NO932362L - Anordning for aa tilveiebringe isolasjon mellom hosliggende kretsomraader paa et enkelt kretskort - Google Patents
Anordning for aa tilveiebringe isolasjon mellom hosliggende kretsomraader paa et enkelt kretskortInfo
- Publication number
- NO932362L NO932362L NO932362A NO932362A NO932362L NO 932362 L NO932362 L NO 932362L NO 932362 A NO932362 A NO 932362A NO 932362 A NO932362 A NO 932362A NO 932362 L NO932362 L NO 932362L
- Authority
- NO
- Norway
- Prior art keywords
- circuit board
- providing isolation
- areas
- adjacent
- single circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/10—Means associated with receiver for limiting or suppressing noise or interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/34—PCB in box or housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/905,305 US5252782A (en) | 1992-06-29 | 1992-06-29 | Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
NO932362D0 NO932362D0 (no) | 1993-06-28 |
NO932362L true NO932362L (no) | 1993-12-30 |
Family
ID=25420608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO932362A NO932362L (no) | 1992-06-29 | 1993-06-28 | Anordning for aa tilveiebringe isolasjon mellom hosliggende kretsomraader paa et enkelt kretskort |
Country Status (9)
Country | Link |
---|---|
US (1) | US5252782A (no) |
EP (1) | EP0579346A1 (no) |
JP (1) | JPH0697692A (no) |
KR (1) | KR940001584A (no) |
AU (1) | AU4002093A (no) |
CA (1) | CA2097947A1 (no) |
IL (1) | IL106160A0 (no) |
MX (1) | MX9303811A (no) |
NO (1) | NO932362L (no) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5289347A (en) * | 1992-06-04 | 1994-02-22 | Digital Equipment Corporation | Enclosure for electronic modules |
DE9300868U1 (de) * | 1993-01-22 | 1994-05-26 | Siemens AG, 80333 München | Einstückiges Isolierteil, insbesondere Spritzgießteil |
CA2092371C (en) * | 1993-03-24 | 1999-06-29 | Boris L. Livshits | Integrated circuit packaging |
US5397857A (en) * | 1993-07-15 | 1995-03-14 | Dual Systems | PCMCIA standard memory card frame |
DE4340108C3 (de) * | 1993-11-22 | 2003-08-14 | Emi Tec Elektronische Material | Abschirmelement und Verfahren zu dessen Herstellung |
US5557063A (en) * | 1994-01-03 | 1996-09-17 | Lucent Technologies Inc. | Electronic component enclosure for RF shielding |
US5550324A (en) * | 1995-02-23 | 1996-08-27 | Fluke Corporation | Environmental sealing system for electronic instruments |
US6242690B1 (en) | 1995-09-25 | 2001-06-05 | Ericsson Inc. | Gasket system for EMI isolation |
US5825634A (en) * | 1995-12-22 | 1998-10-20 | Bfgoodrich Avionics Systems, Inc. | Circuit board having an EMI shielded area |
JP3235777B2 (ja) * | 1996-09-24 | 2001-12-04 | 株式会社三社電機製作所 | 電源装置 |
DE29617342U1 (de) * | 1996-10-05 | 1996-12-12 | Bodenseewerk Gerätetechnik GmbH, 88662 Überlingen | Mehrkanalsystem-Gehäuse |
US5847938A (en) * | 1996-12-20 | 1998-12-08 | Ericsson Inc. | Press-fit shields for electronic assemblies, and methods for assembling the same |
DE19710514C2 (de) * | 1997-03-13 | 2001-06-28 | Itt Mfg Enterprises Inc | Steckkarte für elektronische Geräte |
DE19712842C1 (de) * | 1997-03-26 | 1998-08-13 | Siemens Ag | Steuergerät für ein Kraftfahrzeug |
USRE39272E1 (en) * | 1997-03-26 | 2006-09-12 | Siemens Aktiengesellschaft | Controller for a motor vehicle |
US6314000B1 (en) * | 1998-08-27 | 2001-11-06 | Lucent Technologies Inc. | Enclosure for an RF assembly |
US6201706B1 (en) * | 1998-12-03 | 2001-03-13 | Lambda Electronics, Inc. | Power supply device with externally disconnectable “Y” capacitors |
TW379824U (en) * | 1998-12-28 | 2000-01-11 | Foxconn Prec Components Co Ltd | Heat radiating apparatus |
US6198630B1 (en) * | 1999-01-20 | 2001-03-06 | Hewlett-Packard Company | Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules |
JP3535758B2 (ja) * | 1999-01-27 | 2004-06-07 | シャープ株式会社 | 衛星放送受信用コンバータ |
US6175077B1 (en) | 1999-02-09 | 2001-01-16 | Ericsson Inc. | Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same |
US6088231A (en) * | 1999-03-03 | 2000-07-11 | Methode Electronics, Inc. | RF and EMI shield |
US20070137653A1 (en) * | 2000-03-13 | 2007-06-21 | Wood Thomas J | Ventilation interface for sleep apnea therapy |
GB2348320B (en) * | 1999-03-20 | 2003-10-29 | Nec Technologies | Intermediate frame for circuit boards |
US6269537B1 (en) | 1999-07-28 | 2001-08-07 | Methode Electronics, Inc. | Method of assembling a peripheral device printed circuit board package |
US6271465B1 (en) * | 1999-08-31 | 2001-08-07 | Nokia Mobile Phones Limited | Low cost conformal EMI/RFI shield |
TW507476B (en) * | 1999-11-09 | 2002-10-21 | Gul Technologies Singapore Ltd | Printed circuit boards with in-board shielded circuitry and method of producing the same |
FI19992852A (fi) * | 1999-12-31 | 2001-07-01 | Nokia Mobile Phones Ltd | Menetelmä ja sovitelma elektronisen laitteen EMC-suojauksen toteuttamiseksi sekä elektronisen laitteen piirilevy |
JP2002094689A (ja) * | 2000-06-07 | 2002-03-29 | Sony Computer Entertainment Inc | プログラム実行システム、プログラム実行装置、中継装置、および記録媒体 |
US6977819B2 (en) * | 2001-09-21 | 2005-12-20 | Motorola, Inc. | Apparatus and method for electrically coupling a bezel |
WO2003040754A1 (fr) * | 2001-11-09 | 2003-05-15 | Hitachi, Ltd. | Radar mobile a onde millimetrique |
US6980439B2 (en) * | 2001-12-27 | 2005-12-27 | Intel Corporation | EMI shield for transceiver |
US20050053008A1 (en) * | 2002-03-04 | 2005-03-10 | Griesing John Robert | Wireless device isolation in a controlled RF test environment |
US6724730B1 (en) | 2002-03-04 | 2004-04-20 | Azimuth Networks, Inc. | Test system for simulating a wireless environment and method of using same |
US20040057198A1 (en) * | 2002-03-11 | 2004-03-25 | Helmut Kahl | Device housing comprising an electromagnetically shielded region |
US6949992B2 (en) * | 2002-03-20 | 2005-09-27 | Powerwave Technologies, Inc. | System and method of providing highly isolated radio frequency interconnections |
US7005573B2 (en) | 2003-02-13 | 2006-02-28 | Parker-Hannifin Corporation | Composite EMI shield |
US7326862B2 (en) * | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
WO2004077906A1 (en) * | 2003-02-28 | 2004-09-10 | Wireless Lan Systems Oy | A circuit board and arrangement for minimizing thermal and electromagnetic effects |
FR2854759B1 (fr) * | 2003-05-06 | 2005-07-08 | Wavecom | Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants |
US7120398B2 (en) * | 2003-09-18 | 2006-10-10 | Kyocera Wireless Corp. | Mobile communication devices having high frequency noise reduction and methods of making such devices |
US6903910B1 (en) | 2004-08-06 | 2005-06-07 | Azijuth Networks, Inc. | Shielded enclosure with user-installable interface modules |
US7087835B2 (en) * | 2004-10-19 | 2006-08-08 | Bi-Link Metal Specialties Inc. | Apparatus and method for shielding printed circuit boards |
US7394029B2 (en) * | 2005-08-29 | 2008-07-01 | Matsushita Electric Industrial Co., Ltd. | Module, method of manufacturing module, and electronic apparatus using module |
CN1972587B (zh) * | 2005-11-25 | 2011-11-16 | 深圳富泰宏精密工业有限公司 | 电子装置的屏蔽构件及壳体组件 |
US7355857B2 (en) * | 2006-02-07 | 2008-04-08 | Methode Electronics, Inc. | Heat sink gasket |
US7518880B1 (en) | 2006-02-08 | 2009-04-14 | Bi-Link | Shielding arrangement for electronic device |
JP2008091552A (ja) * | 2006-09-29 | 2008-04-17 | Fujitsu Ltd | プリント配線板およびプリント基板ユニット並びに電子機器 |
US7504592B1 (en) * | 2007-08-31 | 2009-03-17 | Laird Technologies, Inc. | Electromagnetic interference shields and related manufacturing methods |
US8169786B2 (en) * | 2008-05-16 | 2012-05-01 | Psion Teklogix Inc. | Ruggedized housing and components for a handled device |
US20100257732A1 (en) * | 2009-04-14 | 2010-10-14 | Ziberna Frank J | Shielding Arrangement for Electronic Device |
US8406007B1 (en) | 2009-12-09 | 2013-03-26 | Universal Lighting Technologies, Inc. | Magnetic circuit board connector component |
EP2555186A4 (en) | 2010-03-31 | 2014-04-16 | Korea Electronics Telecomm | CODING METHOD AND DEVICE AND DECODING METHOD AND DEVICE |
JP2012089767A (ja) * | 2010-10-22 | 2012-05-10 | Denso Corp | プリント回路板の結露防止構造 |
DE102010063245A1 (de) * | 2010-12-16 | 2012-06-21 | Semikron Elektronik Gmbh & Co. Kg | Leiterplatte mit Schirmung |
US9535463B2 (en) * | 2013-10-14 | 2017-01-03 | Getac Technology Corporation | Circuit board assembling structure, electronic device having the same and assembling method of electronic device |
US9439307B2 (en) * | 2014-02-06 | 2016-09-06 | Tektronix, Inc. | Laminated punched sheet metal electronic enclosure/shield with integrated gaskets |
US11300697B2 (en) | 2016-09-27 | 2022-04-12 | Inova Ltd. | Modified baseplate for sandy soil |
US10433468B2 (en) * | 2017-08-04 | 2019-10-01 | Associated Universities, Inc. | Highly RFI shielded modular electronics packaging system |
US10938161B2 (en) * | 2019-03-29 | 2021-03-02 | Intel Corporation | Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement |
CN111447716A (zh) * | 2020-04-23 | 2020-07-24 | 青岛亿联客信息技术有限公司 | 一种灯具及照明系统 |
US11832391B2 (en) * | 2020-09-30 | 2023-11-28 | Qualcomm Incorporated | Terminal connection routing and method the same |
CN115996535B (zh) * | 2023-03-23 | 2023-08-08 | 成都雷电微力科技股份有限公司 | 一种Ka频段功放架构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801489A (en) * | 1986-03-13 | 1989-01-31 | Nintendo Co., Ltd. | Printed circuit board capable of preventing electromagnetic interference |
US4658334A (en) * | 1986-03-19 | 1987-04-14 | Rca Corporation | RF signal shielding enclosure of electronic systems |
JPH0627995Y2 (ja) * | 1986-03-20 | 1994-07-27 | 株式会社東芝 | シ−ルド構造 |
JPS6427298A (en) * | 1987-07-23 | 1989-01-30 | Uniden Kk | Shielding structure for circuit device on substrate |
JP2612339B2 (ja) * | 1989-04-18 | 1997-05-21 | 三菱電機株式会社 | 電子機器筐体 |
US5014160A (en) * | 1989-07-05 | 1991-05-07 | Digital Equipment Corporation | EMI/RFI shielding method and apparatus |
US5107404A (en) * | 1989-09-14 | 1992-04-21 | Astec International Ltd. | Circuit board assembly for a cellular telephone system or the like |
GB2237147A (en) * | 1989-10-13 | 1991-04-24 | Electricity Council | Printed circuit board arrangement. |
-
1992
- 1992-06-29 US US07/905,305 patent/US5252782A/en not_active Expired - Lifetime
-
1993
- 1993-06-03 AU AU40020/93A patent/AU4002093A/en not_active Abandoned
- 1993-06-08 CA CA002097947A patent/CA2097947A1/en not_active Abandoned
- 1993-06-15 KR KR1019930010849A patent/KR940001584A/ko not_active Application Discontinuation
- 1993-06-21 EP EP93250182A patent/EP0579346A1/en not_active Withdrawn
- 1993-06-24 MX MX9303811A patent/MX9303811A/es unknown
- 1993-06-25 JP JP5177660A patent/JPH0697692A/ja active Pending
- 1993-06-28 NO NO932362A patent/NO932362L/no unknown
- 1993-06-28 IL IL106160A patent/IL106160A0/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NO932362D0 (no) | 1993-06-28 |
CA2097947A1 (en) | 1993-12-30 |
EP0579346A1 (en) | 1994-01-19 |
US5252782A (en) | 1993-10-12 |
JPH0697692A (ja) | 1994-04-08 |
IL106160A0 (en) | 1993-10-20 |
MX9303811A (es) | 1994-01-31 |
AU4002093A (en) | 1994-01-06 |
KR940001584A (ko) | 1994-01-11 |
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