MY128233A - Adhesives and adhesive compositions containing thioether groups - Google Patents
Adhesives and adhesive compositions containing thioether groupsInfo
- Publication number
- MY128233A MY128233A MYPI20020656A MYPI20020656A MY128233A MY 128233 A MY128233 A MY 128233A MY PI20020656 A MYPI20020656 A MY PI20020656A MY PI20020656 A MYPI20020656 A MY PI20020656A MY 128233 A MY128233 A MY 128233A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesives
- compositions containing
- adhesive compositions
- thioether groups
- containing thioether
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title 2
- 125000000101 thioether group Chemical group 0.000 title 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910000510 noble metal Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract 1
- 239000004417 polycarbonate Substances 0.000 abstract 1
- 229920000515 polycarbonate Polymers 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000004926 polymethyl methacrylate Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/801,234 US6800371B2 (en) | 2001-03-07 | 2001-03-07 | Adhesives and adhesive compositions containing thioether groups |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY128233A true MY128233A (en) | 2007-01-31 |
Family
ID=25180543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20020656A MY128233A (en) | 2001-03-07 | 2002-02-26 | Adhesives and adhesive compositions containing thioether groups |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6800371B2 (https=) |
| EP (1) | EP1366130B1 (https=) |
| JP (1) | JP4481568B2 (https=) |
| KR (1) | KR100933964B1 (https=) |
| AT (1) | ATE301174T1 (https=) |
| DE (1) | DE60205342T2 (https=) |
| MX (1) | MXPA03007929A (https=) |
| MY (1) | MY128233A (https=) |
| WO (1) | WO2002072725A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050010003A1 (en) * | 2003-07-11 | 2005-01-13 | Prc-Desoto International, Inc. | Epoxy-capped polythioethers |
| US7622548B2 (en) * | 2003-07-11 | 2009-11-24 | Prc Desoto International, Inc. | Epoxy- or amine/hydroxy-capped polythioethers |
| US7183353B2 (en) * | 2004-04-29 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | UV curable coating composition |
| US20070236542A1 (en) * | 2006-03-29 | 2007-10-11 | Graham David C | Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads |
| KR101029908B1 (ko) * | 2006-05-05 | 2011-04-18 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 싸이오에터 작용성 올리고머성 폴리싸이올로부터 제조된 조성물 및 제품 |
| US8623989B1 (en) | 2006-05-05 | 2014-01-07 | PRC De Soto International, Inc. | Polyurea/polythiourea coatings |
| US7879955B2 (en) * | 2007-05-01 | 2011-02-01 | Rao Chandra B | Compositions including a polythioether |
| ES2690653T3 (es) * | 2008-06-16 | 2018-11-21 | 3M Innovative Properties Company | Composiciones curables reforzadas |
| WO2010082271A1 (ja) * | 2009-01-13 | 2010-07-22 | パナソニック株式会社 | 情報記録装置、情報再生装置及び情報記録媒体 |
| US20110014354A1 (en) * | 2009-07-20 | 2011-01-20 | David Christopher Graham | Adhesive compositions and methods for use in failure analysis |
| US20110318882A1 (en) | 2010-06-24 | 2011-12-29 | Xiaoming Wu | Method of restricting chip movement upon bonding to rigid substrate using spray coatable adhesive |
| JP5960524B2 (ja) * | 2012-07-03 | 2016-08-02 | 株式会社Adeka | 含硫黄エポキシ化合物、該化合物を含有する樹脂組成物、及び、該樹脂組成物を含有する接着剤 |
| JP2014012778A (ja) * | 2012-07-05 | 2014-01-23 | Adeka Corp | 樹脂組成物及びそれを含有してなる接着剤 |
| WO2015116059A1 (en) | 2014-01-29 | 2015-08-06 | Hewlett-Packard Development Company, L.P. | Fluid directing assembly |
| US10737220B2 (en) | 2015-07-01 | 2020-08-11 | 3M Innovative Properties Company | PVP- and/or PVL-containing composite membranes and methods of use |
| WO2017004496A1 (en) | 2015-07-01 | 2017-01-05 | 3M Innovative Properties Company | Polymeric ionomer separation membranes and methods of use |
| WO2017004495A1 (en) | 2015-07-01 | 2017-01-05 | 3M Innovative Properties Company | Composite membranes with improved performance and/or durability and methods of use |
| TWI572675B (zh) * | 2015-07-15 | 2017-03-01 | 臻鼎科技股份有限公司 | 聚醯亞胺組合物、聚醯亞胺膜及電路板 |
| CN107621752B (zh) * | 2016-07-13 | 2019-11-12 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
| CN111925741B (zh) * | 2016-10-28 | 2021-11-09 | 苏州太湖电工新材料股份有限公司 | 一种单面玻璃布补强少胶云母带及线棒 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE528443A (https=) | 1953-04-29 | |||
| NL7000025A (https=) | 1969-01-08 | 1970-07-10 | ||
| JPS55164254A (en) * | 1979-06-06 | 1980-12-20 | Dainippon Toryo Co Ltd | Modified epoxy coating composition |
| US4521490A (en) | 1983-08-11 | 1985-06-04 | Minnesota Mining And Manufacturing Co. | Two-part epoxy composition |
| US4816546A (en) | 1987-06-23 | 1989-03-28 | The Dow Chemical Company | Mixed epoxy resins comprising sulfide containing aliphatic epoxy resins |
| AU602822B2 (en) | 1988-10-05 | 1990-10-25 | National Starch & Chemical Corporation | Self fixturing structural adhesives |
| US5364914A (en) | 1988-10-05 | 1994-11-15 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
| US5225486A (en) * | 1989-08-31 | 1993-07-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
| JPH04175376A (ja) * | 1990-11-08 | 1992-06-23 | Nippon Oil & Fats Co Ltd | 熱硬化性組成物 |
| US5405731A (en) * | 1992-12-22 | 1995-04-11 | E. I. Du Pont De Nemours And Company | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
| JPH07179564A (ja) * | 1993-12-24 | 1995-07-18 | Nippon Steel Chem Co Ltd | 低粘度結晶性エポキシ樹脂の製造方法 |
| CN1085221C (zh) | 1995-06-06 | 2002-05-22 | 日本油脂株式会社 | 热固性组合物,涂覆方法和涂覆制品 |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| JP2000026828A (ja) * | 1998-07-13 | 2000-01-25 | Sekisui Chem Co Ltd | 接着剤組成物 |
| JP2000303053A (ja) * | 1999-04-23 | 2000-10-31 | Sekisui Chem Co Ltd | 接着剤組成物 |
| JP2000303052A (ja) * | 1999-04-23 | 2000-10-31 | Sekisui Chem Co Ltd | 接着剤組成物 |
| KR100372211B1 (ko) | 1999-06-17 | 2003-02-14 | 헨켈 록타이트 코오포레이션 | 조절가능하게 분해가능한 열경화성 수지 조성물, 상기 조성물을 사용하여 반도체 칩과 회로판 사이를 밀봉 언더필링하는 방법, 및 상기 조성물을 사용하여 제조한 전자 장치 |
-
2001
- 2001-03-07 US US09/801,234 patent/US6800371B2/en not_active Expired - Lifetime
-
2002
- 2002-02-05 DE DE2002605342 patent/DE60205342T2/de not_active Expired - Lifetime
- 2002-02-05 WO PCT/US2002/003471 patent/WO2002072725A1/en not_active Ceased
- 2002-02-05 KR KR1020037011642A patent/KR100933964B1/ko not_active Expired - Fee Related
- 2002-02-05 EP EP20020717397 patent/EP1366130B1/en not_active Expired - Lifetime
- 2002-02-05 JP JP2002571782A patent/JP4481568B2/ja not_active Expired - Lifetime
- 2002-02-05 AT AT02717397T patent/ATE301174T1/de not_active IP Right Cessation
- 2002-02-05 MX MXPA03007929A patent/MXPA03007929A/es active IP Right Grant
- 2002-02-26 MY MYPI20020656A patent/MY128233A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP1366130A1 (en) | 2003-12-03 |
| DE60205342D1 (de) | 2005-09-08 |
| US20030017341A1 (en) | 2003-01-23 |
| US6800371B2 (en) | 2004-10-05 |
| KR100933964B1 (ko) | 2009-12-28 |
| MXPA03007929A (es) | 2004-05-05 |
| KR20040030526A (ko) | 2004-04-09 |
| JP2004532299A (ja) | 2004-10-21 |
| WO2002072725A1 (en) | 2002-09-19 |
| ATE301174T1 (de) | 2005-08-15 |
| JP4481568B2 (ja) | 2010-06-16 |
| DE60205342T2 (de) | 2006-06-01 |
| EP1366130B1 (en) | 2005-08-03 |
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