MXPA05005356A - Metodo para soportar componentes electronicos y dispositivo electronico son soporte elastico para un componente electronico. - Google Patents
Metodo para soportar componentes electronicos y dispositivo electronico son soporte elastico para un componente electronico.Info
- Publication number
- MXPA05005356A MXPA05005356A MXPA05005356A MXPA05005356A MXPA05005356A MX PA05005356 A MXPA05005356 A MX PA05005356A MX PA05005356 A MXPA05005356 A MX PA05005356A MX PA05005356 A MXPA05005356 A MX PA05005356A MX PA05005356 A MXPA05005356 A MX PA05005356A
- Authority
- MX
- Mexico
- Prior art keywords
- circuit board
- printed circuit
- elastically compressible
- absorbing material
- electronic device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02388071A EP1422985B1 (en) | 2002-11-19 | 2002-11-19 | A method of supporting electronic components and an electronic device with elestic support for an electronic component |
US42837502P | 2002-11-22 | 2002-11-22 | |
PCT/EP2003/011458 WO2004047510A2 (en) | 2002-11-19 | 2003-10-14 | A method of supporting electronic components and an electronic device with elastic support for an electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA05005356A true MXPA05005356A (es) | 2005-08-26 |
Family
ID=32327865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA05005356A MXPA05005356A (es) | 2002-11-19 | 2003-10-14 | Metodo para soportar componentes electronicos y dispositivo electronico son soporte elastico para un componente electronico. |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5404667B2 (ru) |
KR (1) | KR20050085013A (ru) |
AU (1) | AU2003294695A1 (ru) |
BR (1) | BR0316301A (ru) |
MX (1) | MXPA05005356A (ru) |
RU (1) | RU2328841C2 (ru) |
WO (1) | WO2004047510A2 (ru) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102413323B1 (ko) | 2015-02-06 | 2022-06-27 | 엘지전자 주식회사 | 이동 단말기 |
WO2016144039A1 (en) | 2015-03-06 | 2016-09-15 | Samsung Electronics Co., Ltd. | Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof |
SE540653C2 (sv) | 2016-03-29 | 2018-10-09 | Atlas Copco Airpower Nv | Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget |
US10477737B2 (en) | 2016-05-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method of a hollow shielding structure for circuit elements |
US10477687B2 (en) | 2016-08-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method for EMI shielding structure |
KR102551657B1 (ko) | 2016-12-12 | 2023-07-06 | 삼성전자주식회사 | 전자파 차폐구조 및 그 제조방법 |
US10594020B2 (en) | 2017-07-19 | 2020-03-17 | Samsung Electronics Co., Ltd. | Electronic device having antenna element and method for manufacturing the same |
KR102373931B1 (ko) | 2017-09-08 | 2022-03-14 | 삼성전자주식회사 | 전자파 차폐구조 |
CN114900950A (zh) * | 2022-05-25 | 2022-08-12 | 广东江粉高科技产业园有限公司 | 一种抗弯折裂纹柔性线路板以及设计方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0340959B1 (en) * | 1988-05-06 | 1994-12-28 | Digital Equipment Corporation | Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips |
US5390083A (en) * | 1993-09-30 | 1995-02-14 | Honeywell Inc. | Apparatus and method for stiffening circuit card assemblies |
DE4428320A1 (de) * | 1994-08-10 | 1996-02-15 | Duerrwaechter E Dr Doduco | Kunststoffgehäuse mit einer schwingungsdämpfenden Lagerung eines bondbaren Elements |
FR2798553B1 (fr) * | 1999-09-14 | 2001-10-12 | Sagem | Dispositif de protection de composants electroniques |
JP2001177345A (ja) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | 圧電発振器 |
JP2001326492A (ja) * | 2000-05-17 | 2001-11-22 | Casio Comput Co Ltd | 熱および電磁ノイズ兼用対策部品、および電子機器 |
-
2003
- 2003-10-14 BR BR0316301-6A patent/BR0316301A/pt not_active Application Discontinuation
- 2003-10-14 KR KR1020057008826A patent/KR20050085013A/ko not_active Application Discontinuation
- 2003-10-14 RU RU2005119195/09A patent/RU2328841C2/ru not_active IP Right Cessation
- 2003-10-14 WO PCT/EP2003/011458 patent/WO2004047510A2/en active Application Filing
- 2003-10-14 MX MXPA05005356A patent/MXPA05005356A/es active IP Right Grant
- 2003-10-14 AU AU2003294695A patent/AU2003294695A1/en not_active Abandoned
-
2011
- 2011-02-01 JP JP2011020051A patent/JP5404667B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU2003294695A8 (en) | 2004-06-15 |
JP5404667B2 (ja) | 2014-02-05 |
RU2328841C2 (ru) | 2008-07-10 |
RU2005119195A (ru) | 2006-01-20 |
BR0316301A (pt) | 2005-09-27 |
AU2003294695A1 (en) | 2004-06-15 |
WO2004047510A2 (en) | 2004-06-03 |
KR20050085013A (ko) | 2005-08-29 |
JP2011124598A (ja) | 2011-06-23 |
WO2004047510A3 (en) | 2007-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |