MY181635A - Processes for suppressing minority carrier lifetime degradation in silicon wafers - Google Patents

Processes for suppressing minority carrier lifetime degradation in silicon wafers

Info

Publication number
MY181635A
MY181635A MYPI2013004357A MYPI2013004357A MY181635A MY 181635 A MY181635 A MY 181635A MY PI2013004357 A MYPI2013004357 A MY PI2013004357A MY PI2013004357 A MYPI2013004357 A MY PI2013004357A MY 181635 A MY181635 A MY 181635A
Authority
MY
Malaysia
Prior art keywords
processes
silicon wafers
minority carrier
carrier lifetime
lifetime degradation
Prior art date
Application number
MYPI2013004357A
Other languages
English (en)
Inventor
Robert J Falster
Vladimir V Voronkov
Original Assignee
Memc Singapore Pte Ltd
Corner Star Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Singapore Pte Ltd, Corner Star Ltd filed Critical Memc Singapore Pte Ltd
Publication of MY181635A publication Critical patent/MY181635A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/128Annealing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Photovoltaic Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
MYPI2013004357A 2011-06-03 2012-06-01 Processes for suppressing minority carrier lifetime degradation in silicon wafers MY181635A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161493119P 2011-06-03 2011-06-03
US13/486,463 US8969119B2 (en) 2011-06-03 2012-06-01 Processes for suppressing minority carrier lifetime degradation in silicon wafers

Publications (1)

Publication Number Publication Date
MY181635A true MY181635A (en) 2020-12-30

Family

ID=46229958

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013004357A MY181635A (en) 2011-06-03 2012-06-01 Processes for suppressing minority carrier lifetime degradation in silicon wafers

Country Status (8)

Country Link
US (2) US8969119B2 (enExample)
EP (1) EP2715805B1 (enExample)
JP (1) JP6113152B2 (enExample)
KR (1) KR20140041614A (enExample)
CN (1) CN103582955B (enExample)
MY (1) MY181635A (enExample)
SG (1) SG194904A1 (enExample)
WO (1) WO2012167104A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9634098B2 (en) 2013-06-11 2017-04-25 SunEdison Semiconductor Ltd. (UEN201334164H) Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the Czochralski method
CN105340085B (zh) * 2013-06-26 2018-07-06 康斯坦茨大学 用于生产具有稳定效率的光伏元件的方法和设备
CN103681964A (zh) * 2013-11-29 2014-03-26 奥特斯维能源(太仓)有限公司 太阳能电池片效率衰减后恢复方法
WO2015186288A1 (ja) * 2014-06-02 2015-12-10 株式会社Sumco シリコンウェーハおよびその製造方法
KR101569415B1 (ko) * 2014-06-09 2015-11-16 엘지전자 주식회사 태양 전지의 제조 방법
JP5830147B1 (ja) * 2014-09-04 2015-12-09 信越化学工業株式会社 太陽電池及び太陽電池の製造方法
KR20180058750A (ko) * 2015-09-23 2018-06-01 센트로테에름 인터내셔널 아게 반도체 기판들 내의 결함들을 패시베이팅하기 위한 방법들 및 장치
EP3208366A1 (en) * 2016-02-16 2017-08-23 Siltronic AG Fz silicon and method to prepare fz silicon
CN107369616B (zh) * 2017-07-07 2021-03-12 苏州阿特斯阳光电力科技有限公司 用于处理半导体基板的方法、得到的半导体基板及其用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197717A (ja) * 1982-05-13 1983-11-17 Toshiba Corp 半導体装置の製造方法
WO2001086732A1 (en) * 2000-05-05 2001-11-15 Unisearch Ltd. Low area metal contacts for photovoltaic devices
JP4607304B2 (ja) * 2000-09-26 2011-01-05 信越半導体株式会社 太陽電池用シリコン単結晶及び太陽電池用シリコン単結晶ウエーハ並びにその製造方法
US7084048B2 (en) * 2004-05-07 2006-08-01 Memc Electronic Materials, Inc. Process for metallic contamination reduction in silicon wafers
DE102006012920B3 (de) 2006-03-21 2008-01-24 Universität Konstanz Verfahren zum Herstellen eines Photovoltaikelements mit stabilisiertem Wirkungsgrad
CN100536177C (zh) * 2008-01-29 2009-09-02 江阴浚鑫科技有限公司 晶体硅太阳能电池的热处理方法
FR2929755B1 (fr) * 2008-04-03 2011-04-22 Commissariat Energie Atomique Procede de traitement d'un substrat semi-conducteur par activation thermique d'elements legers
US7943514B2 (en) * 2009-09-03 2011-05-17 Texas Instruments Incorporated Integrated circuits having TSVs including metal gettering dielectric liners
US20120222741A1 (en) * 2009-09-18 2012-09-06 L'air Liquide, Societe Anonyme Pour I'etude Et I'exploitation Des Procedes Georges Claude Solar cell with improved performance
US9105786B2 (en) * 2011-04-18 2015-08-11 Cisco Technology, Inc. Thermal treatment of silicon wafers useful for photovoltaic applications

Also Published As

Publication number Publication date
EP2715805A1 (en) 2014-04-09
WO2012167104A1 (en) 2012-12-06
SG194904A1 (en) 2013-12-30
WO2012167104A4 (en) 2013-02-28
JP6113152B2 (ja) 2017-04-12
CN103582955A (zh) 2014-02-12
JP2014526135A (ja) 2014-10-02
US20150123248A1 (en) 2015-05-07
US20130102129A1 (en) 2013-04-25
EP2715805B1 (en) 2016-04-06
US8969119B2 (en) 2015-03-03
KR20140041614A (ko) 2014-04-04
CN103582955B (zh) 2016-06-29
US9142616B2 (en) 2015-09-22

Similar Documents

Publication Publication Date Title
MY181635A (en) Processes for suppressing minority carrier lifetime degradation in silicon wafers
IN2014CN03143A (enExample)
TN2015000140A1 (en) Modulation of androgen receptor expression
EP2742526A4 (en) TRENCH BEARER
GB201506267D0 (en) Advanced handler wafer debonding method
SG10201506529YA (en) Lipseals and contact elements for semiconductor electroplating apparatuses
SG2013056395A (en) Semiconductor wafer composed of monocrystalline silicon and method for producing it
SG10201406101PA (en) Enhanced wafer carrier
SG11201405381WA (en) Abrasive composition and method for producing semiconductor substrate
GB2495949B (en) Silicon carbide epitaxy
MX2013008212A (es) Derivados de 7-azaindol.
SG11201407916RA (en) Polishing solution composition for wafers
EP2530706A4 (en) METHOD FOR OBTAINING SEMICONDUCTOR WAFERS AND CLEANING COMPOSITION THEREFOR
SG10201605995SA (en) Polishing Composition And Method For Producing Semiconductor Substrate
ZA201305821B (en) Method for producing the pentanary compound semiconductor cztsee,and thin-film solar cell
GB201408505D0 (en) Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure
SG10201501344YA (en) Semiconductor device and method of formingreconstituted wafer with larger carrier to achieve more ewlbpackages per wafer with encapsulant deposited under temperatureand pressure
GB201408506D0 (en) Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
SG2013086384A (en) Dual-loop control for laser annealing of semiconductor wafers
SG10201704400YA (en) Doping media for the local doping of silicon wafers
SG11201400775PA (en) Composition and method for polishing aluminum semiconductor substrates
ZA201308982B (en) Cooling of semiconductor devices
IN2014CN02962A (enExample)
EP2612958A4 (en) METHOD FOR PRODUCING A SILICON CARBIDE INK CRYSTAL, SILICON CARBIDE INK CRYSTAL AND SILICON CARBIDE MONTERRY SUBSTRATE
EP2708497A4 (en) NEW COMPOUND SEMICONDUCTOR AND USE THEREOF