MX2021003176A - Plataforma de enfriamiento por inmersion liquida. - Google Patents

Plataforma de enfriamiento por inmersion liquida.

Info

Publication number
MX2021003176A
MX2021003176A MX2021003176A MX2021003176A MX2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A
Authority
MX
Mexico
Prior art keywords
pressure
liquid phase
dielectric fluid
immersion cooling
liquid immersion
Prior art date
Application number
MX2021003176A
Other languages
English (en)
Spanish (es)
Inventor
John David Enright
Jacob Mertel
Original Assignee
Tmgcore Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/283,181 external-priority patent/US10477726B1/en
Priority claimed from US16/576,191 external-priority patent/US11129298B2/en
Priority claimed from US16/576,363 external-priority patent/US10969842B2/en
Priority claimed from US16/576,239 external-priority patent/US10624237B2/en
Priority claimed from US16/576,309 external-priority patent/US10694643B2/en
Priority claimed from US16/576,285 external-priority patent/US10617032B1/en
Priority claimed from PCT/US2019/051924 external-priority patent/WO2020061305A1/fr
Priority claimed from US16/576,405 external-priority patent/US10653043B2/en
Application filed by Tmgcore Llc filed Critical Tmgcore Llc
Publication of MX2021003176A publication Critical patent/MX2021003176A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
MX2021003176A 2018-11-16 2019-11-11 Plataforma de enfriamiento por inmersion liquida. MX2021003176A (es)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US201862768633P 2018-11-16 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US201962815682P 2019-03-08 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US201962897457P 2019-09-09 2019-09-09
US16/576,191 US11129298B2 (en) 2018-09-19 2019-09-19 Process for liquid immersion cooling
US16/576,363 US10969842B2 (en) 2018-09-19 2019-09-19 Chassis for a liquid immersion cooling system
US16/576,239 US10624237B2 (en) 2018-09-19 2019-09-19 Liquid immersion cooling vessel and components thereof
US16/576,309 US10694643B2 (en) 2018-09-19 2019-09-19 Ballast blocks for a liquid immersion cooling system
US16/576,285 US10617032B1 (en) 2018-09-19 2019-09-19 Robot for a liquid immersion cooling system
PCT/US2019/051924 WO2020061305A1 (fr) 2018-09-19 2019-09-19 Plate-forme de refroidissement par immersion dans un liquide
US16/576,405 US10653043B2 (en) 2018-09-19 2019-09-19 Vapor management system for a liquid immersion cooling system
PCT/US2019/060759 WO2020102090A1 (fr) 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide

Publications (1)

Publication Number Publication Date
MX2021003176A true MX2021003176A (es) 2021-08-11

Family

ID=70732132

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021003176A MX2021003176A (es) 2018-11-16 2019-11-11 Plataforma de enfriamiento por inmersion liquida.

Country Status (8)

Country Link
EP (1) EP3881658A4 (fr)
JP (1) JP2022504024A (fr)
KR (1) KR20210119384A (fr)
CN (1) CN113647204A (fr)
AU (1) AU2019378713A1 (fr)
CA (2) CA3128868A1 (fr)
MX (1) MX2021003176A (fr)
WO (1) WO2020102090A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11357131B1 (en) * 2021-08-03 2022-06-07 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
CN111921468A (zh) * 2020-08-05 2020-11-13 重庆大学 一种新材料合成智能均相反应釜系统及控制方法
EP4313362A1 (fr) 2021-03-22 2024-02-07 TMGcore, LLC Procédés et systèmes de surveillance de matériaux filtrants
EP4068921A1 (fr) * 2021-04-01 2022-10-05 Ovh Systèmes de refroidissement par immersion pour composants électroniques
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
CA3151725A1 (fr) 2021-04-01 2022-10-01 Ovh Systeme de refroidissement par immersion avec double circulation de liquide de refroidissement dielectrique
TW202303067A (zh) * 2021-06-10 2023-01-16 美商Ｔｍｇ科爾有限責任公司 液體浸入式冷卻平台及其部件
US20230080447A1 (en) * 2021-09-15 2023-03-16 Tmgcore, Inc. Liquid immersion cooling platform and components thereof
TWI803982B (zh) * 2021-09-17 2023-06-01 英業達股份有限公司 冷卻系統及其操作方法
WO2024089552A1 (fr) * 2022-10-25 2024-05-02 3M Innovative Properties Company Traversée de fibre optique pour refroidissement par immersion avec prévention de condensat

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3952182A (en) * 1974-01-25 1976-04-20 Flanders Robert D Instantaneous electric fluid heater
US7128142B2 (en) * 2004-08-24 2006-10-31 Halliburton Energy Services, Inc. Apparatus and methods for improved fluid displacement in subterranean formations
WO2006075493A1 (fr) * 2004-12-22 2006-07-20 Tokyo University Of Science Educational Foundation Administrative Organization Procede et appareil de refroidissement de vapeur, structure de passage d'ecoulement et application associee
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
WO2010050933A1 (fr) * 2008-10-29 2010-05-06 Advantest Corporation Régulateur thermique pour dispositifs électroniques
NL2005207A (en) 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US8184436B2 (en) * 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US20140211412A1 (en) * 2011-08-05 2014-07-31 Green Revolution Cooling, Inc. Hard drive cooling for fluid submersion cooling systems
US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
US9335802B2 (en) * 2013-02-01 2016-05-10 Dell Products, L.P. System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid
US9921622B2 (en) * 2013-02-01 2018-03-20 Dell Products, L.P. Stand alone immersion tank data center with contained cooling
EP2994809B1 (fr) * 2013-05-06 2019-08-28 Green Revolution Cooling, Inc. Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu
DE102014102720B4 (de) * 2014-02-28 2017-03-23 Ushio Denki Kabushiki Kaisha Anordnung zum Kühlen einer plasmabasierten Strahlungsquelle mit einer metallischen Kühlflüssigkeit und Verfahren zur Inbetriebnahme einer solchen Kühlanordnung
CN105762437B (zh) * 2014-12-17 2019-04-02 北京长城华冠汽车科技股份有限公司 浸液式电池箱温度控制系统
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
US10405459B2 (en) * 2016-08-04 2019-09-03 Hamilton Sundstrand Corporation Actuated immersion cooled electronic assemblies
JP2017050548A (ja) * 2016-10-13 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
US10605477B2 (en) * 2017-01-20 2020-03-31 Johnson Controls Technology Company HVAC system with free cooling optimization based on coolant flowrate
US11462786B2 (en) * 2017-03-09 2022-10-04 Zuta-Car Ltd. Systems and methods for thermal regulation
CN107564593B (zh) * 2017-08-09 2019-06-18 华北电力大学 一种压力容器外部冷却试验系统和方法

Also Published As

Publication number Publication date
CA3113668A1 (fr) 2020-05-22
KR20210119384A (ko) 2021-10-05
JP2022504024A (ja) 2022-01-13
EP3881658A4 (fr) 2022-09-14
CA3128868A1 (fr) 2020-05-22
CN113647204A (zh) 2021-11-12
EP3881658A1 (fr) 2021-09-22
AU2019378713A1 (en) 2021-06-03
WO2020102090A1 (fr) 2020-05-22

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