MY159063A - Adhesive masking tape for molded underfill process for die-exposed flip chip package - Google Patents

Adhesive masking tape for molded underfill process for die-exposed flip chip package

Info

Publication number
MY159063A
MY159063A MYPI2011002715A MYPI2011002715A MY159063A MY 159063 A MY159063 A MY 159063A MY PI2011002715 A MYPI2011002715 A MY PI2011002715A MY PI2011002715 A MYPI2011002715 A MY PI2011002715A MY 159063 A MY159063 A MY 159063A
Authority
MY
Malaysia
Prior art keywords
flip chip
die
molded underfill
masking tape
heat
Prior art date
Application number
MYPI2011002715A
Inventor
Sung-Hwan Choi
Sang-Pil Kim
Ki-Jeong Moon
Original Assignee
Toray Advanced Mat Korea Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Advanced Mat Korea Inc filed Critical Toray Advanced Mat Korea Inc
Publication of MY159063A publication Critical patent/MY159063A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

THIS DISCLOSURE PROVIDES AN ADHESIVE MASKING TAPE FOR MOLDED UNDERFILL (MUF) PROCESS FOR DIE—EXPOSED FLIP CHIP PACKAGES (DEFCP), COMPRISING A HEAT-RESISTANT SUBSTRATE (A3) AND AN ADHESIVE LAYER (A4) COATED ON THE HEAT-RESISTANT SUBSTRATE (A3), CHARACTERIZED IN THAT THE HEAT-RESISTANT SUBSTRATE (A3) IS A PEN FILM, AND THE HEAT-RESISTANT SUBSTRATE (A3) HAS A THICKNESS OF 25UM TO 5OUM. THE ADHESIVE MASKING TAPES FOR MOLDED UNDERFILL PROCESS FOR DIE-EXPOSED FLIP CHIP PACKAGES IN ACCORDANCE WITH THE PRESENT DISCLOSURE PROVIDES AN EFFECT OF IMPROVING THE RELIABILITY AND PREVENTING THE CONTAMINATION OF FLIP CHIP PACKAGES.
MYPI2011002715A 2011-01-20 2011-06-13 Adhesive masking tape for molded underfill process for die-exposed flip chip package MY159063A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110005902A KR101194544B1 (en) 2011-01-20 2011-01-20 Adhesive masking tape for die exposed flip-chip package defcp molded underfill muf

Publications (1)

Publication Number Publication Date
MY159063A true MY159063A (en) 2016-12-15

Family

ID=46715407

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011002715A MY159063A (en) 2011-01-20 2011-06-13 Adhesive masking tape for molded underfill process for die-exposed flip chip package

Country Status (4)

Country Link
JP (1) JP5659408B2 (en)
KR (1) KR101194544B1 (en)
MY (1) MY159063A (en)
TW (1) TWI504717B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5942321B2 (en) * 2012-09-21 2016-06-29 東レ先端素材株式会社Ｔｏｒａｙ Ａｄｖａｎｃｅｄ Ｍａｔｅｒｉａｌｓ Ｋｏｒｅａ， Ｉｎｃ． Adhesive composition for masking tape in mold underfill process and masking tape using the same
JP6204051B2 (en) * 2013-04-19 2017-09-27 株式会社巴川製紙所 Mold release sheet
JP5858347B2 (en) * 2014-02-05 2016-02-10 大日本印刷株式会社 Adhesive composition and adhesive film using the same
WO2019130539A1 (en) * 2017-12-28 2019-07-04 リンテック株式会社 Adhesive sheet and method for producing semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2661950B2 (en) * 1988-03-31 1997-10-08 古河電気工業株式会社 Radiation-curable adhesive tape for fixing semiconductor wafers
CN100362035C (en) * 2003-01-31 2008-01-16 日本瑞翁株式会社 Process for producing cycloolefin resin film and process for producing cycloolefin polymer sheet or film
JP4563711B2 (en) * 2004-03-30 2010-10-13 グンゼ株式会社 Substrate film for dicing
JP4393934B2 (en) * 2004-06-23 2010-01-06 リンテック株式会社 Adhesive sheet for semiconductor processing
JP4805765B2 (en) * 2006-09-12 2011-11-02 電気化学工業株式会社 An adhesive sheet for fixing an electronic component and a method for manufacturing an electronic component using the same.
JP4343943B2 (en) * 2006-11-24 2009-10-14 日東電工株式会社 Heat-resistant adhesive tape for semiconductor device manufacturing
JP2010053192A (en) * 2008-08-27 2010-03-11 Nitto Denko Corp Pressure-sensitive adhesive tape or sheet
KR20100073613A (en) * 2008-12-23 2010-07-01 도레이첨단소재 주식회사 Heat-resistant adhesive tape for semiconductor device

Also Published As

Publication number Publication date
JP2012149210A (en) 2012-08-09
KR20120084501A (en) 2012-07-30
JP5659408B2 (en) 2015-01-28
KR101194544B1 (en) 2012-10-25
TWI504717B (en) 2015-10-21
TW201245384A (en) 2012-11-16

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