JPS6413795A - Manufacture of circuit element - Google Patents
Manufacture of circuit elementInfo
- Publication number
- JPS6413795A JPS6413795A JP62170631A JP17063187A JPS6413795A JP S6413795 A JPS6413795 A JP S6413795A JP 62170631 A JP62170631 A JP 62170631A JP 17063187 A JP17063187 A JP 17063187A JP S6413795 A JPS6413795 A JP S6413795A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- onto
- adhesives
- heat
- resistant film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PURPOSE:To smooth-finish the surface of a circuit, and to improve sliding characteristics while easily forming the circuit even onto a curved surface by shaping the desired circuit onto a heat-resistant film, applying adhesives onto the circuit and to transfer the circuit onto the surface of an insulating substrate. CONSTITUTION:A material which resists the temperature of a circuit baking, which later, and has a low linear expansion coefficient, size of which is hardly changed and the surface of which has excellent smoothness, such as a polyimide group resin is used as a heat-resistant film, and the desired circuit is shaped by printing carbon resistance paste, etc., employing carbon group powder as a conductive component onto the heat-resistant film in uniform thickness through screen printing, etc. An epoxy.urethane resin, etc., are used as adhesives, and applied onto the circuit and transferred onto the surface of an insulating substrate. Transfer is performed in such a manner that adhesives are heated at a required temperature according to the performance of adhesives, and pressure is applied through a pressing method or a rolling method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62170631A JPS6413795A (en) | 1987-07-07 | 1987-07-07 | Manufacture of circuit element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62170631A JPS6413795A (en) | 1987-07-07 | 1987-07-07 | Manufacture of circuit element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413795A true JPS6413795A (en) | 1989-01-18 |
Family
ID=15908452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62170631A Pending JPS6413795A (en) | 1987-07-07 | 1987-07-07 | Manufacture of circuit element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413795A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004520656A (en) * | 2001-05-16 | 2004-07-08 | アエスカ エス．ア． | Method for manufacturing contactless chip card using transfer paper |
| JP2015207445A (en) * | 2014-04-21 | 2015-11-19 | コニカミノルタ株式会社 | Pattern formation method |
-
1987
- 1987-07-07 JP JP62170631A patent/JPS6413795A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004520656A (en) * | 2001-05-16 | 2004-07-08 | アエスカ エス．ア． | Method for manufacturing contactless chip card using transfer paper |
| JP2015207445A (en) * | 2014-04-21 | 2015-11-19 | コニカミノルタ株式会社 | Pattern formation method |
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