MY177080A - Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet - Google Patents

Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet

Info

Publication number
MY177080A
MY177080A MYPI20060825A MYPI20060825A MY177080A MY 177080 A MY177080 A MY 177080A MY PI20060825 A MYPI20060825 A MY PI20060825A MY PI20060825 A MYPI20060825 A MY PI20060825A MY 177080 A MY177080 A MY 177080A
Authority
MY
Malaysia
Prior art keywords
electronic component
pallet
delivery
cutting portions
pair
Prior art date
Application number
MYPI20060825A
Other languages
English (en)
Inventor
Sato Masayuki
Kawada Yasuo
Original Assignee
Sii Crystal Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sii Crystal Technology Inc filed Critical Sii Crystal Technology Inc
Publication of MY177080A publication Critical patent/MY177080A/en

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
MYPI20060825A 2005-02-28 2006-02-27 Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet MY177080A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005054173A JP4422047B2 (ja) 2005-02-28 2005-02-28 電子部品の搬送用パレット及びこれを用いた電子部品の製造方法

Publications (1)

Publication Number Publication Date
MY177080A true MY177080A (en) 2020-09-04

Family

ID=37030798

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20060825A MY177080A (en) 2005-02-28 2006-02-27 Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet

Country Status (4)

Country Link
JP (1) JP4422047B2 (ja)
CN (1) CN1841926B (ja)
MY (1) MY177080A (ja)
TW (1) TWI360945B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4920526B2 (ja) * 2007-08-22 2012-04-18 セイコーインスツル株式会社 パレット、及び圧電振動子の製造方法
JP4921284B2 (ja) * 2007-08-22 2012-04-25 セイコーインスツル株式会社 パレット、及び圧電振動子の製造方法
JP7539749B1 (ja) 2024-04-24 2024-08-26 有限会社旭電機製作所 電子部品実装装置及び方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3441615B2 (ja) * 1997-04-07 2003-09-02 信越ポリマー株式会社 ウエーハ接触防止装置
KR200225469Y1 (ko) * 2000-12-28 2001-06-01 주식회사젯텍 반도체 리드프레임 스트립의 이송용 벨트
MY134884A (en) * 2001-08-17 2007-12-31 Aem Tech Engineers Pte Ltd Belt apparatus for carrying elements during treatment
JP2004155443A (ja) * 2002-11-05 2004-06-03 Shinon Denki Sangyo Kk 半導体集積回路用トレー
CN1501466A (zh) * 2002-11-14 2004-06-02 矽品精密工业股份有限公司 球栅阵列半导体封装件用的承载装置

Also Published As

Publication number Publication date
TWI360945B (en) 2012-03-21
JP2006240620A (ja) 2006-09-14
TW200703895A (en) 2007-01-16
CN1841926A (zh) 2006-10-04
JP4422047B2 (ja) 2010-02-24
CN1841926B (zh) 2010-09-29

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