CA3113668A1 - Plate-forme de refroidissement par immersion dans un liquide - Google Patents

Plate-forme de refroidissement par immersion dans un liquide

Info

Publication number
CA3113668A1
CA3113668A1 CA3113668A CA3113668A CA3113668A1 CA 3113668 A1 CA3113668 A1 CA 3113668A1 CA 3113668 A CA3113668 A CA 3113668A CA 3113668 A CA3113668 A CA 3113668A CA 3113668 A1 CA3113668 A1 CA 3113668A1
Authority
CA
Canada
Prior art keywords
pressure
liquid phase
dielectric fluid
immersion cooling
liquid immersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3113668A
Other languages
English (en)
Inventor
John David Enright
Jacob Mertel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TMGcore Inc
Original Assignee
TMGcore Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/283,181 external-priority patent/US10477726B1/en
Priority claimed from US16/576,363 external-priority patent/US10969842B2/en
Priority claimed from US16/576,239 external-priority patent/US10624237B2/en
Priority claimed from US16/576,309 external-priority patent/US10694643B2/en
Priority claimed from PCT/US2019/051924 external-priority patent/WO2020061305A1/fr
Priority claimed from US16/576,285 external-priority patent/US10617032B1/en
Priority claimed from US16/576,405 external-priority patent/US10653043B2/en
Priority claimed from US16/576,191 external-priority patent/US11129298B2/en
Application filed by TMGcore Inc filed Critical TMGcore Inc
Publication of CA3113668A1 publication Critical patent/CA3113668A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
CA3113668A 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide Pending CA3113668A1 (fr)

Applications Claiming Priority (24)

Application Number Priority Date Filing Date Title
US201862768633P 2018-11-16 2018-11-16
US62/768,633 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US16/283,181 2019-02-22
US201962815682P 2019-03-08 2019-03-08
US62/815,682 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US62/875,222 2019-07-17
US201962897457P 2019-09-09 2019-09-09
US62/897,457 2019-09-09
US16/576,363 US10969842B2 (en) 2018-09-19 2019-09-19 Chassis for a liquid immersion cooling system
US16/576,239 2019-09-19
US16/576,239 US10624237B2 (en) 2018-09-19 2019-09-19 Liquid immersion cooling vessel and components thereof
US16/576,309 US10694643B2 (en) 2018-09-19 2019-09-19 Ballast blocks for a liquid immersion cooling system
PCT/US2019/051924 WO2020061305A1 (fr) 2018-09-19 2019-09-19 Plate-forme de refroidissement par immersion dans un liquide
US16/576,285 US10617032B1 (en) 2018-09-19 2019-09-19 Robot for a liquid immersion cooling system
US16/576,309 2019-09-19
USPCT/US2019/051924 2019-09-19
US16/576,363 2019-09-19
US16/576,405 2019-09-19
US16/576,285 2019-09-19
US16/576,405 US10653043B2 (en) 2018-09-19 2019-09-19 Vapor management system for a liquid immersion cooling system
US16/576,191 2019-09-19
US16/576,191 US11129298B2 (en) 2018-09-19 2019-09-19 Process for liquid immersion cooling

Publications (1)

Publication Number Publication Date
CA3113668A1 true CA3113668A1 (fr) 2020-05-22

Family

ID=70732132

Family Applications (2)

Application Number Title Priority Date Filing Date
CA3128868A Pending CA3128868A1 (fr) 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide
CA3113668A Pending CA3113668A1 (fr) 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CA3128868A Pending CA3128868A1 (fr) 2018-11-16 2019-11-11 Plate-forme de refroidissement par immersion dans un liquide

Country Status (8)

Country Link
EP (1) EP3881658A4 (fr)
JP (1) JP2022504024A (fr)
KR (1) KR20210119384A (fr)
CN (1) CN113647204A (fr)
AU (1) AU2019378713A1 (fr)
CA (2) CA3128868A1 (fr)
MX (1) MX2021003176A (fr)
WO (1) WO2020102090A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11357131B1 (en) * 2021-08-03 2022-06-07 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
CN111921468A (zh) * 2020-08-05 2020-11-13 重庆大学 一种新材料合成智能均相反应釜系统及控制方法
TW202306627A (zh) * 2021-03-22 2023-02-16 美商Ｔｍｇ科爾有限責任公司 用於監測過濾材料的過程及系統
EP4068925A1 (fr) * 2021-04-01 2022-10-05 Ovh Structure en ciseaux pour la gestion des câbles/tubes des ensembles électroniques montés en bâti et refroidis par liquide
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
CA3151725A1 (fr) 2021-04-01 2022-10-01 Ovh Systeme de refroidissement par immersion avec double circulation de liquide de refroidissement dielectrique
EP4352590A1 (fr) * 2021-06-10 2024-04-17 Modine LLC Plateforme de refroidissement par immersion dans un liquide et ses composants
US20230080447A1 (en) * 2021-09-15 2023-03-16 Tmgcore, Inc. Liquid immersion cooling platform and components thereof
TWI803982B (zh) * 2021-09-17 2023-06-01 英業達股份有限公司 冷卻系統及其操作方法

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US3952182A (en) * 1974-01-25 1976-04-20 Flanders Robert D Instantaneous electric fluid heater
US7128142B2 (en) * 2004-08-24 2006-10-31 Halliburton Energy Services, Inc. Apparatus and methods for improved fluid displacement in subterranean formations
EP1837612A1 (fr) * 2004-12-22 2007-09-26 Tokyo University of Science, Educational Foundation Procede et appareil de refroidissement de vapeur, structure de passage d'ecoulement et application associee
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
WO2010050933A1 (fr) * 2008-10-29 2010-05-06 Advantest Corporation Régulateur thermique pour dispositifs électroniques
NL2005207A (en) 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US8184436B2 (en) * 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
WO2013022805A1 (fr) * 2011-08-05 2013-02-14 Green Revolution Cooling, Inc. Refroidissement de lecteur de disque dur pour systèmes de refroidissement par immersion dans du fluide
US9921622B2 (en) * 2013-02-01 2018-03-20 Dell Products, L.P. Stand alone immersion tank data center with contained cooling
US9335802B2 (en) * 2013-02-01 2016-05-10 Dell Products, L.P. System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid
US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
EP2994809B1 (fr) * 2013-05-06 2019-08-28 Green Revolution Cooling, Inc. Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu
DE102014102720B4 (de) * 2014-02-28 2017-03-23 Ushio Denki Kabushiki Kaisha Anordnung zum Kühlen einer plasmabasierten Strahlungsquelle mit einer metallischen Kühlflüssigkeit und Verfahren zur Inbetriebnahme einer solchen Kühlanordnung
CN105762437B (zh) * 2014-12-17 2019-04-02 北京长城华冠汽车科技股份有限公司 浸液式电池箱温度控制系统
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
US10405459B2 (en) * 2016-08-04 2019-09-03 Hamilton Sundstrand Corporation Actuated immersion cooled electronic assemblies
JP2017050548A (ja) * 2016-10-13 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
US10605477B2 (en) * 2017-01-20 2020-03-31 Johnson Controls Technology Company HVAC system with free cooling optimization based on coolant flowrate
CN110770964A (zh) * 2017-03-09 2020-02-07 祖达汽车有限公司 热调节系统和方法
CN107564593B (zh) * 2017-08-09 2019-06-18 华北电力大学 一种压力容器外部冷却试验系统和方法

Also Published As

Publication number Publication date
AU2019378713A1 (en) 2021-06-03
CN113647204A (zh) 2021-11-12
CA3128868A1 (fr) 2020-05-22
EP3881658A4 (fr) 2022-09-14
EP3881658A1 (fr) 2021-09-22
MX2021003176A (es) 2021-08-11
JP2022504024A (ja) 2022-01-13
KR20210119384A (ko) 2021-10-05
WO2020102090A1 (fr) 2020-05-22

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