MY192661A - Semiconductor processing tape - Google Patents

Semiconductor processing tape

Info

Publication number
MY192661A
MY192661A MYPI2017001239A MYPI2017001239A MY192661A MY 192661 A MY192661 A MY 192661A MY PI2017001239 A MYPI2017001239 A MY PI2017001239A MY PI2017001239 A MYPI2017001239 A MY PI2017001239A MY 192661 A MY192661 A MY 192661A
Authority
MY
Malaysia
Prior art keywords
tape
stress
removable adhesive
semiconductor processing
adhesive tape
Prior art date
Application number
MYPI2017001239A
Other languages
English (en)
Inventor
Masami Aoyama
Jirou Sugiyama
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY192661A publication Critical patent/MY192661A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
MYPI2017001239A 2015-03-24 2016-03-23 Semiconductor processing tape MY192661A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060797 2015-03-24
PCT/JP2016/059203 WO2016152919A1 (ja) 2015-03-24 2016-03-23 半導体加工用テープ

Publications (1)

Publication Number Publication Date
MY192661A true MY192661A (en) 2022-08-30

Family

ID=56978356

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017001239A MY192661A (en) 2015-03-24 2016-03-23 Semiconductor processing tape

Country Status (7)

Country Link
JP (1) JP6097893B2 (zh)
KR (1) KR101894690B1 (zh)
CN (1) CN107408501B (zh)
MY (1) MY192661A (zh)
SG (1) SG11201706197VA (zh)
TW (1) TWI697539B (zh)
WO (1) WO2016152919A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785162B2 (ja) * 2017-01-12 2020-11-18 株式会社ディスコ 分割装置
JP2020145392A (ja) * 2019-03-08 2020-09-10 日東電工株式会社 ダイシングテープ、及び接着フィルム付きダイシングテープ
JP7060547B2 (ja) * 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
KR20200143258A (ko) 2019-06-13 2020-12-23 닛토덴코 가부시키가이샤 다이싱 테이프 및 다이싱 다이 본드 필름
JP7381315B2 (ja) * 2019-12-03 2023-11-15 日東電工株式会社 ダイシングテープ付き接着フィルム
CN114364761B (zh) * 2020-07-30 2024-02-02 古河电气工业株式会社 半导体加工用胶带
CN117716472A (zh) * 2021-07-08 2024-03-15 麦克赛尔株式会社 粘着胶带

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1095960A (ja) * 1996-09-20 1998-04-14 Nichiban Co Ltd 粘着テープ及び救急絆創膏
JP2003041206A (ja) * 2001-07-30 2003-02-13 Hitachi Chem Co Ltd 接着シート、その使用方法及び半導体装置
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004059852A (ja) * 2002-07-31 2004-02-26 Dainippon Ink & Chem Inc 粘着シート
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP5393024B2 (ja) * 2007-12-14 2014-01-22 株式会社ニトムズ 延伸剥離テープ
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP2012054432A (ja) * 2010-09-01 2012-03-15 Nitto Denko Corp 半導体ウエハ保護用粘着シート
CN105143380B (zh) * 2013-03-28 2019-05-17 古河电气工业株式会社 粘合带及晶片加工用胶带
JP2015021082A (ja) * 2013-07-19 2015-02-02 日東電工株式会社 電子部品切断用熱剥離型粘着テープおよび電子部品の切断方法

Also Published As

Publication number Publication date
SG11201706197VA (en) 2017-08-30
CN107408501B (zh) 2018-08-24
JP6097893B2 (ja) 2017-03-15
TW201700671A (zh) 2017-01-01
WO2016152919A1 (ja) 2016-09-29
JPWO2016152919A1 (ja) 2017-04-27
KR101894690B1 (ko) 2018-09-04
TWI697539B (zh) 2020-07-01
CN107408501A (zh) 2017-11-28
KR20170117199A (ko) 2017-10-20

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