MY193145A - Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same - Google Patents

Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Info

Publication number
MY193145A
MY193145A MYPI2019004109A MYPI2019004109A MY193145A MY 193145 A MY193145 A MY 193145A MY PI2019004109 A MYPI2019004109 A MY PI2019004109A MY PI2019004109 A MYPI2019004109 A MY PI2019004109A MY 193145 A MY193145 A MY 193145A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
adhesive sheet
producing
mentioned above
same
Prior art date
Application number
MYPI2019004109A
Other languages
English (en)
Inventor
Yasufumi Kondou
Takamasa Ichikawa
Shouji IWASAKI
Wenfeng Fu
Yuuki Matsunaga
Original Assignee
Tomoegawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Co Ltd filed Critical Tomoegawa Co Ltd
Publication of MY193145A publication Critical patent/MY193145A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
MYPI2019004109A 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same MY193145A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017017490A JP6956492B2 (ja) 2017-02-02 2017-02-02 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
PCT/JP2018/003406 WO2018143343A1 (ja) 2017-02-02 2018-02-01 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法

Publications (1)

Publication Number Publication Date
MY193145A true MY193145A (en) 2022-09-26

Family

ID=63040829

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004109A MY193145A (en) 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Country Status (7)

Country Link
JP (1) JP6956492B2 (ko)
KR (1) KR102424574B1 (ko)
CN (1) CN110214168A (ko)
MY (1) MY193145A (ko)
SG (1) SG11201906503UA (ko)
TW (1) TWI770112B (ko)
WO (1) WO2018143343A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6909171B2 (ja) * 2018-02-12 2021-07-28 株式会社巴川製紙所 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
JP7187906B2 (ja) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法
CN110982156B (zh) * 2019-12-24 2022-10-04 海隆石油产品技术服务（上海）有限公司 一种易粘结高填充聚烯烃板材及其制备方法和应用
CN116848635A (zh) * 2021-02-16 2023-10-03 株式会社巴川制纸所 半导体装置制造用粘接片及使用该半导体装置制造用粘接片的半导体装置的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779601B2 (ja) 2001-11-28 2006-05-31 株式会社巴川製紙所 半導体装置組立用マスクシート
JP2004182804A (ja) * 2002-12-02 2004-07-02 Mitsui Chemicals Inc 樹脂組成物及びそれよりなるフィルム状接着剤
JP4319892B2 (ja) 2003-11-07 2009-08-26 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP2008095014A (ja) 2006-10-13 2008-04-24 Tomoegawa Paper Co Ltd Ｑｆｎ用熱硬化型樹脂組成物および接着シート
CN105981138B (zh) * 2014-02-14 2018-12-28 三井化学东赛璐株式会社 半导体晶片表面保护用粘着膜、以及使用粘着膜的半导体晶片的保护方法和半导体装置的制造方法

Also Published As

Publication number Publication date
TWI770112B (zh) 2022-07-11
JP2018123254A (ja) 2018-08-09
WO2018143343A1 (ja) 2018-08-09
KR102424574B1 (ko) 2022-07-25
CN110214168A (zh) 2019-09-06
KR20190111911A (ko) 2019-10-02
JP6956492B2 (ja) 2021-11-02
TW201840770A (zh) 2018-11-16
SG11201906503UA (en) 2019-08-27

Similar Documents

Publication Publication Date Title
MY193145A (en) Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same
TW201129670A (en) Adhesive sheet and electronic part
TW201613760A (en) Composite sheet for resin film formation
SG11201902926YA (en) Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
PH12017501228B1 (en) Film, method for its production, and method for producing semiconductor element using the film
MX2017008266A (es) Composicion de resina de epoxi.
SG11201906510PA (en) Method and device for bonding chips
PH12015500899A1 (en) Coverplay film, flexible printed circuit board using same, and production method therefor
MY180537A (en) Wafer processing method using adhesive tape to pick up device chips
MY187016A (en) First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
MX2019003548A (es) Dispositivo para asegurar una unidad electronica a un neumatico y un neumatico que comprende una unidad electronica.
PH12016500005A1 (en) Dicing sheet
WO2017034644A3 (en) Method of providing an electronic device and electronic device thereof
MY168172A (en) Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device
PH12018502253A1 (en) Pressure-sensitive adhesive tape for semiconductor substrate fabrication
MY189136A (en) Tape for electronic device packaging
WO2017137796A8 (ja) 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム
WO2015156891A3 (en) Method of providing a flexible semiconductor device and flexible semiconductor device thereof
MY179367A (en) Adhesive film and semiconductor package using adhesive film
PH12018500851A1 (en) First protective film forming sheet
TW201612231A (en) Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same
MY162038A (en) Die bonding apparatus
WO2020117431A3 (en) Integrated circuit substrate for containing liquid adhesive bleed-out
PH12019500576A1 (en) Adhesive sheet for semiconductor processing
PH12019501058A1 (en) Adhesive sheet for semiconductor processing