MY147408A - Curable silicone resin composition and cured body thereof - Google Patents

Curable silicone resin composition and cured body thereof

Info

Publication number
MY147408A
MY147408A MYPI20084610A MYPI20084610A MY147408A MY 147408 A MY147408 A MY 147408A MY PI20084610 A MYPI20084610 A MY PI20084610A MY PI20084610 A MYPI20084610 A MY PI20084610A MY 147408 A MY147408 A MY 147408A
Authority
MY
Malaysia
Prior art keywords
resin composition
silicone resin
curable silicone
cured body
cured
Prior art date
Application number
MYPI20084610A
Other languages
English (en)
Inventor
Yoshitake Makoto
Takeuchi Kasumi
Sagawa Takashi
Nakanishi Koji
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of MY147408A publication Critical patent/MY147408A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/50Phosphorus bound to carbon only
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5377Phosphinous compounds, e.g. R2=P—OR'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
MYPI20084610A 2006-05-16 2007-05-11 Curable silicone resin composition and cured body thereof MY147408A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006137074A JP5072263B2 (ja) 2006-05-16 2006-05-16 硬化性シリコーンレジン組成物およびその硬化物

Publications (1)

Publication Number Publication Date
MY147408A true MY147408A (en) 2012-11-30

Family

ID=38353129

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20084610A MY147408A (en) 2006-05-16 2007-05-11 Curable silicone resin composition and cured body thereof

Country Status (8)

Country Link
US (1) US20090298980A1 (enExample)
EP (1) EP2024439B1 (enExample)
JP (1) JP5072263B2 (enExample)
KR (1) KR101429037B1 (enExample)
CN (1) CN101443416B (enExample)
MY (1) MY147408A (enExample)
TW (1) TWI403559B (enExample)
WO (1) WO2007132932A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006016753A1 (de) * 2006-04-10 2007-10-11 Wacker Chemie Ag Vernetzbare Massen auf der Basis von Organosiliciumverbindungen
JP2010526927A (ja) * 2007-05-14 2010-08-05 モーメンテイブ・パーフオーマンス・マテリアルズ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 絶縁体の生成におけるフェロセン又はフェロセン誘導体の使用
JP2010001358A (ja) * 2008-06-19 2010-01-07 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン組成物、その硬化物及び該組成物からなる光学素子封止材
JP4993135B2 (ja) * 2008-07-08 2012-08-08 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2012007136A (ja) * 2010-05-21 2012-01-12 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
EP2609137A1 (en) 2010-08-23 2013-07-03 Dow Corning Corporation Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins
JP2014500897A (ja) 2010-11-09 2014-01-16 ダウ コーニング コーポレーション 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂
JP2013095809A (ja) 2011-10-31 2013-05-20 Nitto Denko Corp シリコーン樹脂組成物、シリコーン樹脂シート、光半導体素子装置、および、シリコーン樹脂シートの製造方法。
DE102012200335A1 (de) * 2012-01-11 2013-07-11 Wacker Chemie Ag Hitzestabilisierte Siliconmischung
DE102012013710A1 (de) * 2012-07-11 2014-01-16 Technische Universität München Vernetzbare Siloxane durch säurekatalysierte Polymerisation von Oxasilacyclen
DE102012013711A1 (de) 2012-07-11 2014-01-16 Technische Universität München Oxasilacyclen und Verfahren zu deren Herstellung
WO2014164801A1 (en) * 2013-03-11 2014-10-09 Rutgers, The State University Of New Jersey Metallorganocatalysis for asymmetric transformations
JP5853989B2 (ja) * 2013-05-16 2016-02-09 信越化学工業株式会社 リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
WO2015030116A1 (ja) * 2013-08-30 2015-03-05 電気化学工業株式会社 ポリエン-ポリチオール系組成物
US20180105692A1 (en) * 2015-02-25 2018-04-19 Dow Corning Toray Co., Ltd. Curable granular silicone composition and method for manufacturing thereof
US11091636B2 (en) 2017-06-19 2021-08-17 Dow Silicones Corporation Liquid silicone composition for transfer- or injection-molding optical parts, optical parts made therefrom, and a method thereof
KR102717266B1 (ko) * 2017-10-20 2024-10-16 다우 도레이 캄파니 리미티드 경화성 입자상 실리콘 조성물, 그 경화물, 및 그 제조 방법
CN113165348A (zh) * 2018-12-25 2021-07-23 陶氏东丽株式会社 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途
US12415923B2 (en) 2020-08-06 2025-09-16 Dow Tray Co., Ltd. Curable silicone composition and cured product of same
KR20240051148A (ko) * 2021-08-30 2024-04-19 닛산 가가쿠 가부시키가이샤 열경화성 조성물
US20240376269A1 (en) * 2021-10-21 2024-11-14 Dow Global Technologies Llc Method for promoting hydrosilylation reaction to prepare ester-functional siloxane oligomers
TW202340380A (zh) 2022-03-31 2023-10-16 日商陶氏東麗股份有限公司 固化性聚矽氧組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615972A (en) * 1967-04-28 1971-10-26 Dow Chemical Co Expansible thermoplastic polymer particles containing volatile fluid foaming agent and method of foaming the same
US3844992A (en) * 1973-11-16 1974-10-29 Dow Corning Wood graining tool fast cure organopolysiloxane resins
JPH0826225B2 (ja) * 1990-06-13 1996-03-13 東レ・ダウコーニング・シリコーン株式会社 加熱硬化型シリコーンエラストマー組成物
JP2526188B2 (ja) * 1991-11-28 1996-08-21 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性オルガノポリシロキサン組成物
JP3341381B2 (ja) * 1993-08-09 2002-11-05 信越化学工業株式会社 加熱硬化型シリコーンゴム組成物
JP3899134B2 (ja) * 1993-12-29 2007-03-28 東レ・ダウコーニング株式会社 加熱硬化性シリコーン組成物
US5696210A (en) * 1996-10-09 1997-12-09 Dow Corning Corporation Flowable adhesive
DE19735813A1 (de) * 1997-08-18 1999-02-25 Wacker Chemie Gmbh Kompressiblen Schwefel enthaltender Siliconkautschuk
CA2488091A1 (en) 2002-06-05 2003-12-18 Nobuo Kushibiki Polysiloxane film and process for producing the same
JP4663969B2 (ja) * 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
DE10235267A1 (de) * 2002-08-01 2004-02-12 Wacker-Chemie Gmbh Verwendung von Rhodium-vernetzenden Siliconelastomeren für die Herstellung von Backformen
JP4559048B2 (ja) * 2003-07-24 2010-10-06 ダウ・コーニング・コーポレイション 硬化性シリコーン組成物、及びこれを用いたパターン形成方法
JP4647941B2 (ja) * 2004-06-23 2011-03-09 東レ・ダウコーニング株式会社 シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物
JP5420141B2 (ja) * 2006-03-01 2014-02-19 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物および硬化物

Also Published As

Publication number Publication date
CN101443416B (zh) 2012-09-26
JP2007308542A (ja) 2007-11-29
WO2007132932A1 (en) 2007-11-22
TW200806749A (en) 2008-02-01
TWI403559B (zh) 2013-08-01
EP2024439A1 (en) 2009-02-18
EP2024439B1 (en) 2012-06-27
JP5072263B2 (ja) 2012-11-14
US20090298980A1 (en) 2009-12-03
KR20090028530A (ko) 2009-03-18
CN101443416A (zh) 2009-05-27
KR101429037B1 (ko) 2014-08-12

Similar Documents

Publication Publication Date Title
MY147408A (en) Curable silicone resin composition and cured body thereof
TW200736341A (en) Curable silicone resin composition and cured body thereof
ATE517947T1 (de) Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung
TW200940649A (en) White heat-curable silicone resin composition, optoelectronic part case, and molding method
WO2008153125A1 (ja) 光半導体素子用封止剤及び光半導体素子
WO2011043634A3 (ko) 내열성이 향상된 전방향족 액정 폴리에스테르 수지 컴파운드 및 그의 제조방법
MY150038A (en) Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
TW200604285A (en) Resin composition and its application, and modified polyolefin resin and method for manufactruing the same
WO2008114634A1 (ja) 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法
MY152079A (en) Resin molded body and method for manufacturing the same
WO2008127923A3 (en) Heat-resistant structural epoxy resins
WO2008027280A3 (en) Optical devices and silicone compositions and processes fabricating the optical devices
WO2011090361A3 (ko) 경화성 조성물
MXPA04008505A (es) Resinas de poliimida procesables por ir y mtr.
AU2003275406A1 (en) Room temperature curable water-based mold release agent for composite materials
MY149507A (en) Curable organopolysiloxane resin composition and optical part molded therefrom
WO2009054060A1 (ja) 高耐熱性マスターバッチ、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体
WO2007138399A3 (en) Heat-curable powder coating composition
WO2010039470A3 (en) Poly(arylene ether) composition with improved melt flow and method for the preparation thereof
WO2008114731A1 (ja) 熱収縮性部材に用いる樹脂組成物、該樹脂組成物からなる熱収縮性チューブ、及び該チューブで被覆された部材
EP2028220A4 (en) MOLDED ARTICLE AND METHOD FOR PRODUCING THE SAID ARTICLE
ATE287934T1 (de) Wärmehärtende epoxydpulverbeschichtungen die verbesserte entgasungseigenschaften aufweisen
WO2008133147A1 (ja) 耐熱性に優れた有機重合体微粒子およびその製造方法、並びにこれを用いた光学用部材
EA200701639A1 (ru) Порошковые покрытия
WO2011100049A3 (en) Phosphorus-containing epoxy resin