TWI348993B - Potassium hydrogen peroxymonosulfate solutions - Google Patents

Potassium hydrogen peroxymonosulfate solutions

Info

Publication number
TWI348993B
TWI348993B TW093105892A TW93105892A TWI348993B TW I348993 B TWI348993 B TW I348993B TW 093105892 A TW093105892 A TW 093105892A TW 93105892 A TW93105892 A TW 93105892A TW I348993 B TWI348993 B TW I348993B
Authority
TW
Taiwan
Prior art keywords
potassium hydrogen
hydrogen peroxymonosulfate
solutions
peroxymonosulfate solutions
potassium
Prior art date
Application number
TW093105892A
Other languages
English (en)
Chinese (zh)
Other versions
TW200502159A (en
Inventor
Thomas Peter Tufano
Michael Brian Coxey
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200502159A publication Critical patent/TW200502159A/zh
Application granted granted Critical
Publication of TWI348993B publication Critical patent/TWI348993B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08—Peroxysulfates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • ing And Chemical Polishing (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Weting (AREA)
TW093105892A 2003-03-31 2004-03-05 Potassium hydrogen peroxymonosulfate solutions TWI348993B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/404,200 US6818142B2 (en) 2003-03-31 2003-03-31 Potassium hydrogen peroxymonosulfate solutions

Publications (2)

Publication Number Publication Date
TW200502159A TW200502159A (en) 2005-01-16
TWI348993B true TWI348993B (en) 2011-09-21

Family

ID=33096896

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105892A TWI348993B (en) 2003-03-31 2004-03-05 Potassium hydrogen peroxymonosulfate solutions

Country Status (9)

Country Link
US (1) US6818142B2 (https=)
EP (1) EP1608591A1 (https=)
JP (1) JP4745221B2 (https=)
KR (1) KR101069113B1 (https=)
CN (1) CN1331736C (https=)
CA (1) CA2517511A1 (https=)
MY (1) MY138355A (https=)
TW (1) TWI348993B (https=)
WO (1) WO2004089817A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329365B2 (en) * 2004-08-25 2008-02-12 Samsung Electronics Co., Ltd. Etchant composition for indium oxide layer and etching method using the same
KR101191405B1 (ko) * 2005-07-13 2012-10-16 삼성디스플레이 주식회사 식각액 및 이를 이용한 액정 표시 장치의 제조 방법
US20070023364A1 (en) * 2005-07-28 2007-02-01 Felkner I C Tetrasilver Tetraoxide as Disinfective Agent for Cryptosporidium
US20070138109A1 (en) * 2005-12-21 2007-06-21 Tufano Thomas P Oxidizing composition for salt water
US7442323B2 (en) * 2006-06-02 2008-10-28 E. I. Du Pont De Nemours And Company Potassium monopersulfate solutions
SG183744A1 (en) * 2007-08-20 2012-09-27 Advanced Tech Materials Composition and method for removing ion-implanted photoresist
KR20100133507A (ko) * 2008-05-01 2010-12-21 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 고밀도 주입된 레지스트의 제거를 위한 저 ｐｈ 혼합물
US20100252530A1 (en) * 2009-04-03 2010-10-07 E. I. Du Pont De Nemours And Company Etchant composition and method
TWI480360B (zh) * 2009-04-03 2015-04-11 杜邦股份有限公司 蝕刻劑組成物及方法
JP5340071B2 (ja) * 2009-08-03 2013-11-13 株式会社Ａｄｅｋａ 安定剤を含むペルオキシ一硫酸水溶液の製造方法
CN102260871A (zh) * 2011-06-24 2011-11-30 李沛泓 印刷线路板微蚀刻剂
EP2572776A1 (en) * 2011-09-21 2013-03-27 Evonik Degussa GmbH Device for mixing and cooling two reactive liquids and method of making peroxomonosulphuric acid with the device
EP2572781A1 (en) 2011-09-21 2013-03-27 Evonik Degussa GmbH Device and method for making a dilute aqueous solution of peroxomonosulphuric acid
CN110172349B (zh) * 2019-05-08 2020-11-20 厦门大学 一种氮化镓半导体光电化学刻蚀液及加工方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE106331C (https=)
US2500881A (en) * 1949-05-10 1950-03-14 Stader William Hanger support
BE579110A (https=) 1958-05-29
US3048546A (en) 1959-02-24 1962-08-07 Du Pont Bleaching compositions
US3041139A (en) * 1960-06-24 1962-06-26 Du Pont Method of preparing monopersulfate composition containing the triple salt khso4?k2so4?2khso5
ATE74879T1 (de) * 1983-12-30 1992-05-15 Du Pont Kaliummonopersulfat-zusammensetzungen und verfahren zu deren herstellung.
US4579725A (en) 1983-12-30 1986-04-01 E. I. Du Pont De Nemours And Company Potassium monopersulfate compositions and process for preparing them
DE3427119A1 (de) * 1984-07-23 1986-01-23 Peroxid-Chemie GmbH, 8023 Höllriegelskreuth Verfahren zur herstellung von kaliumpermonosulfat-tripelsalz
DE3914827C2 (de) 1989-05-05 1995-06-14 Schuelke & Mayr Gmbh Flüssiges Desinfektionsmittelkonzentrat
US5139763A (en) * 1991-03-06 1992-08-18 E. I. Du Pont De Nemours And Company Class of stable potassium monopersulfate compositions
DE19503900C1 (de) 1995-02-07 1995-11-23 Degussa Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶
DE69734868T2 (de) * 1996-07-25 2006-08-03 Dupont Air Products Nanomaterials L.L.C., Tempe Zusammensetzung und verfahren zum chemisch-mechanischen polieren
US5855805A (en) * 1996-08-08 1999-01-05 Fmc Corporation Microetching and cleaning of printed wiring boards
JP3094392B2 (ja) 1997-12-10 2000-10-03 株式会社荏原電産 エッチング液
US6200454B1 (en) 1997-12-24 2001-03-13 Mitsubishi Gas Chemical Company, Inc. Process for producing sodium persulfate
JP2000064067A (ja) * 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
US6255117B1 (en) 1999-06-04 2001-07-03 Lamotte Company Method and device for determining monopersulfate
JP3974305B2 (ja) * 1999-06-18 2007-09-12 エルジー フィリップス エルシーディー カンパニー リミテッド エッチング剤及びこれを用いた電子機器用基板の製造方法と電子機器

Also Published As

Publication number Publication date
US6818142B2 (en) 2004-11-16
KR20060013493A (ko) 2006-02-10
EP1608591A1 (en) 2005-12-28
KR101069113B1 (ko) 2011-09-30
TW200502159A (en) 2005-01-16
WO2004089817A1 (en) 2004-10-21
JP4745221B2 (ja) 2011-08-10
JP2006522003A (ja) 2006-09-28
MY138355A (en) 2009-05-29
US20040197261A1 (en) 2004-10-07
CN1768005A (zh) 2006-05-03
CA2517511A1 (en) 2004-10-21
CN1331736C (zh) 2007-08-15

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Legal Events

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