MY186454A - Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board - Google Patents

Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board

Info

Publication number
MY186454A
MY186454A MYPI2021000356A MYPI2021000356A MY186454A MY 186454 A MY186454 A MY 186454A MY PI2021000356 A MYPI2021000356 A MY PI2021000356A MY PI2021000356 A MYPI2021000356 A MY PI2021000356A MY 186454 A MY186454 A MY 186454A
Authority
MY
Malaysia
Prior art keywords
copper foil
roughened
copper
wiring board
printed wiring
Prior art date
Application number
MYPI2021000356A
Other languages
English (en)
Inventor
Misato Mizoguchi
Akitoshi Takanashi
Makoto Hosokawa
Shinya Hiraoka
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY186454A publication Critical patent/MY186454A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
MYPI2021000356A 2018-08-10 2019-07-25 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board MY186454A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018152072 2018-08-10
PCT/JP2019/029224 WO2020031721A1 (ja) 2018-08-10 2019-07-25 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
MY186454A true MY186454A (en) 2021-07-22

Family

ID=69414103

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021000356A MY186454A (en) 2018-08-10 2019-07-25 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board

Country Status (6)

Country Link
JP (1) JP6905157B2 (zh)
KR (1) KR102480377B1 (zh)
CN (1) CN112424399B (zh)
MY (1) MY186454A (zh)
TW (1) TWI719567B (zh)
WO (1) WO2020031721A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6582156B1 (ja) * 2018-02-23 2019-09-25 古河電気工業株式会社 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
WO2021157363A1 (ja) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR20220106200A (ko) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
JP7051988B1 (ja) 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
CN117321254A (zh) 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
JPWO2022244826A1 (zh) 2021-05-20 2022-11-24
WO2022244828A1 (ja) 2021-05-20 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN118019880A (zh) * 2021-09-30 2024-05-10 三井金属矿业株式会社 粗糙化处理铜箔及覆铜层叠板、以及印刷电路板的制造方法
WO2023189839A1 (ja) * 2022-03-31 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
CN107002265B (zh) * 2015-01-22 2019-04-26 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
JP5842077B1 (ja) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 キャリア付銅箔、銅張積層板及びプリント配線板
CN107614760B (zh) * 2015-07-03 2018-07-13 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
CN107923047B (zh) * 2015-07-29 2020-05-01 纳美仕有限公司 粗糙化处理铜箔、覆铜层叠板及印刷电路板
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
JP6462961B2 (ja) * 2016-12-14 2019-01-30 古河電気工業株式会社 表面処理銅箔および銅張積層板
WO2021157363A1 (ja) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
JPWO2020031721A1 (ja) 2021-04-30
CN112424399A (zh) 2021-02-26
CN112424399B (zh) 2023-07-25
TW202009329A (zh) 2020-03-01
JP6905157B2 (ja) 2021-07-21
KR102480377B1 (ko) 2022-12-23
WO2020031721A1 (ja) 2020-02-13
TWI719567B (zh) 2021-02-21
KR20210019518A (ko) 2021-02-22

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