CN103582955B - 抑制硅晶片中少数载流子寿命下降的方法 - Google Patents
抑制硅晶片中少数载流子寿命下降的方法 Download PDFInfo
- Publication number
- CN103582955B CN103582955B CN201280027376.0A CN201280027376A CN103582955B CN 103582955 B CN103582955 B CN 103582955B CN 201280027376 A CN201280027376 A CN 201280027376A CN 103582955 B CN103582955 B CN 103582955B
- Authority
- CN
- China
- Prior art keywords
- sec
- less
- silicon wafer
- wafer
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/128—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Photovoltaic Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161493119P | 2011-06-03 | 2011-06-03 | |
| US61/493,119 | 2011-06-03 | ||
| PCT/US2012/040492 WO2012167104A1 (en) | 2011-06-03 | 2012-06-01 | Processes for suppressing minority carrier lifetime degradation in silicon wafers |
| US13/486,463 US8969119B2 (en) | 2011-06-03 | 2012-06-01 | Processes for suppressing minority carrier lifetime degradation in silicon wafers |
| US13/486,463 | 2012-06-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103582955A CN103582955A (zh) | 2014-02-12 |
| CN103582955B true CN103582955B (zh) | 2016-06-29 |
Family
ID=46229958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280027376.0A Expired - Fee Related CN103582955B (zh) | 2011-06-03 | 2012-06-01 | 抑制硅晶片中少数载流子寿命下降的方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8969119B2 (enExample) |
| EP (1) | EP2715805B1 (enExample) |
| JP (1) | JP6113152B2 (enExample) |
| KR (1) | KR20140041614A (enExample) |
| CN (1) | CN103582955B (enExample) |
| MY (1) | MY181635A (enExample) |
| SG (1) | SG194904A1 (enExample) |
| WO (1) | WO2012167104A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9634098B2 (en) | 2013-06-11 | 2017-04-25 | SunEdison Semiconductor Ltd. (UEN201334164H) | Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the Czochralski method |
| ES2830766T3 (es) * | 2013-06-26 | 2021-06-04 | Univ Konstanz | Procedimiento y dispositivo para producir un elemento fotovoltaico con eficiencia estabilizada |
| CN103681964A (zh) * | 2013-11-29 | 2014-03-26 | 奥特斯维能源(太仓)有限公司 | 太阳能电池片效率衰减后恢复方法 |
| KR101895817B1 (ko) * | 2014-06-02 | 2018-09-07 | 가부시키가이샤 사무코 | 실리콘 웨이퍼 및 그 제조 방법 |
| KR101569415B1 (ko) * | 2014-06-09 | 2015-11-16 | 엘지전자 주식회사 | 태양 전지의 제조 방법 |
| JP5830147B1 (ja) * | 2014-09-04 | 2015-12-09 | 信越化学工業株式会社 | 太陽電池及び太陽電池の製造方法 |
| WO2017050772A1 (de) * | 2015-09-23 | 2017-03-30 | Centrotherm Photovoltaics Ag | Verfahren und vorrichtung zum passivieren von defekten in halbleitersubstraten |
| EP3208366A1 (en) * | 2016-02-16 | 2017-08-23 | Siltronic AG | Fz silicon and method to prepare fz silicon |
| CN107369616B (zh) * | 2017-07-07 | 2021-03-12 | 苏州阿特斯阳光电力科技有限公司 | 用于处理半导体基板的方法、得到的半导体基板及其用途 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197717A (ja) * | 1982-05-13 | 1983-11-17 | Toshiba Corp | 半導体装置の製造方法 |
| JP2003533053A (ja) * | 2000-05-05 | 2003-11-05 | ユニサーチ リミテツド | 光起電力素子のための低領域金属接点 |
| JP4607304B2 (ja) * | 2000-09-26 | 2011-01-05 | 信越半導体株式会社 | 太陽電池用シリコン単結晶及び太陽電池用シリコン単結晶ウエーハ並びにその製造方法 |
| US7084048B2 (en) * | 2004-05-07 | 2006-08-01 | Memc Electronic Materials, Inc. | Process for metallic contamination reduction in silicon wafers |
| DE102006012920B3 (de) * | 2006-03-21 | 2008-01-24 | Universität Konstanz | Verfahren zum Herstellen eines Photovoltaikelements mit stabilisiertem Wirkungsgrad |
| CN100536177C (zh) * | 2008-01-29 | 2009-09-02 | 江阴浚鑫科技有限公司 | 晶体硅太阳能电池的热处理方法 |
| FR2929755B1 (fr) * | 2008-04-03 | 2011-04-22 | Commissariat Energie Atomique | Procede de traitement d'un substrat semi-conducteur par activation thermique d'elements legers |
| US7943514B2 (en) * | 2009-09-03 | 2011-05-17 | Texas Instruments Incorporated | Integrated circuits having TSVs including metal gettering dielectric liners |
| EP2478571A4 (en) * | 2009-09-18 | 2014-03-19 | Air Liquide | SOLAR CELL WITH IMPROVED PERFORMANCE |
| US9105786B2 (en) * | 2011-04-18 | 2015-08-11 | Cisco Technology, Inc. | Thermal treatment of silicon wafers useful for photovoltaic applications |
-
2012
- 2012-06-01 EP EP12726561.9A patent/EP2715805B1/en not_active Not-in-force
- 2012-06-01 MY MYPI2013004357A patent/MY181635A/en unknown
- 2012-06-01 WO PCT/US2012/040492 patent/WO2012167104A1/en not_active Ceased
- 2012-06-01 KR KR20137035025A patent/KR20140041614A/ko not_active Ceased
- 2012-06-01 JP JP2014513752A patent/JP6113152B2/ja not_active Expired - Fee Related
- 2012-06-01 CN CN201280027376.0A patent/CN103582955B/zh not_active Expired - Fee Related
- 2012-06-01 SG SG2013083514A patent/SG194904A1/en unknown
- 2012-06-01 US US13/486,463 patent/US8969119B2/en not_active Expired - Fee Related
-
2015
- 2015-01-14 US US14/596,269 patent/US9142616B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014526135A (ja) | 2014-10-02 |
| MY181635A (en) | 2020-12-30 |
| US20130102129A1 (en) | 2013-04-25 |
| US8969119B2 (en) | 2015-03-03 |
| WO2012167104A4 (en) | 2013-02-28 |
| SG194904A1 (en) | 2013-12-30 |
| US9142616B2 (en) | 2015-09-22 |
| JP6113152B2 (ja) | 2017-04-12 |
| KR20140041614A (ko) | 2014-04-04 |
| EP2715805B1 (en) | 2016-04-06 |
| CN103582955A (zh) | 2014-02-12 |
| US20150123248A1 (en) | 2015-05-07 |
| WO2012167104A1 (en) | 2012-12-06 |
| EP2715805A1 (en) | 2014-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Singapore Singapore Patentee after: Edison Solar Products Singapore Private Ltd. Address before: Singapore Singapore Patentee before: MEMC Singapore Pte. Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 17th Floor, Global Trade Plaza, 1 West Austin Road, Kowloon, China Patentee after: SUNEDISON, Inc. Address before: Singapore Singapore Patentee before: Edison Solar Products Singapore Private Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160629 Termination date: 20190601 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |