MY156527A - Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product - Google Patents

Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product

Info

Publication number
MY156527A
MY156527A MYPI2012002646A MYPI2012002646A MY156527A MY 156527 A MY156527 A MY 156527A MY PI2012002646 A MYPI2012002646 A MY PI2012002646A MY PI2012002646 A MYPI2012002646 A MY PI2012002646A MY 156527 A MY156527 A MY 156527A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
cured product
production
same
Prior art date
Application number
MYPI2012002646A
Other languages
English (en)
Inventor
Kaji Masashi
Ogami Koichiro
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of MY156527A publication Critical patent/MY156527A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
MYPI2012002646A 2009-12-14 2010-12-13 Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product MY156527A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009282740 2009-12-14

Publications (1)

Publication Number Publication Date
MY156527A true MY156527A (en) 2016-02-26

Family

ID=44167269

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012002646A MY156527A (en) 2009-12-14 2010-12-13 Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product

Country Status (7)

Country Link
JP (1) JP5166610B2 (fr)
KR (1) KR101752222B1 (fr)
CN (1) CN102656204B (fr)
MY (1) MY156527A (fr)
SG (1) SG181697A1 (fr)
TW (1) TWI494338B (fr)
WO (1) WO2011074517A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104114639B (zh) * 2012-03-16 2016-11-09 住友电木株式会社 封装用树脂组合物和使用其的电子装置
JP2013209503A (ja) * 2012-03-30 2013-10-10 Nippon Steel & Sumikin Chemical Co Ltd エポキシ樹脂組成物、及びその硬化物
KR101385005B1 (ko) * 2012-04-25 2014-04-16 국도화학 주식회사 에폭시몰딩컴파운드용 자기소화성 에폭시 수지 및 그 제법, 에폭시몰딩컴파운드용 에폭시 수지 조성물
JPWO2014065152A1 (ja) * 2012-10-26 2016-09-08 新日鉄住金化学株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物の製造方法、及び半導体装置
JP2017095524A (ja) * 2014-03-28 2017-06-01 新日鉄住金化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
CN104269096B (zh) * 2014-09-19 2018-08-10 黄海龙 数字化虚拟胎儿全身动脉系统的构建方法
JP6426966B2 (ja) * 2014-10-06 2018-11-21 日鉄ケミカル&マテリアル株式会社 半導体封止用樹脂組成物及び半導体装置
TWI728084B (zh) * 2016-03-30 2021-05-21 日商日鐵化學材料股份有限公司 多價羥基樹脂、其之製造方法、環氧樹脂、環氧樹脂組成物及其之硬化物
JP7212830B2 (ja) * 2017-03-31 2023-01-26 株式会社レゾナック 封止用エポキシ樹脂組成物及び電子部品装置
CN107457951B (zh) * 2017-08-08 2019-04-09 哈尔滨工业大学 一种可重构的热固性多重刺激形状记忆复合材料制备方法
JP2019104821A (ja) 2017-12-12 2019-06-27 日鉄ケミカル&マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP7252196B2 (ja) * 2018-03-09 2023-04-04 日鉄ケミカル&マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP7059132B2 (ja) 2018-06-29 2022-04-25 日鉄ケミカル&マテリアル株式会社 多価ヒドロキシ樹脂の製造方法
JP7277136B2 (ja) 2018-12-28 2023-05-18 日鉄ケミカル&マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
JP7545889B2 (ja) 2020-12-25 2024-09-05 日鉄ケミカル&マテリアル株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
CN117460756A (zh) * 2021-06-30 2024-01-26 日铁化学材料株式会社 环氧树脂、环氧树脂组合物及其固化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205566B2 (ja) * 1991-02-08 2001-09-04 新日鐵化学株式会社 多官能エポキシ樹脂及びその製造方法
JP3227180B2 (ja) * 1991-08-19 2001-11-12 新日鐵化学株式会社 多官能エポキシ樹脂及びその中間体並びにその製造方法
JP2952094B2 (ja) * 1991-10-30 1999-09-20 新日鐵化学株式会社 エポキシ化合物
JP3122834B2 (ja) * 1994-09-20 2001-01-09 明和化成株式会社 新規フェノールノボラック縮合体
JPH08239454A (ja) * 1995-03-03 1996-09-17 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2000344858A (ja) * 1999-03-16 2000-12-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP5127160B2 (ja) * 2006-05-19 2013-01-23 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
WO2009110424A1 (fr) 2008-03-03 2009-09-11 新日鐵化学株式会社 Résine époxy modifiée, compositions de résine époxy et articles durcis
JP5433294B2 (ja) * 2009-04-30 2014-03-05 エア・ウォーター株式会社 ジヒドロキシナフタレン系重合体、その製造方法およびその用途

Also Published As

Publication number Publication date
WO2011074517A1 (fr) 2011-06-23
TW201144347A (en) 2011-12-16
SG181697A1 (en) 2012-07-30
KR101752222B1 (ko) 2017-06-29
CN102656204B (zh) 2014-08-27
JP5166610B2 (ja) 2013-03-21
TWI494338B (zh) 2015-08-01
KR20120115301A (ko) 2012-10-17
CN102656204A (zh) 2012-09-05
JPWO2011074517A1 (ja) 2013-04-25

Similar Documents

Publication Publication Date Title
MY156527A (en) Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product
ATE522577T1 (de) Thermoplastische polyamide mit polyetheraminen
BR112013029221A2 (pt) composição de formulação de resina epóxi curável, processo para preparar uma composição de formulação de resina epóxi curável, processo para preparar um material isolante de epóxi e produto
MY169938A (en) Curable composition, cured product thereof, optical member and optical device
WO2011059633A3 (fr) Résines polyoxazolidone
MX2018005051A (es) Composicion de resina de poliester termoplastica y articulo moldeado.
ATE510897T1 (de) Hitzebeständige strukturelle epoxidharze
WO2010056489A3 (fr) Composition thermoplastique comportant une charge conductrice de chaleur et un polyester-amide hyperbranché
WO2009001658A1 (fr) Composition de résine composite cyanate/époxy de type à un composant
BR112013025856A2 (pt) composições de elastômero de fluropoliéter tendo temperaturas de transição vítrea baixas
WO2010123314A3 (fr) Nouvelle résine époxy et composition de résine époxy la comprenant
WO2018073652A3 (fr) Compositions de résine époxy et matériaux composites renforcés de fibres préparés à partir desdites compositions
TW200722453A (en) Thermosetting resin composition
JP2012514077A5 (fr)
WO2011056651A3 (fr) Résines de polyimide pour applications d'usure à haute température
MX2013005424A (es) Molde para extension de lampara automotriz.
MX2024001373A (es) Composiciones de polimero termicamente conductor que contienen negro de humo.
TW200513508A (en) Epoxy compound, preparation method thereof, and use thereof
TW200745194A (en) Epoxy resin hardener and epoxy resin composition
MY173820A (en) Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body
JP2015520782A5 (fr)
WO2009060897A1 (fr) Résine époxy et son procédé de fabrication, composition de résine époxy et produit durci
WO2011100049A3 (fr) Résine époxyde contenant du phosphore
WO2011097009A3 (fr) Compositions de résine époxy durcissables
JP2013253220A5 (fr)