DE69300234D1 - Lötmittelauflege auf einer Leiterplatte. - Google Patents

Lötmittelauflege auf einer Leiterplatte.

Info

Publication number
DE69300234D1
DE69300234D1 DE69300234T DE69300234T DE69300234D1 DE 69300234 D1 DE69300234 D1 DE 69300234D1 DE 69300234 T DE69300234 T DE 69300234T DE 69300234 T DE69300234 T DE 69300234T DE 69300234 D1 DE69300234 D1 DE 69300234D1
Authority
DE
Germany
Prior art keywords
circuit board
solder application
solder
application
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69300234T
Other languages
English (en)
Other versions
DE69300234T2 (de
Inventor
Peter Michael Banks
William M Morgan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69300234D1 publication Critical patent/DE69300234D1/de
Application granted granted Critical
Publication of DE69300234T2 publication Critical patent/DE69300234T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1554—Rotating or turning the PCB in a continuous manner
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
DE69300234T 1992-03-18 1993-03-03 Lötmittelauflege auf einer Leiterplatte. Expired - Fee Related DE69300234T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9205832A GB2265325A (en) 1992-03-18 1992-03-18 Solder application to a circuit board
US08/024,991 US5520967A (en) 1992-03-18 1993-03-02 Solder application to a circuit board

Publications (2)

Publication Number Publication Date
DE69300234D1 true DE69300234D1 (de) 1995-08-10
DE69300234T2 DE69300234T2 (de) 1996-02-29

Family

ID=26300549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69300234T Expired - Fee Related DE69300234T2 (de) 1992-03-18 1993-03-03 Lötmittelauflege auf einer Leiterplatte.

Country Status (5)

Country Link
US (4) US5520967A (de)
EP (1) EP0561527B1 (de)
JP (1) JPH0790360B2 (de)
DE (1) DE69300234T2 (de)
GB (1) GB2265325A (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611480A (en) * 1992-03-03 1997-03-18 Pillarhouse International Limited Soldering process
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5782400A (en) * 1996-06-28 1998-07-21 Susco Manufacturing Co., Inc. Substrate carrier for a soldering machine
JP3028791B2 (ja) * 1997-08-06 2000-04-04 日本電気株式会社 チップ部品の実装方法
JPH11151572A (ja) * 1997-11-17 1999-06-08 Tamagawa Seiki Co Ltd ハンダ付け方法及び装置
US6315189B1 (en) * 1998-10-13 2001-11-13 Texas Instruments Incorporated Semiconductor package lead plating method and apparatus
US20030018243A1 (en) * 1999-07-07 2003-01-23 Gerhardt Thomas J. Selectively plated sensor
US7918383B2 (en) * 2004-09-01 2011-04-05 Micron Technology, Inc. Methods for placing substrates in contact with molten solder
DE102009000892A1 (de) 2008-11-25 2010-06-17 Slv Halle Gmbh Verfahren zur Schichtapplikation folienförmiger Lotwerkstoffe mittels Ultraschallschweißen

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3416958A (en) * 1966-02-25 1968-12-17 Lear Siegler Inc Alloy coating for electrical conductors
US3661638A (en) * 1970-05-26 1972-05-09 Photocircuits Corp Process for uniformly coating printed circuit board through holes
DE2228218B1 (de) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum tauchloeten von traegerplaettchen
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
US3945618A (en) * 1974-08-01 1976-03-23 Branson Ultrasonics Corporation Sonic apparatus
US4592944A (en) * 1982-05-24 1986-06-03 International Business Machines Corporation Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
US4637541A (en) * 1985-06-28 1987-01-20 Unit Industries, Inc. Circuit board soldering device
JPS635867A (ja) * 1986-06-25 1988-01-11 Matsushita Electric Works Ltd 自動半田付装置
JPH07112041B2 (ja) * 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
JPS63165066A (ja) * 1986-12-25 1988-07-08 Nec Corp 自動はんだ付装置
JPH01135165U (de) * 1988-03-01 1989-09-14
JPH0614351Y2 (ja) * 1989-06-01 1994-04-13 朝日電装株式会社 シフトスイッチ
JP2554542Y2 (ja) * 1992-02-17 1997-11-17 台灣杜邦股▲ふん▼有限公司 プリント回路基板
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5313021A (en) * 1992-09-18 1994-05-17 Aptix Corporation Circuit board for high pin count surface mount pin grid arrays
KR950001962A (ko) * 1993-06-30 1995-01-04 김광호 반도체 칩 범프

Also Published As

Publication number Publication date
EP0561527A1 (de) 1993-09-22
JPH0790360B2 (ja) 1995-10-04
EP0561527B1 (de) 1995-07-05
US5637149A (en) 1997-06-10
GB9205832D0 (en) 1992-04-29
DE69300234T2 (de) 1996-02-29
US5637833A (en) 1997-06-10
US5520967A (en) 1996-05-28
GB2265325A (en) 1993-09-29
JPH0679448A (ja) 1994-03-22
US5683743A (en) 1997-11-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee