MY177080A - Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet - Google Patents

Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet

Info

Publication number
MY177080A
MY177080A MYPI20060825A MYPI20060825A MY177080A MY 177080 A MY177080 A MY 177080A MY PI20060825 A MYPI20060825 A MY PI20060825A MY PI20060825 A MYPI20060825 A MY PI20060825A MY 177080 A MY177080 A MY 177080A
Authority
MY
Malaysia
Prior art keywords
electronic component
pallet
delivery
cutting portions
pair
Prior art date
Application number
MYPI20060825A
Inventor
Sato Masayuki
Kawada Yasuo
Original Assignee
Sii Crystal Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sii Crystal Technology Inc filed Critical Sii Crystal Technology Inc
Publication of MY177080A publication Critical patent/MY177080A/en

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

To provide a pallet (10) for delivery of an electronic component corresponding to the high-accuracy alignment, heating, and vacuum. In the pallet (10) for delivery for alignment of an electronic component having a plurality of lead terminals in one direction upon delivery, the pallet (10) for delivery is formed in the shape of a rectangular thin plate having a plurality of cutting portions (11) at one side of long sides; at least two cutting portions (11) are made into a pair; the width (A) of the cutting portion (11) is approximately the same as the diameter (B) of the lead terminal (3) of the electronic component; and the interval (C) of the pair of the cutting portions (11) is larger than the width of the electronic component.
MYPI20060825A 2005-02-28 2006-02-27 Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet MY177080A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005054173A JP4422047B2 (en) 2005-02-28 2005-02-28 Pallet for transporting electronic parts and method of manufacturing electronic parts using the same

Publications (1)

Publication Number Publication Date
MY177080A true MY177080A (en) 2020-09-04

Family

ID=37030798

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20060825A MY177080A (en) 2005-02-28 2006-02-27 Pallet for delivery of electronic component and method for manufacturing electronic component using this pallet

Country Status (4)

Country Link
JP (1) JP4422047B2 (en)
CN (1) CN1841926B (en)
MY (1) MY177080A (en)
TW (1) TWI360945B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4920526B2 (en) * 2007-08-22 2012-04-18 セイコーインスツル株式会社 Pallet and method for manufacturing piezoelectric vibrator
JP4921284B2 (en) * 2007-08-22 2012-04-25 セイコーインスツル株式会社 Pallet and method for manufacturing piezoelectric vibrator
JP7539749B1 (en) 2024-04-24 2024-08-26 有限会社旭電機製作所 Electronic component mounting device and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3441615B2 (en) * 1997-04-07 2003-09-02 信越ポリマー株式会社 Wafer contact prevention device
KR200225469Y1 (en) * 2000-12-28 2001-06-01 주식회사젯텍 Feeding Belt For Semi-Conductor Lead Frame Strip
MY134884A (en) * 2001-08-17 2007-12-31 Aem Tech Engineers Pte Ltd Belt apparatus for carrying elements during treatment
JP2004155443A (en) * 2002-11-05 2004-06-03 Shinon Denki Sangyo Kk Tray for semiconductor integrated circuit
CN1501466A (en) * 2002-11-14 2004-06-02 矽品精密工业股份有限公司 Bearing apparatus for ball grid array semiconductor packaging piece

Also Published As

Publication number Publication date
TWI360945B (en) 2012-03-21
JP2006240620A (en) 2006-09-14
TW200703895A (en) 2007-01-16
CN1841926A (en) 2006-10-04
JP4422047B2 (en) 2010-02-24
CN1841926B (en) 2010-09-29

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