MY175952A - Method for manufacturing glass substrate for information recording medium, method for manufacturing information recording medium, and polishing pad - Google Patents
Method for manufacturing glass substrate for information recording medium, method for manufacturing information recording medium, and polishing padInfo
- Publication number
- MY175952A MY175952A MYPI2015700624A MYPI2015700624A MY175952A MY 175952 A MY175952 A MY 175952A MY PI2015700624 A MYPI2015700624 A MY PI2015700624A MY PI2015700624 A MYPI2015700624 A MY PI2015700624A MY 175952 A MY175952 A MY 175952A
- Authority
- MY
- Malaysia
- Prior art keywords
- recording medium
- information recording
- manufacturing
- glass substrate
- polishing pad
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012206985 | 2012-09-20 | ||
PCT/JP2013/066705 WO2014045653A1 (ja) | 2012-09-20 | 2013-06-18 | 情報記録媒体用ガラス基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY175952A true MY175952A (en) | 2020-07-16 |
Family
ID=50340984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015700624A MY175952A (en) | 2012-09-20 | 2013-06-18 | Method for manufacturing glass substrate for information recording medium, method for manufacturing information recording medium, and polishing pad |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6328052B2 (zh) |
CN (1) | CN104603877B (zh) |
MY (1) | MY175952A (zh) |
SG (2) | SG11201501490WA (zh) |
WO (1) | WO2014045653A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11745303B2 (en) | 2016-07-12 | 2023-09-05 | Noritake Co., Limited | Polishing body and manufacturing method therefor |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002092867A (ja) * | 2000-09-21 | 2002-03-29 | Hoya Corp | 情報記録媒体用ガラス基板の製造方法及び情報記録媒体の製造方法 |
US6802955B2 (en) * | 2002-01-11 | 2004-10-12 | Speedfam-Ipec Corporation | Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
JP4448766B2 (ja) * | 2004-12-08 | 2010-04-14 | 信越化学工業株式会社 | 研磨方法 |
JP5242903B2 (ja) * | 2006-09-29 | 2013-07-24 | 帝人コードレ株式会社 | 研磨布の製造方法 |
TWI432285B (zh) * | 2007-02-01 | 2014-04-01 | Kuraray Co | 研磨墊及研磨墊之製法 |
KR20100028294A (ko) * | 2008-09-04 | 2010-03-12 | 주식회사 코오롱 | 연마패드 및 그의 제조방법 |
JP5421635B2 (ja) * | 2009-03-30 | 2014-02-19 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP5184448B2 (ja) * | 2009-06-23 | 2013-04-17 | 富士紡ホールディングス株式会社 | 研磨パッド、その製造方法および研磨加工方法 |
JP2011025343A (ja) * | 2009-07-24 | 2011-02-10 | Toray Ind Inc | 研磨パッドの製造方法 |
JP2010042508A (ja) * | 2009-11-25 | 2010-02-25 | Shin-Etsu Chemical Co Ltd | 研磨方法 |
JP5598371B2 (ja) * | 2011-02-21 | 2014-10-01 | 旭硝子株式会社 | ガラス基板の研磨方法 |
-
2013
- 2013-06-18 JP JP2014536623A patent/JP6328052B2/ja active Active
- 2013-06-18 CN CN201380045143.8A patent/CN104603877B/zh active Active
- 2013-06-18 WO PCT/JP2013/066705 patent/WO2014045653A1/ja active Application Filing
- 2013-06-18 MY MYPI2015700624A patent/MY175952A/en unknown
- 2013-06-18 SG SG11201501490WA patent/SG11201501490WA/en unknown
- 2013-06-18 SG SG10201705207SA patent/SG10201705207SA/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN104603877B (zh) | 2018-06-26 |
JP6328052B2 (ja) | 2018-05-23 |
WO2014045653A1 (ja) | 2014-03-27 |
JPWO2014045653A1 (ja) | 2016-08-18 |
SG10201705207SA (en) | 2017-07-28 |
CN104603877A (zh) | 2015-05-06 |
SG11201501490WA (en) | 2015-04-29 |
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