MX2023008627A - Unidad de refrigeración por inmersión para refrigerar componentes electrónicos y procedimiento de uso de la misma. - Google Patents

Unidad de refrigeración por inmersión para refrigerar componentes electrónicos y procedimiento de uso de la misma.

Info

Publication number
MX2023008627A
MX2023008627A MX2023008627A MX2023008627A MX2023008627A MX 2023008627 A MX2023008627 A MX 2023008627A MX 2023008627 A MX2023008627 A MX 2023008627A MX 2023008627 A MX2023008627 A MX 2023008627A MX 2023008627 A MX2023008627 A MX 2023008627A
Authority
MX
Mexico
Prior art keywords
cooling
cooling channel
electronic components
coolant
channel wall
Prior art date
Application number
MX2023008627A
Other languages
English (en)
Inventor
Hanxleden Houwert Vincent Daniël Van
Original Assignee
Stem Tech | Ixora Holding B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL2027361A external-priority patent/NL2027361B9/en
Application filed by Stem Tech | Ixora Holding B V filed Critical Stem Tech | Ixora Holding B V
Publication of MX2023008627A publication Critical patent/MX2023008627A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

La presente invención se refiere a una unidad de refrigeración por inmersión, para refrigerar componentes electrónicos, que comprende al menos un canal de calentamiento cerrado, definido por al menos una pared de canal circunferencial de calentamiento que tiene un inicio y un final, que aloja una o más placas de circuito impreso, en la que se proporcionan uno o más componentes electrónicos disipadores de calor en cada placa de circuito impreso, al menos un canal de refrigeración cerrado, definido por al menos una pared de canal circunferencial de refrigeración, en la que un inicio del canal de refrigeración está conectado a un extremo del canal de calentamiento, y en el que un extremo del canal de refrigeración está conectado al inicio del canal de calentamiento de manera que se forma un circuito cerrado entre los canales, un refrigerante líquido, para refrigerar los componentes electrónicos, llenando dicho refrigerante al menos los canales y sumergiendo la placa de circuito impreso, en la que los canales permiten cada uno un flujo de refrigerante que tiene al menos un componente vertical en el que al menos una porción de la pared del canal de refrigeración está formada por un material conductor del calor, permitiendo dicha porción un intercambio de calor entre una parte del refrigerante en contacto con un lado interior de dicha porción de pared del canal de refrigeración y un entorno en contacto con un lado exterior de dicha porción de pared del canal de refrigeración. La invención se refiere además a una unidad de refrigeración y un soporte, y a un procedimiento de uso de la unidad de refrigeración.
MX2023008627A 2021-01-21 2022-01-20 Unidad de refrigeración por inmersión para refrigerar componentes electrónicos y procedimiento de uso de la misma. MX2023008627A (es)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
NL2027361A NL2027361B9 (en) 2021-01-21 2021-01-21 Immersive cooling unit for cooling electronic components and method of using the same
NL2028314 2021-05-27
NL2029151 2021-09-08
NL2029988 2021-12-01
NL2030162 2021-12-16
PCT/NL2022/050025 WO2022158975A1 (en) 2021-01-21 2022-01-20 Immersive cooling unit for cooling electronic components and method of using the same

Publications (1)

Publication Number Publication Date
MX2023008627A true MX2023008627A (es) 2023-10-25

Family

ID=80001292

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023008627A MX2023008627A (es) 2021-01-21 2022-01-20 Unidad de refrigeración por inmersión para refrigerar componentes electrónicos y procedimiento de uso de la misma.

Country Status (8)

Country Link
US (1) US20240130074A1 (es)
EP (1) EP4282235A1 (es)
JP (1) JP2024504702A (es)
KR (1) KR20230131890A (es)
AU (1) AU2022209683A1 (es)
CA (1) CA3205578A1 (es)
MX (1) MX2023008627A (es)
WO (1) WO2022158975A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI817651B (zh) * 2022-08-15 2023-10-01 技鋼科技股份有限公司 散熱系統

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR860000253B1 (ko) * 1981-04-07 1986-03-21 카다야마 히도하지로 비등 냉각장치(沸騰冷却裝置)
GB9215442D0 (en) * 1992-07-21 1992-09-02 British Aerospace Cooling of electronic components
US20070034360A1 (en) * 2005-06-08 2007-02-15 Hall Jack P High performance cooling assembly for electronics
DE102007013906B4 (de) * 2007-03-22 2009-12-10 Airbus Deutschland Gmbh Kühlanordnung für elektronische Bauteile sowie damit ausgestatteter Elektronikschrank
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
EP2487327B1 (en) * 2011-02-09 2015-10-14 Siemens Aktiengesellschaft Subsea electronic system
JP2015534164A (ja) * 2012-09-07 2015-11-26 スミス，ディビッド 地熱地下環境内に設置される電子冷却装置及び方法
US8947873B2 (en) * 2012-11-26 2015-02-03 International Business Machines Corporation Immersion-cooled and conduction-cooled electronic system
EP2803813B1 (en) * 2013-05-16 2019-02-27 ABB Schweiz AG A subsea unit with conduction and convection cooling
US9516792B2 (en) * 2015-03-25 2016-12-06 Intel Corporation Ultrasound assisted immersion cooling
US20170094842A1 (en) * 2015-09-28 2017-03-30 Infineon Technologies Austria Ag Power Supply and Method
NL2015841B1 (en) 2015-11-23 2017-06-07 Aecorsis B V A device comprising heat producing components with liquid submersion cooling.
EP3177125B1 (en) * 2015-12-01 2019-12-11 Aselsan Elektronik Sanayi ve Ticaret Anonim Sirketi A hybrid cooling device
JP6651967B2 (ja) * 2016-04-19 2020-02-19 富士通株式会社 液冷サーバ
JP2020106949A (ja) * 2018-12-26 2020-07-09 富士通株式会社 電子機器、及び電子機器の筐体ユニット
JP7295381B2 (ja) * 2019-02-14 2023-06-21 富士通株式会社 冷却装置、冷却システム及び冷却方法
CN111615291B (zh) * 2019-02-25 2023-04-11 富联精密电子(天津)有限公司 浸没式冷却装置

Also Published As

Publication number Publication date
EP4282235A1 (en) 2023-11-29
US20240130074A1 (en) 2024-04-18
WO2022158975A9 (en) 2022-08-25
KR20230131890A (ko) 2023-09-14
AU2022209683A1 (en) 2023-08-03
JP2024504702A (ja) 2024-02-01
CA3205578A1 (en) 2022-07-28
WO2022158975A1 (en) 2022-07-28

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