MY162618A - Semiconductor wafer protective film - Google Patents

Semiconductor wafer protective film

Info

Publication number
MY162618A
MY162618A MYPI20091649A MYPI20091649A MY162618A MY 162618 A MY162618 A MY 162618A MY PI20091649 A MYPI20091649 A MY PI20091649A MY PI20091649 A MYPI20091649 A MY PI20091649A MY 162618 A MY162618 A MY 162618A
Authority
MY
Malaysia
Prior art keywords
resin
parts
mass
semiconductor wafer
protective film
Prior art date
Application number
MYPI20091649A
Other languages
English (en)
Inventor
Ichiroku Nobuhiro
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of MY162618A publication Critical patent/MY162618A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
MYPI20091649A 2008-04-25 2009-04-23 Semiconductor wafer protective film MY162618A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008115503 2008-04-25

Publications (1)

Publication Number Publication Date
MY162618A true MY162618A (en) 2017-06-30

Family

ID=41283438

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20091649A MY162618A (en) 2008-04-25 2009-04-23 Semiconductor wafer protective film

Country Status (5)

Country Link
JP (1) JP5233032B2 (zh)
KR (1) KR101485612B1 (zh)
CN (1) CN101567340B (zh)
MY (1) MY162618A (zh)
SG (1) SG156592A1 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5298913B2 (ja) * 2009-02-12 2013-09-25 信越化学工業株式会社 接着剤組成物およびそれを用いた半導体ウエハ用保護シート
JP5123341B2 (ja) * 2010-03-15 2013-01-23 信越化学工業株式会社 接着剤組成物、半導体ウエハ保護膜形成用シート
JP6159050B2 (ja) * 2010-07-26 2017-07-05 東京応化工業株式会社 接着剤組成物及び接着フィルム
JP2012033637A (ja) 2010-07-29 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法
JP2012049388A (ja) * 2010-08-27 2012-03-08 Shin Etsu Chem Co Ltd 半導体ウエハ保護膜形成用シート
JP5385247B2 (ja) * 2010-12-03 2014-01-08 信越化学工業株式会社 ウエハモールド材及び半導体装置の製造方法
TWI608062B (zh) * 2011-05-31 2017-12-11 住友電木股份有限公司 樹脂組成物、使用它之半導體裝置及半導體裝置之製造方法
JP5648617B2 (ja) * 2011-10-24 2015-01-07 信越化学工業株式会社 熱伝導性接着剤組成物並びにそれを用いた接着用シート及び熱伝導性ダイシング・ダイアタッチフィルム
KR101393895B1 (ko) * 2011-11-02 2014-05-13 (주)엘지하우시스 절단성이 우수한 반도체 웨이퍼 표면보호용 점착필름
JP6001273B2 (ja) * 2012-02-13 2016-10-05 信越化学工業株式会社 半導体ウエハ用保護フィルム及び半導体チップの製造方法
JP5931700B2 (ja) * 2012-11-13 2016-06-08 信越化学工業株式会社 半導体ウエハ用保護フィルム及び半導体チップの製造方法
CN103242797B (zh) * 2013-05-23 2014-06-18 江苏亚宝绝缘材料股份有限公司 一种聚酰亚胺胶粘剂
US10190017B2 (en) 2014-03-28 2019-01-29 Lintec Corporation Protective film-forming film and method of manufacturing semiconductor chip with protective film
TW201713507A (zh) * 2015-10-14 2017-04-16 達邁科技股份有限公司 超薄聚醯亞胺膜及其製成和組合方法
JP6763139B2 (ja) * 2015-12-25 2020-09-30 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
JP6579996B2 (ja) * 2016-05-10 2019-09-25 日東電工株式会社 シート、テープおよび半導体装置の製造方法
CN108148535B (zh) * 2017-12-18 2020-08-28 兰陵杰森装饰材料有限公司 一种热硫化胶粘剂及其制备方法
KR102419283B1 (ko) * 2021-01-27 2022-07-11 회명산업 주식회사 광경화성 유리 표면 보호 페이스트 조성물
CN113150730B (zh) * 2021-05-13 2022-07-29 湖北三选科技有限公司 一种晶圆切割用保护胶
CN114015055B (zh) * 2021-11-17 2023-04-14 江西晨光新材料股份有限公司 一种功能硅烷封端聚硅氧烷的合成方法及应用
EP4303656A1 (en) 2022-07-08 2024-01-10 Morphotonics Holding B.V. Removable textured layer
CN115216264B (zh) * 2022-08-17 2024-03-29 株洲时代新材料科技股份有限公司 一种功率半导体封装用聚酰胺酸涂覆胶的制备方法
CN116496738B (zh) * 2023-05-04 2024-01-30 深圳市安伯斯科技有限公司 一种低粘度可低温快速固化的底部填充胶及其制备方法

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JP2832143B2 (ja) * 1993-12-28 1998-12-02 信越化学工業株式会社 シリコーン微粒子およびその製造方法
MY131961A (en) * 2000-03-06 2007-09-28 Hitachi Chemical Co Ltd Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
JP4789080B2 (ja) 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法
JP3954330B2 (ja) * 2001-06-18 2007-08-08 信越化学工業株式会社 液状樹脂組成物及びこれを硬化してなる半導体装置保護用材料
JP4318872B2 (ja) * 2001-07-18 2009-08-26 電気化学工業株式会社 微細球状シリカ粉末の製造方法
JP4387085B2 (ja) * 2002-05-27 2009-12-16 住友ベークライト株式会社 ダイアタッチペースト及び半導体装置
JP4401625B2 (ja) * 2002-07-04 2010-01-20 日立化成工業株式会社 接着シート
JP4776189B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 ウエハ加工用テープ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP5040247B2 (ja) 2006-10-06 2012-10-03 東レ株式会社 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
CN101523561B (zh) * 2006-10-06 2011-06-22 住友电木株式会社 半导体用膜、半导体用膜的制造方法及半导体装置

Also Published As

Publication number Publication date
KR20090113178A (ko) 2009-10-29
CN101567340B (zh) 2012-07-04
JP5233032B2 (ja) 2013-07-10
JP2009283927A (ja) 2009-12-03
CN101567340A (zh) 2009-10-28
KR101485612B1 (ko) 2015-01-22
SG156592A1 (en) 2009-11-26

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