CN103582955B - 抑制硅晶片中少数载流子寿命下降的方法 - Google Patents

抑制硅晶片中少数载流子寿命下降的方法 Download PDF

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Publication number
CN103582955B
CN103582955B CN201280027376.0A CN201280027376A CN103582955B CN 103582955 B CN103582955 B CN 103582955B CN 201280027376 A CN201280027376 A CN 201280027376A CN 103582955 B CN103582955 B CN 103582955B
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China
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silicon wafer
wafer
temperature
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Expired - Fee Related
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CN201280027376.0A
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English (en)
Chinese (zh)
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CN103582955A (zh
Inventor
R·J·法尔斯特
V·V·沃龙科夫
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Edison Solar Products Singapore Private Ltd
SunEdison Inc
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SunEdison Products Singapore Pte Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/128Annealing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Photovoltaic Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201280027376.0A 2011-06-03 2012-06-01 抑制硅晶片中少数载流子寿命下降的方法 Expired - Fee Related CN103582955B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161493119P 2011-06-03 2011-06-03
US61/493,119 2011-06-03
PCT/US2012/040492 WO2012167104A1 (en) 2011-06-03 2012-06-01 Processes for suppressing minority carrier lifetime degradation in silicon wafers
US13/486,463 US8969119B2 (en) 2011-06-03 2012-06-01 Processes for suppressing minority carrier lifetime degradation in silicon wafers
US13/486,463 2012-06-01

Publications (2)

Publication Number Publication Date
CN103582955A CN103582955A (zh) 2014-02-12
CN103582955B true CN103582955B (zh) 2016-06-29

Family

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CN201280027376.0A Expired - Fee Related CN103582955B (zh) 2011-06-03 2012-06-01 抑制硅晶片中少数载流子寿命下降的方法

Country Status (8)

Country Link
US (2) US8969119B2 (enExample)
EP (1) EP2715805B1 (enExample)
JP (1) JP6113152B2 (enExample)
KR (1) KR20140041614A (enExample)
CN (1) CN103582955B (enExample)
MY (1) MY181635A (enExample)
SG (1) SG194904A1 (enExample)
WO (1) WO2012167104A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9634098B2 (en) 2013-06-11 2017-04-25 SunEdison Semiconductor Ltd. (UEN201334164H) Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the Czochralski method
ES2830766T3 (es) * 2013-06-26 2021-06-04 Univ Konstanz Procedimiento y dispositivo para producir un elemento fotovoltaico con eficiencia estabilizada
CN103681964A (zh) * 2013-11-29 2014-03-26 奥特斯维能源(太仓)有限公司 太阳能电池片效率衰减后恢复方法
KR101895817B1 (ko) * 2014-06-02 2018-09-07 가부시키가이샤 사무코 실리콘 웨이퍼 및 그 제조 방법
KR101569415B1 (ko) * 2014-06-09 2015-11-16 엘지전자 주식회사 태양 전지의 제조 방법
JP5830147B1 (ja) * 2014-09-04 2015-12-09 信越化学工業株式会社 太陽電池及び太陽電池の製造方法
WO2017050772A1 (de) * 2015-09-23 2017-03-30 Centrotherm Photovoltaics Ag Verfahren und vorrichtung zum passivieren von defekten in halbleitersubstraten
EP3208366A1 (en) * 2016-02-16 2017-08-23 Siltronic AG Fz silicon and method to prepare fz silicon
CN107369616B (zh) * 2017-07-07 2021-03-12 苏州阿特斯阳光电力科技有限公司 用于处理半导体基板的方法、得到的半导体基板及其用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197717A (ja) * 1982-05-13 1983-11-17 Toshiba Corp 半導体装置の製造方法
JP2003533053A (ja) * 2000-05-05 2003-11-05 ユニサーチ リミテツド 光起電力素子のための低領域金属接点
JP4607304B2 (ja) * 2000-09-26 2011-01-05 信越半導体株式会社 太陽電池用シリコン単結晶及び太陽電池用シリコン単結晶ウエーハ並びにその製造方法
US7084048B2 (en) * 2004-05-07 2006-08-01 Memc Electronic Materials, Inc. Process for metallic contamination reduction in silicon wafers
DE102006012920B3 (de) * 2006-03-21 2008-01-24 Universität Konstanz Verfahren zum Herstellen eines Photovoltaikelements mit stabilisiertem Wirkungsgrad
CN100536177C (zh) * 2008-01-29 2009-09-02 江阴浚鑫科技有限公司 晶体硅太阳能电池的热处理方法
FR2929755B1 (fr) * 2008-04-03 2011-04-22 Commissariat Energie Atomique Procede de traitement d'un substrat semi-conducteur par activation thermique d'elements legers
US7943514B2 (en) * 2009-09-03 2011-05-17 Texas Instruments Incorporated Integrated circuits having TSVs including metal gettering dielectric liners
EP2478571A4 (en) * 2009-09-18 2014-03-19 Air Liquide SOLAR CELL WITH IMPROVED PERFORMANCE
US9105786B2 (en) * 2011-04-18 2015-08-11 Cisco Technology, Inc. Thermal treatment of silicon wafers useful for photovoltaic applications

Also Published As

Publication number Publication date
JP2014526135A (ja) 2014-10-02
MY181635A (en) 2020-12-30
US20130102129A1 (en) 2013-04-25
US8969119B2 (en) 2015-03-03
WO2012167104A4 (en) 2013-02-28
SG194904A1 (en) 2013-12-30
US9142616B2 (en) 2015-09-22
JP6113152B2 (ja) 2017-04-12
KR20140041614A (ko) 2014-04-04
EP2715805B1 (en) 2016-04-06
CN103582955A (zh) 2014-02-12
US20150123248A1 (en) 2015-05-07
WO2012167104A1 (en) 2012-12-06
EP2715805A1 (en) 2014-04-09

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Address after: Singapore Singapore

Patentee after: Edison Solar Products Singapore Private Ltd.

Address before: Singapore Singapore

Patentee before: MEMC Singapore Pte. Ltd.

CP01 Change in the name or title of a patent holder
CP03 Change of name, title or address

Address after: 17th Floor, Global Trade Plaza, 1 West Austin Road, Kowloon, China

Patentee after: SUNEDISON, Inc.

Address before: Singapore Singapore

Patentee before: Edison Solar Products Singapore Private Ltd.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160629

Termination date: 20190601

CF01 Termination of patent right due to non-payment of annual fee