MX9303811A - Aparato para proporcionar aislamiento rfi/emi entre areas de circuito adyacentes en una tarjeta de circuitos sencilla. - Google Patents

Aparato para proporcionar aislamiento rfi/emi entre areas de circuito adyacentes en una tarjeta de circuitos sencilla.

Info

Publication number
MX9303811A
MX9303811A MX9303811A MX9303811A MX9303811A MX 9303811 A MX9303811 A MX 9303811A MX 9303811 A MX9303811 A MX 9303811A MX 9303811 A MX9303811 A MX 9303811A MX 9303811 A MX9303811 A MX 9303811A
Authority
MX
Mexico
Prior art keywords
circuit
circuit board
sensitive
area
adjacent
Prior art date
Application number
MX9303811A
Other languages
English (en)
Inventor
Gregory Alan Cantrell
Paul Vernon Marshall
David Leon Parks
Original Assignee
E Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E Systems Inc filed Critical E Systems Inc
Publication of MX9303811A publication Critical patent/MX9303811A/es

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06—Receivers
    • H04B1/10—Means associated with receiver for limiting or suppressing noise or interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/34—PCB in box or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Un área sensible de circuito en una tarjeta de circuito se aísla de un área no sensible de circuito localizada adyacente, rodeando el área sensible de circuito con planos de tierra interconectados eléctricamente colocados en lados opuestos de la tarjeta de circuito. El sistema de aislamiento incluye adicionalmente un casco hermetizado RF/IF 'concha de almeja' fijado a cada lado de la tarjeta de circuito abarcando el área sensible de circuito. Una junta parcialmente conductora se ubica entre la concha de almeja y las superficies superior e inferior de la tarjeta de circuito para mejorar el comportamiento aislante.
MX9303811A 1992-06-29 1993-06-24 Aparato para proporcionar aislamiento rfi/emi entre areas de circuito adyacentes en una tarjeta de circuitos sencilla. MX9303811A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/905,305 US5252782A (en) 1992-06-29 1992-06-29 Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board

Publications (1)

Publication Number Publication Date
MX9303811A true MX9303811A (es) 1994-01-31

Family

ID=25420608

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9303811A MX9303811A (es) 1992-06-29 1993-06-24 Aparato para proporcionar aislamiento rfi/emi entre areas de circuito adyacentes en una tarjeta de circuitos sencilla.

Country Status (9)

Country Link
US (1) US5252782A (es)
EP (1) EP0579346A1 (es)
JP (1) JPH0697692A (es)
KR (1) KR940001584A (es)
AU (1) AU4002093A (es)
CA (1) CA2097947A1 (es)
IL (1) IL106160A0 (es)
MX (1) MX9303811A (es)
NO (1) NO932362L (es)

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US5847938A (en) * 1996-12-20 1998-12-08 Ericsson Inc. Press-fit shields for electronic assemblies, and methods for assembling the same
DE19710514C2 (de) * 1997-03-13 2001-06-28 Itt Mfg Enterprises Inc Steckkarte für elektronische Geräte
USRE39272E1 (en) * 1997-03-26 2006-09-12 Siemens Aktiengesellschaft Controller for a motor vehicle
DE19712842C1 (de) * 1997-03-26 1998-08-13 Siemens Ag Steuergerät für ein Kraftfahrzeug
US6314000B1 (en) * 1998-08-27 2001-11-06 Lucent Technologies Inc. Enclosure for an RF assembly
US6201706B1 (en) * 1998-12-03 2001-03-13 Lambda Electronics, Inc. Power supply device with externally disconnectable “Y” capacitors
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US6175077B1 (en) 1999-02-09 2001-01-16 Ericsson Inc. Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same
US6088231A (en) * 1999-03-03 2000-07-11 Methode Electronics, Inc. RF and EMI shield
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US6271465B1 (en) * 1999-08-31 2001-08-07 Nokia Mobile Phones Limited Low cost conformal EMI/RFI shield
TW507476B (en) * 1999-11-09 2002-10-21 Gul Technologies Singapore Ltd Printed circuit boards with in-board shielded circuitry and method of producing the same
FI19992852A (fi) * 1999-12-31 2001-07-01 Nokia Mobile Phones Ltd Menetelmä ja sovitelma elektronisen laitteen EMC-suojauksen toteuttamiseksi sekä elektronisen laitteen piirilevy
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US6977819B2 (en) * 2001-09-21 2005-12-20 Motorola, Inc. Apparatus and method for electrically coupling a bezel
JP3964873B2 (ja) * 2001-11-09 2007-08-22 株式会社日立製作所 車載用ミリ波レーダ装置
US6980439B2 (en) * 2001-12-27 2005-12-27 Intel Corporation EMI shield for transceiver
US20050053008A1 (en) * 2002-03-04 2005-03-10 Griesing John Robert Wireless device isolation in a controlled RF test environment
US6724730B1 (en) 2002-03-04 2004-04-20 Azimuth Networks, Inc. Test system for simulating a wireless environment and method of using same
EP1345485A3 (de) * 2002-03-11 2006-04-19 Helmut Kahl Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich
US6949992B2 (en) * 2002-03-20 2005-09-27 Powerwave Technologies, Inc. System and method of providing highly isolated radio frequency interconnections
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
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FR2854759B1 (fr) * 2003-05-06 2005-07-08 Wavecom Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants
US7120398B2 (en) * 2003-09-18 2006-10-10 Kyocera Wireless Corp. Mobile communication devices having high frequency noise reduction and methods of making such devices
US6903910B1 (en) 2004-08-06 2005-06-07 Azijuth Networks, Inc. Shielded enclosure with user-installable interface modules
US7087835B2 (en) * 2004-10-19 2006-08-08 Bi-Link Metal Specialties Inc. Apparatus and method for shielding printed circuit boards
US7394029B2 (en) * 2005-08-29 2008-07-01 Matsushita Electric Industrial Co., Ltd. Module, method of manufacturing module, and electronic apparatus using module
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
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CN102918590B (zh) 2010-03-31 2014-12-10 韩国电子通信研究院 编码方法和装置、以及解码方法和装置
JP2012089767A (ja) * 2010-10-22 2012-05-10 Denso Corp プリント回路板の結露防止構造
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US9439307B2 (en) * 2014-02-06 2016-09-06 Tektronix, Inc. Laminated punched sheet metal electronic enclosure/shield with integrated gaskets
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US10938161B2 (en) * 2019-03-29 2021-03-02 Intel Corporation Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement
CN111447716A (zh) * 2020-04-23 2020-07-24 青岛亿联客信息技术有限公司 一种灯具及照明系统
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Also Published As

Publication number Publication date
EP0579346A1 (en) 1994-01-19
NO932362D0 (no) 1993-06-28
JPH0697692A (ja) 1994-04-08
AU4002093A (en) 1994-01-06
KR940001584A (ko) 1994-01-11
CA2097947A1 (en) 1993-12-30
IL106160A0 (en) 1993-10-20
US5252782A (en) 1993-10-12
NO932362L (no) 1993-12-30

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