MY159063A - Adhesive masking tape for molded underfill process for die-exposed flip chip package - Google Patents
Adhesive masking tape for molded underfill process for die-exposed flip chip packageInfo
- Publication number
- MY159063A MY159063A MYPI2011002715A MYPI2011002715A MY159063A MY 159063 A MY159063 A MY 159063A MY PI2011002715 A MYPI2011002715 A MY PI2011002715A MY PI2011002715 A MYPI2011002715 A MY PI2011002715A MY 159063 A MY159063 A MY 159063A
- Authority
- MY
- Malaysia
- Prior art keywords
- flip chip
- die
- molded underfill
- masking tape
- heat
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 230000000873 masking effect Effects 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 4
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110005902A KR101194544B1 (ko) | 2011-01-20 | 2011-01-20 | 다이 익스포즈드 플립칩 패키지(defcp)의 몰드 언더필 공정용 점착 마스킹 테이프 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY159063A true MY159063A (en) | 2016-12-15 |
Family
ID=46715407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2011002715A MY159063A (en) | 2011-01-20 | 2011-06-13 | Adhesive masking tape for molded underfill process for die-exposed flip chip package |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5659408B2 (zh) |
KR (1) | KR101194544B1 (zh) |
MY (1) | MY159063A (zh) |
TW (1) | TWI504717B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5942321B2 (ja) * | 2012-09-21 | 2016-06-29 | 東レ先端素材株式会社Toray Advanced Materials Korea, Inc. | モールドアンダーフィル工程のマスキングテープ用粘着剤組成物及びそれを利用したマスキングテープ |
JP6204051B2 (ja) * | 2013-04-19 | 2017-09-27 | 株式会社巴川製紙所 | モールド成形用離型シート |
JP5858347B2 (ja) * | 2014-02-05 | 2016-02-10 | 大日本印刷株式会社 | 粘着剤組成物およびそれを用いた粘着フィルム |
WO2019130539A1 (ja) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2661950B2 (ja) * | 1988-03-31 | 1997-10-08 | 古河電気工業株式会社 | 半導体ウエハ固定用放射線硬化性粘着テープ |
CN100362035C (zh) * | 2003-01-31 | 2008-01-16 | 日本瑞翁株式会社 | 制备环烯树脂膜的方法和制备环烯聚合物片或膜的方法 |
JP4563711B2 (ja) * | 2004-03-30 | 2010-10-13 | グンゼ株式会社 | ダイシング用基体フイルム |
JP4393934B2 (ja) * | 2004-06-23 | 2010-01-06 | リンテック株式会社 | 半導体加工用粘着シート |
JP4805765B2 (ja) * | 2006-09-12 | 2011-11-02 | 電気化学工業株式会社 | 電子部品固定用粘着シート及びそれを用いた電子部品の製造方法。 |
JP4343943B2 (ja) * | 2006-11-24 | 2009-10-14 | 日東電工株式会社 | 半導体装置製造用の耐熱性粘着テープ |
JP2010053192A (ja) * | 2008-08-27 | 2010-03-11 | Nitto Denko Corp | 粘着テープ又はシート |
KR20100073613A (ko) * | 2008-12-23 | 2010-07-01 | 도레이첨단소재 주식회사 | 반도체 장치용 내열 점착테잎 |
-
2011
- 2011-01-20 KR KR1020110005902A patent/KR101194544B1/ko active IP Right Grant
- 2011-06-08 JP JP2011128433A patent/JP5659408B2/ja not_active Expired - Fee Related
- 2011-06-13 MY MYPI2011002715A patent/MY159063A/en unknown
- 2011-06-17 TW TW100121211A patent/TWI504717B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2012149210A (ja) | 2012-08-09 |
KR20120084501A (ko) | 2012-07-30 |
JP5659408B2 (ja) | 2015-01-28 |
KR101194544B1 (ko) | 2012-10-25 |
TWI504717B (zh) | 2015-10-21 |
TW201245384A (en) | 2012-11-16 |
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