MY163071A - Electronic material polishing liquid - Google Patents
Electronic material polishing liquidInfo
- Publication number
- MY163071A MY163071A MYPI2013004663A MYPI2013004663A MY163071A MY 163071 A MY163071 A MY 163071A MY PI2013004663 A MYPI2013004663 A MY PI2013004663A MY PI2013004663 A MYPI2013004663 A MY PI2013004663A MY 163071 A MY163071 A MY 163071A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- electronic material
- polishing liquid
- electronic
- manufacturing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 16
- 239000012776 electronic material Substances 0.000 title abstract 12
- 239000007788 liquid Substances 0.000 title abstract 7
- 150000003839 salts Chemical class 0.000 abstract 5
- 238000004519 manufacturing process Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 230000002378 acidificating effect Effects 0.000 abstract 2
- 150000007514 bases Chemical class 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000007517 polishing process Methods 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000010494 dissociation reaction Methods 0.000 abstract 1
- 208000018459 dissociative disease Diseases 0.000 abstract 1
- 230000005588 protonation Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011144241 | 2011-06-29 | ||
| JP2011146481 | 2011-06-30 | ||
| JP2011146486 | 2011-06-30 | ||
| JP2011149228 | 2011-07-05 | ||
| JP2011149229 | 2011-07-05 | ||
| JP2011149227 | 2011-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY163071A true MY163071A (en) | 2017-08-15 |
Family
ID=47424171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013004663A MY163071A (en) | 2011-06-29 | 2012-06-27 | Electronic material polishing liquid |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN103619982B (fr) |
| MY (1) | MY163071A (fr) |
| TW (1) | TWI513804B (fr) |
| WO (1) | WO2013002281A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6408236B2 (ja) * | 2014-04-03 | 2018-10-17 | 昭和電工株式会社 | 研磨組成物、及び該研磨組成物を用いた基板の研磨方法 |
| US10640681B1 (en) * | 2018-10-20 | 2020-05-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for tungsten |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4171859B2 (ja) * | 1999-06-23 | 2008-10-29 | Ｊｓｒ株式会社 | 研磨用組成物および研磨方法 |
| JP2008155368A (ja) * | 1999-06-23 | 2008-07-10 | Jsr Corp | 研磨用組成物、および研磨方法 |
| JP2002050595A (ja) * | 2000-08-04 | 2002-02-15 | Hitachi Ltd | 研磨方法、配線形成方法及び半導体装置の製造方法 |
| JP2002249762A (ja) * | 2001-02-27 | 2002-09-06 | Sanyo Chem Ind Ltd | 研磨材用添加剤 |
| JP2004031442A (ja) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | 研磨液及び研磨方法 |
| JP2004051756A (ja) * | 2002-07-19 | 2004-02-19 | Sanyo Chem Ind Ltd | Ｃｍｐプロセス用研磨組成物 |
| US7300480B2 (en) * | 2003-09-25 | 2007-11-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate barrier polishing composition |
| JP2006066851A (ja) * | 2004-08-30 | 2006-03-09 | Matsumura Sekiyu Kenkyusho:Kk | 化学的機械研磨用組成物 |
| CN101010421B (zh) * | 2004-08-31 | 2011-08-03 | 三洋化成工业株式会社 | 表面活性剂 |
| JP5437571B2 (ja) * | 2006-12-26 | 2014-03-12 | 花王株式会社 | 研磨液キット |
| JP2008182221A (ja) * | 2006-12-28 | 2008-08-07 | Sanyo Chem Ind Ltd | 半導体基板用洗浄剤 |
| JP5192952B2 (ja) * | 2007-09-14 | 2013-05-08 | 三洋化成工業株式会社 | 磁気ディスク基板用洗浄剤 |
| JP5192953B2 (ja) * | 2007-09-14 | 2013-05-08 | 三洋化成工業株式会社 | 磁気ディスク用ガラス基板洗浄剤 |
-
2012
- 2012-06-27 CN CN201280031168.8A patent/CN103619982B/zh not_active Expired - Fee Related
- 2012-06-27 WO PCT/JP2012/066424 patent/WO2013002281A1/fr active Application Filing
- 2012-06-27 MY MYPI2013004663A patent/MY163071A/en unknown
- 2012-06-28 TW TW101123153A patent/TWI513804B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN103619982B (zh) | 2015-09-30 |
| TW201307543A (zh) | 2013-02-16 |
| CN103619982A (zh) | 2014-03-05 |
| WO2013002281A1 (fr) | 2013-01-03 |
| TWI513804B (zh) | 2015-12-21 |
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