MY149262A - Facilitating adhesion between substrate and patterned layer - Google Patents

Facilitating adhesion between substrate and patterned layer

Info

Publication number
MY149262A
MY149262A MYPI2011001822A MYPI20111822A MY149262A MY 149262 A MY149262 A MY 149262A MY PI2011001822 A MYPI2011001822 A MY PI2011001822A MY PI20111822 A MYPI20111822 A MY PI20111822A MY 149262 A MY149262 A MY 149262A
Authority
MY
Malaysia
Prior art keywords
substrate
patterned layer
facilitating adhesion
adhesion
layer
Prior art date
Application number
MYPI2011001822A
Other languages
English (en)
Inventor
Edward B Fletcher
Ye Zhengmao
Frank Y Xu
Dwayne L Labrake
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of MY149262A publication Critical patent/MY149262A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Laminated Bodies (AREA)
  • Cleaning Implements For Floors, Carpets, Furniture, Walls, And The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
MYPI2011001822A 2008-10-30 2009-10-29 Facilitating adhesion between substrate and patterned layer MY149262A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10952808P 2008-10-30 2008-10-30
US12/606,588 US8361546B2 (en) 2008-10-30 2009-10-27 Facilitating adhesion between substrate and patterned layer

Publications (1)

Publication Number Publication Date
MY149262A true MY149262A (en) 2013-08-15

Family

ID=41447119

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001822A MY149262A (en) 2008-10-30 2009-10-29 Facilitating adhesion between substrate and patterned layer

Country Status (5)

Country Link
US (1) US8361546B2 (OSRAM)
JP (1) JP5404803B2 (OSRAM)
KR (1) KR101699060B1 (OSRAM)
MY (1) MY149262A (OSRAM)
WO (1) WO2010051024A1 (OSRAM)

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US8846195B2 (en) * 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
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US8361546B2 (en) 2008-10-30 2013-01-29 Molecular Imprints, Inc. Facilitating adhesion between substrate and patterned layer
US20110165412A1 (en) * 2009-11-24 2011-07-07 Molecular Imprints, Inc. Adhesion layers in nanoimprint lithograhy
KR20130105648A (ko) * 2010-09-08 2013-09-25 몰레큘러 임프린츠 인코퍼레이티드 임프린트 리소그래피에 사용하는 증기 전달 시스템
TWI471693B (zh) * 2011-11-10 2015-02-01 Canon Kk 光可固化組成物，及使用彼之圖案化方法
US10488753B2 (en) 2015-09-08 2019-11-26 Canon Kabushiki Kaisha Substrate pretreatment and etch uniformity in nanoimprint lithography
US20170066208A1 (en) 2015-09-08 2017-03-09 Canon Kabushiki Kaisha Substrate pretreatment for reducing fill time in nanoimprint lithography
US10754244B2 (en) 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10134588B2 (en) 2016-03-31 2018-11-20 Canon Kabushiki Kaisha Imprint resist and substrate pretreatment for reducing fill time in nanoimprint lithography
US10095106B2 (en) 2016-03-31 2018-10-09 Canon Kabushiki Kaisha Removing substrate pretreatment compositions in nanoimprint lithography
US10620539B2 (en) 2016-03-31 2020-04-14 Canon Kabushiki Kaisha Curing substrate pretreatment compositions in nanoimprint lithography
US10509313B2 (en) 2016-06-28 2019-12-17 Canon Kabushiki Kaisha Imprint resist with fluorinated photoinitiator and substrate pretreatment for reducing fill time in nanoimprint lithography
US10317793B2 (en) 2017-03-03 2019-06-11 Canon Kabushiki Kaisha Substrate pretreatment compositions for nanoimprint lithography
US11448958B2 (en) * 2017-09-21 2022-09-20 Canon Kabushiki Kaisha System and method for controlling the placement of fluid resist droplets
US12300487B2 (en) * 2018-09-27 2025-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist composition and method of forming photoresist pattern
PL3650224T3 (pl) * 2018-11-09 2023-09-18 Phoenix Contact Gmbh & Co. Kg Urządzenie i sposób zadrukowywania artykułu
US11845241B2 (en) 2021-03-18 2023-12-19 Canon Kabushiki Kaisha Laminate containing an adhesion promoter layer and method of making the laminate
US12242205B2 (en) 2021-11-30 2025-03-04 Canon Kabushiki Kaisha Reaction chamber with stop-gapped vacuum seal
US12325046B2 (en) * 2022-06-28 2025-06-10 Canon Kabushiki Kaisha Superstrate including a body and layers and methods of forming and using the same

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Also Published As

Publication number Publication date
KR101699060B1 (ko) 2017-01-23
JP2012507391A (ja) 2012-03-29
WO2010051024A1 (en) 2010-05-06
JP5404803B2 (ja) 2014-02-05
US8361546B2 (en) 2013-01-29
KR20110089857A (ko) 2011-08-09
US20100112236A1 (en) 2010-05-06

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