MY138355A - Potassium hydrogen peroxymonosulfate solutions - Google Patents

Potassium hydrogen peroxymonosulfate solutions

Info

Publication number
MY138355A
MY138355A MYPI20041139A MYPI20041139A MY138355A MY 138355 A MY138355 A MY 138355A MY PI20041139 A MYPI20041139 A MY PI20041139A MY PI20041139 A MYPI20041139 A MY PI20041139A MY 138355 A MY138355 A MY 138355A
Authority
MY
Malaysia
Prior art keywords
potassium hydrogen
hydrogen peroxymonosulfate
solutions
peroxymonosulfate solutions
khso5
Prior art date
Application number
MYPI20041139A
Other languages
English (en)
Inventor
Thomas Peter Tufano
Michael Brian Coxey
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of MY138355A publication Critical patent/MY138355A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • ing And Chemical Polishing (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Weting (AREA)
MYPI20041139A 2003-03-31 2004-03-30 Potassium hydrogen peroxymonosulfate solutions MY138355A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/404,200 US6818142B2 (en) 2003-03-31 2003-03-31 Potassium hydrogen peroxymonosulfate solutions

Publications (1)

Publication Number Publication Date
MY138355A true MY138355A (en) 2009-05-29

Family

ID=33096896

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20041139A MY138355A (en) 2003-03-31 2004-03-30 Potassium hydrogen peroxymonosulfate solutions

Country Status (9)

Country Link
US (1) US6818142B2 (https=)
EP (1) EP1608591A1 (https=)
JP (1) JP4745221B2 (https=)
KR (1) KR101069113B1 (https=)
CN (1) CN1331736C (https=)
CA (1) CA2517511A1 (https=)
MY (1) MY138355A (https=)
TW (1) TWI348993B (https=)
WO (1) WO2004089817A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329365B2 (en) * 2004-08-25 2008-02-12 Samsung Electronics Co., Ltd. Etchant composition for indium oxide layer and etching method using the same
KR101191405B1 (ko) * 2005-07-13 2012-10-16 삼성디스플레이 주식회사 식각액 및 이를 이용한 액정 표시 장치의 제조 방법
US20070023364A1 (en) * 2005-07-28 2007-02-01 Felkner I C Tetrasilver Tetraoxide as Disinfective Agent for Cryptosporidium
US20070138109A1 (en) * 2005-12-21 2007-06-21 Tufano Thomas P Oxidizing composition for salt water
US7442323B2 (en) * 2006-06-02 2008-10-28 E. I. Du Pont De Nemours And Company Potassium monopersulfate solutions
SG183744A1 (en) * 2007-08-20 2012-09-27 Advanced Tech Materials Composition and method for removing ion-implanted photoresist
KR20100133507A (ko) * 2008-05-01 2010-12-21 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 고밀도 주입된 레지스트의 제거를 위한 저 ｐｈ 혼합물
US20100252530A1 (en) * 2009-04-03 2010-10-07 E. I. Du Pont De Nemours And Company Etchant composition and method
TWI480360B (zh) * 2009-04-03 2015-04-11 杜邦股份有限公司 蝕刻劑組成物及方法
JP5340071B2 (ja) * 2009-08-03 2013-11-13 株式会社Ａｄｅｋａ 安定剤を含むペルオキシ一硫酸水溶液の製造方法
CN102260871A (zh) * 2011-06-24 2011-11-30 李沛泓 印刷线路板微蚀刻剂
EP2572776A1 (en) * 2011-09-21 2013-03-27 Evonik Degussa GmbH Device for mixing and cooling two reactive liquids and method of making peroxomonosulphuric acid with the device
EP2572781A1 (en) 2011-09-21 2013-03-27 Evonik Degussa GmbH Device and method for making a dilute aqueous solution of peroxomonosulphuric acid
CN110172349B (zh) * 2019-05-08 2020-11-20 厦门大学 一种氮化镓半导体光电化学刻蚀液及加工方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE106331C (https=)
US2500881A (en) * 1949-05-10 1950-03-14 Stader William Hanger support
BE579110A (https=) 1958-05-29
US3048546A (en) 1959-02-24 1962-08-07 Du Pont Bleaching compositions
US3041139A (en) * 1960-06-24 1962-06-26 Du Pont Method of preparing monopersulfate composition containing the triple salt khso4?k2so4?2khso5
ATE74879T1 (de) * 1983-12-30 1992-05-15 Du Pont Kaliummonopersulfat-zusammensetzungen und verfahren zu deren herstellung.
US4579725A (en) 1983-12-30 1986-04-01 E. I. Du Pont De Nemours And Company Potassium monopersulfate compositions and process for preparing them
DE3427119A1 (de) * 1984-07-23 1986-01-23 Peroxid-Chemie GmbH, 8023 Höllriegelskreuth Verfahren zur herstellung von kaliumpermonosulfat-tripelsalz
DE3914827C2 (de) 1989-05-05 1995-06-14 Schuelke & Mayr Gmbh Flüssiges Desinfektionsmittelkonzentrat
US5139763A (en) * 1991-03-06 1992-08-18 E. I. Du Pont De Nemours And Company Class of stable potassium monopersulfate compositions
DE19503900C1 (de) 1995-02-07 1995-11-23 Degussa Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶
DE69734868T2 (de) * 1996-07-25 2006-08-03 Dupont Air Products Nanomaterials L.L.C., Tempe Zusammensetzung und verfahren zum chemisch-mechanischen polieren
US5855805A (en) * 1996-08-08 1999-01-05 Fmc Corporation Microetching and cleaning of printed wiring boards
JP3094392B2 (ja) 1997-12-10 2000-10-03 株式会社荏原電産 エッチング液
US6200454B1 (en) 1997-12-24 2001-03-13 Mitsubishi Gas Chemical Company, Inc. Process for producing sodium persulfate
JP2000064067A (ja) * 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
US6255117B1 (en) 1999-06-04 2001-07-03 Lamotte Company Method and device for determining monopersulfate
JP3974305B2 (ja) * 1999-06-18 2007-09-12 エルジー フィリップス エルシーディー カンパニー リミテッド エッチング剤及びこれを用いた電子機器用基板の製造方法と電子機器

Also Published As

Publication number Publication date
US6818142B2 (en) 2004-11-16
KR20060013493A (ko) 2006-02-10
EP1608591A1 (en) 2005-12-28
KR101069113B1 (ko) 2011-09-30
TW200502159A (en) 2005-01-16
WO2004089817A1 (en) 2004-10-21
JP4745221B2 (ja) 2011-08-10
TWI348993B (en) 2011-09-21
JP2006522003A (ja) 2006-09-28
US20040197261A1 (en) 2004-10-07
CN1768005A (zh) 2006-05-03
CA2517511A1 (en) 2004-10-21
CN1331736C (zh) 2007-08-15

Similar Documents

Publication Publication Date Title
MY138355A (en) Potassium hydrogen peroxymonosulfate solutions
TWI268292B (en) Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
MXPA03010455A (es) Composiciones para el cuidado bucal.
AR051704A1 (es) Composicion para el consumo humano que brinda mejoras en la concentracion de la agudeza mental
BRPI0414502A (pt) processo de preparação de silicato e de sìlica precipitada, sìlica precipitada e utilização da sìlica precipitada
TW200619214A (en) Aromatic compound
MY117075A (en) Method of removing mercury in liquid hydrocarbon
TW200605212A (en) Method for enhancing fluorine utilization
ATE340247T1 (de) Korrosionsschutz für glaswaren
WO2002092027A3 (en) Confectionery compositions
MXPA03011369A (es) Agente anticorrosivo y proceso de proteccion de corrosion para superficies de metal.
TW200618737A (en) A disinfectant formulation
AU2003289928A1 (en) Coated peroxygen compounds with controlled release, a process for their preparation and their use
TW200624607A (en) Gold plating liquid and gold plating method
KR860000410A (ko) 화학동(化學銅)도금방법
ATE388194T1 (de) Stabilisierung von wässrigen lösungen von homo- und copolymeren des n-vinylpyrrolidons
WO2006008450A3 (en) Cored wire composition for increasing titanium content of steel
TW200604379A (en) Phenylnaphthylimidazole compound and usage of the same
MXPA03007757A (es) Composiciones que contienen creatina y creatinina.
KR920017955A (ko) 시아노하이드린 및/또는 니트릴을 함유하는 수용액을 해독시키는 방법
IL142386A0 (en) Method for retarding corrosion of metals in lithium halide solutions
DK0904071T3 (da) Oralt rehydreringsprodukt indeholdende glutamin
JPS5540064A (en) Blow-hole resistance covered electrode
WO2003016593A3 (en) Hydrogen evolution inhibiting additives for zinc electrowinning
MY146391A (en) Tin and tin alloy electroplating solution