JP2000182913A - Method of forming surface edge electrode on substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming surface edge electrode capable of making a thick end surface electrode over three surfaces with a good pattern and with good accuracy by one printing and a solid composite part. SOLUTION: This method of forming an electrode includes a first step of forming an ink pattern layer 5 by screen-printing an conductive ink on an elastic body by using a metal plate 3 and a second step of pressing the edge portion of a substrate 6 on the pattern layer 5 on the elastic body to transfer the ink on the elastic body to the substrate 6 to form the pattern layer of the conductive ink on the edge portion of the substrate 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a substrate end face electrode of a solid composite component requiring an end face electrode and a solid composite component.

[0002]

2. Description of the Related Art In recent years, semiconductor LSIs and chip parts have been reduced in size and weight.
With the same method as in the related art, it becomes difficult to form an end surface electrode of the component.

In the method of forming the end face electrode, Japanese Patent Publication No. 6-20
No. 035 discloses a method of applying a conductive ink using an intaglio printing method. Also, Japanese Patent Application Laid-Open No. 9-2
As disclosed in Japanese Patent No. 46125, a method of bonding an electrode material layer to a substrate by using a thermal transfer film is introduced.

[0004]

In the conventional method as described above, when an electrode having a good pattern shape and high precision is formed on the end face of the substrate, the thickness of the electrode becomes small. When considering the plating process, it is desired that the thickness of the end face electrode be large, but when the film thickness is increased, the pattern is widened and collapsed when considering the pattern shape and accuracy, which has a problem. .

Also, in order to form an electrode with a sufficient thickness by wrapping around the three surfaces at the end of the component, it is necessary to perform printing three times, which increases the number of steps.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and a method for forming a substrate end surface electrode having a good pattern shape and accuracy, in which the thickness of the end surface electrode can be extended to three end surfaces by one printing. It is an object to provide a solid composite part.

[0007]

In order to solve the above-mentioned problems, the present invention provides a first step of printing a conductive ink on an elastic body by screen printing using a metal plate to form an ink pattern layer. A second step of pressing an edge of the substrate against the pattern layer on the elastic body to transfer the ink on the elastic body to the substrate, thereby forming a conductive ink pattern layer on the substrate end surface. This is a method for forming an electrode.

According to the above-described forming method, since the ink is printed on the elastic body by the metal plate, the solvent in the ink is appropriately absorbed, and a thick ink film having a large thickness and a good pattern shape and accuracy can be formed.

Then, in order to transfer from the elastic body to the substrate,
At the time of pressing, the elastic body is deformed along with the pressure, and the ink goes around from the end face of the substrate to the side face, so that the conductive ink layer can be accurately formed on three faces at a time. This results in a thick film and a uniform shape.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION
A first method in which a conductive ink is printed on an elastic body by screen printing using a metal plate to form an ink pattern layer
Forming a conductive ink pattern layer on the substrate edge by a process and a second step of transferring the ink on the elastic body to the substrate by pressing the pattern layer on the elastic body against the edge of the substrate. This is a method of forming a substrate end face electrode.

According to the above-described forming method, since the ink is printed on the elastic body by the metal plate, the solvent in the ink is appropriately absorbed, so that an ink layer having a large thickness and a good pattern shape and accuracy can be formed. Then, since the elastic body is transferred from the elastic body to the substrate, the elastic body is deformed along with the pressure when pressed, and the conductive ink layer can be accurately formed on three surfaces at a time because the ink goes around from the end surface of the substrate to the side surface. .
This results in a thick film and a uniform shape.

According to a second aspect of the present invention, there is provided the method for forming a substrate end face electrode according to the first aspect, wherein the metal plate used for screen printing has a thickness of 80 μm or more.

According to the above-mentioned forming method, a conductive ink pattern layer having a good pattern shape and a large film thickness can be formed by setting the printing film thickness to be constant.

According to a third aspect of the present invention, the viscosity of the ink used is 60000 to 90000c at 20 rpm.
2. The method for forming a substrate end face electrode according to claim 1, wherein the pressure is ps.

According to the above-described forming method, a large amount of ink can be transferred from the elastic body to the substrate uniformly by limiting the viscosity.

According to a fourth aspect of the present invention, there is provided the method of forming a substrate end face electrode according to the first aspect, wherein the substrate on which the ink is transferred is formed in a strip shape, and a plurality of transfers are performed at one time.

According to the above-mentioned forming method, by forming into a strip shape,
The end face electrodes of many parts can be formed at one time.

According to a fifth aspect of the present invention, an ink pattern layer is formed by printing a conductive ink on an elastic body by screen printing using a metal plate, and thereafter, a substrate layer is formed on the pattern layer on the elastic body. A solid composite component that is pressed against an edge to transfer the ink on the elastic body to the substrate, and that the substrate having the conductive ink pattern layer formed on the edge of the substrate is fired or cured.

The component formed by the above-mentioned forming method is a solid composite component having a thick end face electrode and a board end face electrode having good shape and accuracy.

An embodiment of the present invention will be described below with reference to FIGS. (Embodiment 1) Hereinafter, a method for forming a substrate end face electrode according to the present invention will be described with reference to the drawings.

FIG. 1A is a schematic view showing a step of printing silver ink on silicon rubber using a metal plate in a method of forming a substrate end face electrode according to an embodiment of the present invention. . (B) shows a schematic view of the silver ink on the silicon rubber and the ceramic substrate. (C) shows a schematic view of the step of pressing the ceramic substrate against the silver ink on the silicon rubber. (D) is a schematic view showing a step of transferring the silver ink on the silicon rubber to the ceramic substrate.

Hereinafter, the forming method will be described. A metal plate 3 having a plate thickness of 80 μm is placed on a silicon rubber 4, and a silver ink 2 having a viscosity of 206,000 rpm and 86,000 cps is printed using a squeegee 1. After printing, remove the metal plate 3,
The pattern layer 5 of the silver ink 2 is formed. Next, the ceramic substrate 6 is pressed against the pattern layer 5 of the silver ink 2. When the ceramic substrate 6 is separated from the silicon rubber 4 again, the silver ink pattern layer 5 is transferred to the end surface of the ceramic substrate 6.

Thus, in order to print the conductive ink on the elastic body by the metal plate, the solvent in the ink is appropriately absorbed by the silicon rubber, and the ink layer having a large thickness and a good pattern shape and accuracy is formed. Can be formed.

Then, in order to transfer from the elastic body to the substrate,
At the time of pressing, the elastic body is deformed along with the pressure, and the ink goes around from the end face of the substrate to the side face, so that the conductive ink layer can be accurately formed on three faces at a time. This results in a thick film and a uniform shape.

Further, since the metal plate used for screen printing has a thickness of 80 μm or more, a conductive ink pattern layer having a good pattern shape and a large film thickness can be formed by making the printing film thickness constant. Can be done.

The viscosity of the ink used is 20 rp.
Since m is 60000 to 90000 cps, it is possible to transfer a large amount of ink from the elastic body to the substrate uniformly.

From the above, it is possible to provide a method of forming a substrate end face electrode which is a uniform thick film and has a good pattern shape.

(Embodiment 2) A method for forming a solid composite component, which is an example of a method for forming an electronic component of the present invention, will be described below with reference to the drawings.

FIG. 2A is a schematic view showing a step of printing silver palladium ink on silicon rubber using a metal plate in the method of forming a substrate end face electrode according to one embodiment of the present invention. I have. (B) is a schematic view of a silver-palladium ink on the silicon rubber and a strip-shaped ceramic substrate. (C) shows a schematic view of a step of pressing a strip-shaped ceramic substrate against silver palladium ink on the silicon rubber. (D) is a schematic view of a step of transferring the silver palladium ink to a strip-shaped ceramic substrate.

The forming method will be described below. A metal plate 13 having a plate thickness of 120 μm is placed on the silicon rubber 14, and a silver palladium ink 12 having a viscosity of 64000 cps is printed using the squeegee 11. After printing, the metal plate 13 is removed, and the pattern layer 15 of the silver palladium ink 12 is formed. Next, the strip-shaped ceramic substrate 16 is pressed against the pattern layer 15 of the silver-palladium ink 12. When the strip-shaped ceramic substrate 16 is separated from the silicon rubber 14 again, the ink pattern layer 15 is transferred to the end face of the strip-shaped ceramic substrate 16. An end surface electrode is formed on the facing surface in the same process, and is fired at a firing temperature of 850 ° C. to be divided into individual pieces (not shown).

In this way, since the conductive ink is printed on the elastic body by the metal plate, the solvent in the ink is appropriately absorbed by the silicone rubber, so that an ink layer having a thick film thickness and a good pattern shape and accuracy can be formed. .

Then, in order to transfer from the elastic body to the substrate,
At the time of pressing, the elastic body is deformed along with the pressure, and the ink goes around from the end face of the substrate to the side face, so that the conductive ink layer can be accurately formed on three faces at a time. This results in a thick film and a uniform shape.

By forming the substrate on which the ink is to be transferred in a strip shape and performing a plurality of transfers at a time, it is possible to form the end face electrodes of many components at a time. Further, since the metal plate used for screen printing has a thickness of 80 μm or more, a conductive ink pattern layer having a good pattern shape and a large film thickness can be formed by setting the printing film thickness to a constant thickness.

The ink used has a viscosity of 20 rp.
Since m is 60000 to 90000 cps, it is possible to transfer a large amount of ink from the elastic body to the substrate uniformly.

From the above, a uniform and thick film thickness is obtained.
In addition, it is possible to provide a method of forming a substrate end face electrode which is an electrode having a good shape and a solid composite component.

In the above description, two embodiments have been described. However, the present invention can be similarly applied to a solid composite component that requires an electrode to be formed on an end face of a substrate. Further, in the present embodiment, the ink viscosity is 6400
0 cps, 86000 cps, but 20
In the case of 60,000 to 90000 cps at rpm, the same forming method is used. The metal plate thickness is 8
Although those having a thickness of 0 μm and 120 μm are used, the present invention can be similarly implemented if the plate thickness is 80 μm or more.

[0037]

As described above, according to the present invention, a first step of forming an ink pattern layer by printing a conductive ink on an elastic body by screen printing using a metal plate, and forming a pattern layer on the elastic body. A second step of pressing the end of the substrate against the substrate to transfer the ink on the elastic body to the substrate,
A method of forming a substrate end face electrode, wherein a pattern layer of a conductive ink is formed at the end of the substrate.

According to the above-described forming method, since the ink is printed on the elastic body by the metal plate, the solvent in the ink is appropriately absorbed, so that an ink layer having a large film thickness and a precise pattern shape can be formed.

Then, in order to transfer from the elastic body to the substrate,
At the time of pressing, the elastic body is deformed along with the pressure, and the ink goes around from the end face of the substrate to the side face, so that the conductive ink layer can be accurately formed on three faces at a time. As a result, it is possible to provide a method of forming a substrate end face electrode having a large thickness and a uniform shape, and a solid composite component.

[Brief description of the drawings]

FIG. 1A is a schematic view of a step of printing silver ink on silicon rubber using a metal plate in a method of forming a substrate end face electrode according to an embodiment of the present invention; Schematic diagram of silver ink and ceramic substrate (c) Schematic diagram of the step of pressing the ceramic substrate against the silver ink on the silicon rubber (d) Schematic diagram of the process of transferring the silver ink on the silicon rubber to the ceramic substrate

FIG. 2 (a) is a schematic view of a step of printing silver palladium ink on silicon rubber using a metal plate in the method of forming a substrate end face electrode according to one embodiment of the present invention; Schematic diagram of the silver-palladium ink and the strip-shaped ceramic substrate. (C) Schematic diagram of the process of pressing the strip-shaped ceramic substrate against the silver-palladium ink on the silicon rubber. (D) The silver-palladium ink was stripped. Schematic diagram of the process transferred to the ceramic substrate

[Explanation of symbols]

 Reference Signs List 1 squeegee 2 silver ink 3 metal plate 4 silicon rubber 5 ink pattern layer 6 ceramic substrate 11 squeegee 12 silver palladium ink 13 metal plate 14 silicon rubber 15 ink pattern layer 16 ceramic substrate

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Hashimoto 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E082 AA01 BC38 CC01 FG26 GG10 GG11 GG28 PP09 PP10

Claims (5)

[Claims] 1. A first step of printing a conductive ink on an elastic body by screen printing using a metal plate to form an ink pattern layer, and pressing the conductive ink against the pattern layer on the elastic body against an end of a substrate. A method of forming a substrate end face electrode, wherein a conductive ink pattern layer is formed at an end of the substrate by a second step of transferring the ink on the elastic body to the substrate. 2. The method according to claim 1, wherein the metal plate used for screen printing has a thickness of 80 μm or more. 3. The ink used has a viscosity of 6 at 20 rpm.
2. The method for forming a substrate end face electrode according to claim 1, wherein the thickness is 0000 to 90000 cps. 4. The method according to claim 1, wherein the substrate on which the ink is transferred is formed in a strip shape, and a plurality of transfers are performed at a time. 5. An ink pattern layer is formed by printing a conductive ink on an elastic body by screen printing using a metal plate, and then pressed against an end of a substrate against the pattern layer on the elastic body. A solid composite component that transfers the above ink to the substrate and performs a baking or curing process on the substrate on which the conductive ink pattern layer is formed at the edge of the substrate.