MY184033A - Sputtering target for forming magnetic thin film - Google Patents

Sputtering target for forming magnetic thin film

Info

Publication number
MY184033A
MY184033A MYPI2017702985A MYPI2017702985A MY184033A MY 184033 A MY184033 A MY 184033A MY PI2017702985 A MYPI2017702985 A MY PI2017702985A MY PI2017702985 A MYPI2017702985 A MY PI2017702985A MY 184033 A MY184033 A MY 184033A
Authority
MY
Malaysia
Prior art keywords
sputtering target
forming magnetic
thin film
boron
magnetic thin
Prior art date
Application number
MYPI2017702985A
Other languages
English (en)
Inventor
Yuto MORISHITA
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY184033A publication Critical patent/MY184033A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
MYPI2017702985A 2015-02-19 2016-02-15 Sputtering target for forming magnetic thin film MY184033A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015031027 2015-02-19
PCT/JP2016/054300 WO2016133047A1 (ja) 2015-02-19 2016-02-15 磁性体薄膜形成用スパッタリングターゲット

Publications (1)

Publication Number Publication Date
MY184033A true MY184033A (en) 2021-03-17

Family

ID=56688870

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017702985A MY184033A (en) 2015-02-19 2016-02-15 Sputtering target for forming magnetic thin film

Country Status (5)

Country Link
JP (1) JP6445126B2 (zh)
CN (1) CN108026631B (zh)
MY (1) MY184033A (zh)
SG (1) SG11201706389UA (zh)
WO (1) WO2016133047A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6958819B2 (ja) 2016-11-01 2021-11-02 田中貴金属工業株式会社 磁気記録媒体用スパッタリングターゲット
JP7072664B2 (ja) * 2018-09-25 2022-05-20 Ｊｘ金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
CN110171972B (zh) * 2019-01-04 2021-10-22 南京汇聚新材料科技有限公司 一种低温烧结陶瓷材料

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158607A (ja) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd ＺｎＯ系焼結体およびその製法
US20060286414A1 (en) * 2005-06-15 2006-12-21 Heraeus, Inc. Enhanced oxide-containing sputter target alloy compositions
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット
CN105026589B (zh) * 2013-04-30 2017-07-18 吉坤日矿日石金属株式会社 烧结体、包含该烧结体的磁记录膜形成用溅射靶

Also Published As

Publication number Publication date
JPWO2016133047A1 (ja) 2017-11-09
WO2016133047A1 (ja) 2016-08-25
CN108026631A (zh) 2018-05-11
SG11201706389UA (en) 2017-09-28
JP6445126B2 (ja) 2018-12-26
CN108026631B (zh) 2020-02-28

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