MXPA03000412A - Metodo para manufacturar una tarjeta inteligente sin contacto utilizando papel de transferencia. - Google Patents

Metodo para manufacturar una tarjeta inteligente sin contacto utilizando papel de transferencia.

Info

Publication number
MXPA03000412A
MXPA03000412A MXPA03000412A MXPA03000412A MXPA03000412A MX PA03000412 A MXPA03000412 A MX PA03000412A MX PA03000412 A MXPA03000412 A MX PA03000412A MX PA03000412 A MXPA03000412 A MX PA03000412A MX PA03000412 A MXPA03000412 A MX PA03000412A
Authority
MX
Mexico
Prior art keywords
producing
transfer paper
chip card
contactless chip
contactless
Prior art date
Application number
MXPA03000412A
Other languages
English (en)
Inventor
Christophe Halope
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of MXPA03000412A publication Critical patent/MXPA03000412A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
MXPA03000412A 2001-05-16 2002-05-14 Metodo para manufacturar una tarjeta inteligente sin contacto utilizando papel de transferencia. MXPA03000412A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0106480A FR2824939B1 (fr) 2001-05-16 2001-05-16 Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede
PCT/FR2002/001625 WO2002093472A1 (fr) 2001-05-16 2002-05-14 Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert

Publications (1)

Publication Number Publication Date
MXPA03000412A true MXPA03000412A (es) 2003-10-15

Family

ID=8863369

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03000412A MXPA03000412A (es) 2001-05-16 2002-05-14 Metodo para manufacturar una tarjeta inteligente sin contacto utilizando papel de transferencia.

Country Status (13)

Country Link
US (2) US6908786B2 (es)
EP (1) EP1393248B1 (es)
JP (1) JP4289478B2 (es)
KR (1) KR100896953B1 (es)
CN (1) CN1301483C (es)
BR (1) BR0205348A (es)
CA (1) CA2413181C (es)
FR (1) FR2824939B1 (es)
HK (1) HK1061295A1 (es)
IL (1) IL153644A (es)
MX (1) MXPA03000412A (es)
TW (1) TWI238973B (es)
WO (1) WO2002093472A1 (es)

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JP2006209497A (ja) * 2005-01-28 2006-08-10 Seiko Epson Corp Ｒｆｉｄタグ、印刷用紙、プリンタ装置、ｒｆｉｄシステム
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
US8119458B2 (en) * 2005-02-01 2012-02-21 Nagraid S.A. Placement method of an electronic module on a substrate
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
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US7154283B1 (en) 2006-02-22 2006-12-26 Avery Dennison Corporation Method of determining performance of RFID devices
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US20090004467A1 (en) * 2006-04-05 2009-01-01 Assa Abloy Ab High durability contactless identification card
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US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
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US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
EP2235667B1 (en) 2008-01-23 2012-10-10 Smartrac IP B.V. Manufacture of a smart card
US20090266736A1 (en) * 2008-04-25 2009-10-29 Drug Plastics & Glass Company, Inc. Container having an identification device molded therein and method of making same
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
KR101038653B1 (ko) * 2009-03-27 2011-06-02 (주)이모트 Ｒｆ－ｉｄ 태그 제작 방법
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
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BR112012031767B8 (pt) 2010-06-14 2023-01-24 Avery Dennison Corp Método de fabricação de uma estrutura de antena, método de fabricação de um marcador de identificação de frequência de rádio e estrutura condutora para uso com um marcador de rfid
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
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Also Published As

Publication number Publication date
BR0205348A (pt) 2003-04-22
CA2413181C (fr) 2011-03-22
US6908786B2 (en) 2005-06-21
IL153644A0 (en) 2003-07-06
FR2824939A1 (fr) 2002-11-22
HK1061295A1 (en) 2004-09-10
CN1463410A (zh) 2003-12-24
IL153644A (en) 2007-09-20
EP1393248B1 (fr) 2012-11-21
FR2824939B1 (fr) 2003-10-10
CN1301483C (zh) 2007-02-21
US20030153120A1 (en) 2003-08-14
WO2002093472A1 (fr) 2002-11-21
TWI238973B (en) 2005-09-01
EP1393248A1 (fr) 2004-03-03
KR100896953B1 (ko) 2009-05-12
US20050230486A1 (en) 2005-10-20
US7271039B2 (en) 2007-09-18
JP4289478B2 (ja) 2009-07-01
JP2004520656A (ja) 2004-07-08
KR20030025270A (ko) 2003-03-28
CA2413181A1 (fr) 2002-11-21

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