in release strength of a carrier foil after long-time high-temperature thermal history, and thus can stabilize the release strength.
MYPI2016701902A 2015-07-01 2016-05-25 Copper foil provided with carrier, copper-clad laminate, and printed wiring board MY176516A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015133105A JP5842077B1 (en) 2015-07-01 2015-07-01 Copper foil with carrier, copper-clad laminate and printed wiring board

Publications (1)

Publication Number Publication Date
MY176516A true MY176516A (en) 2020-08-12

Family

ID=55073285

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016701902A MY176516A (en) 2015-07-01 2016-05-25 Copper foil provided with carrier, copper-clad laminate, and printed wiring board

Country Status (7)

Country Link
JP (1) JP5842077B1 (en)
KR (2) KR20170004826A (en)
CN (1) CN106332458B (en)
LU (1) LU93050B1 (en)
MY (1) MY176516A (en)
PH (1) PH12016000167A1 (en)
TW (1) TWI583268B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5842077B1 (en) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 Copper foil with carrier, copper-clad laminate and printed wiring board
JP6471140B2 (en) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 Composite metal foil, copper-clad laminate using the composite metal foil, and method for producing the copper-clad laminate
JP6462940B1 (en) * 2018-03-23 2019-01-30 三井金属鉱業株式会社 Copper foil with carrier, copper-clad laminate and printed wiring board
KR102480377B1 (en) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392066B2 (en) * 1998-01-19 2003-03-31 三井金属鉱業株式会社 Composite copper foil, method for producing the same, copper-clad laminate and printed wiring board using the composite copper foil
US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
JP3612594B2 (en) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 Composite foil with resin, method for producing the same, multilayer copper-clad laminate using the composite foil, and method for producing multilayer printed wiring board
JP4073248B2 (en) * 2002-05-14 2008-04-09 三井金属鉱業株式会社 Method for producing electrolytic copper foil with carrier foil for high temperature and heat resistance and electrolytic copper foil with carrier foil for high temperature and heat obtained by the production method
JP3812834B2 (en) * 2002-08-12 2006-08-23 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing the same, and copper-clad laminate using the electrolytic copper foil with carrier foil
JP2009180796A (en) * 2008-01-29 2009-08-13 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element, and method for manufacturing printed wiring board
US20120168075A1 (en) * 2008-03-21 2012-07-05 Enthone Inc. Adhesion promotion of metal to laminate with multi-functional molecular system
JP5379528B2 (en) 2009-03-24 2013-12-25 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
EP2240005A1 (en) * 2009-04-09 2010-10-13 ATOTECH Deutschland GmbH A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
CN101892499B (en) * 2010-07-24 2011-11-09 江西理工大学 Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof
KR101811091B1 (en) * 2011-03-03 2017-12-20 닛코-매터리얼즈 가부시키가이샤 Photosensitive resin composition, photoresist film using same, resist pattern forming method, and conductor pattern forming method
JP5842077B1 (en) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 Copper foil with carrier, copper-clad laminate and printed wiring board

Also Published As

Publication number Publication date
KR20170004826A (en) 2017-01-11
KR102316978B1 (en) 2021-10-25
PH12016000167B1 (en) 2017-10-30
TW201622495A (en) 2016-06-16
JP5842077B1 (en) 2016-01-13
LU93050B1 (en) 2017-06-08
TWI583268B (en) 2017-05-11
JP2017013385A (en) 2017-01-19
KR20170004924A (en) 2017-01-11
PH12016000167A1 (en) 2017-10-30
CN106332458B (en) 2019-03-22
CN106332458A (en) 2017-01-11
LU93050A1 (en) 2017-01-25

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