CA3113668A1 - Liquid immersion cooling platform - Google Patents

Liquid immersion cooling platform

Info

Publication number
CA3113668A1
CA3113668A1 CA3113668A CA3113668A CA3113668A1 CA 3113668 A1 CA3113668 A1 CA 3113668A1 CA 3113668 A CA3113668 A CA 3113668A CA 3113668 A CA3113668 A CA 3113668A CA 3113668 A1 CA3113668 A1 CA 3113668A1
Authority
CA
Canada
Prior art keywords
pressure
liquid phase
dielectric fluid
immersion cooling
liquid immersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3113668A
Other languages
French (fr)
Inventor
John David Enright
Jacob Mertel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TMGcore Inc
Original Assignee
TMGcore Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/283,181 external-priority patent/US10477726B1/en
Priority claimed from US16/576,363 external-priority patent/US10969842B2/en
Priority claimed from US16/576,309 external-priority patent/US10694643B2/en
Priority claimed from US16/576,239 external-priority patent/US10624237B2/en
Priority claimed from US16/576,191 external-priority patent/US11129298B2/en
Priority claimed from US16/576,285 external-priority patent/US10617032B1/en
Priority claimed from US16/576,405 external-priority patent/US10653043B2/en
Priority claimed from PCT/US2019/051924 external-priority patent/WO2020061305A1/en
Application filed by TMGcore Inc filed Critical TMGcore Inc
Publication of CA3113668A1 publication Critical patent/CA3113668A1/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created. A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
CA3113668A 2018-11-16 2019-11-11 Liquid immersion cooling platform Pending CA3113668A1 (en)

Applications Claiming Priority (24)

Application Number Priority Date Filing Date Title
US201862768633P 2018-11-16 2018-11-16
US62/768,633 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US16/283,181 2019-02-22
US201962815682P 2019-03-08 2019-03-08
US62/815,682 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US62/875,222 2019-07-17
US201962897457P 2019-09-09 2019-09-09
US62/897,457 2019-09-09
US16/576,363 US10969842B2 (en) 2018-09-19 2019-09-19 Chassis for a liquid immersion cooling system
US16/576,309 US10694643B2 (en) 2018-09-19 2019-09-19 Ballast blocks for a liquid immersion cooling system
US16/576,239 US10624237B2 (en) 2018-09-19 2019-09-19 Liquid immersion cooling vessel and components thereof
US16/576,191 US11129298B2 (en) 2018-09-19 2019-09-19 Process for liquid immersion cooling
USPCT/US2019/051924 2019-09-19
US16/576,285 US10617032B1 (en) 2018-09-19 2019-09-19 Robot for a liquid immersion cooling system
US16/576,363 2019-09-19
US16/576,285 2019-09-19
US16/576,405 2019-09-19
US16/576,309 2019-09-19
US16/576,239 2019-09-19
US16/576,405 US10653043B2 (en) 2018-09-19 2019-09-19 Vapor management system for a liquid immersion cooling system
US16/576,191 2019-09-19
PCT/US2019/051924 WO2020061305A1 (en) 2018-09-19 2019-09-19 Liquid immersion cooling platform

Publications (1)

Publication Number Publication Date
CA3113668A1 true CA3113668A1 (en) 2020-05-22

Family

ID=70732132

Family Applications (2)

Application Number Title Priority Date Filing Date
CA3113668A Pending CA3113668A1 (en) 2018-11-16 2019-11-11 Liquid immersion cooling platform
CA3128868A Pending CA3128868A1 (en) 2018-11-16 2019-11-11 Liquid immersion cooling platform

Family Applications After (1)

Application Number Title Priority Date Filing Date
CA3128868A Pending CA3128868A1 (en) 2018-11-16 2019-11-11 Liquid immersion cooling platform

Country Status (8)

Country Link
EP (1) EP3881658A4 (en)
JP (1) JP2022504024A (en)
KR (1) KR20210119384A (en)
CN (1) CN113647204A (en)
AU (1) AU2019378713A1 (en)
CA (2) CA3113668A1 (en)
MX (1) MX2021003176A (en)
WO (1) WO2020102090A1 (en)

Families Citing this family (13)

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US11357131B1 (en) * 2021-08-03 2022-06-07 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
MX2022005713A (en) 2019-11-11 2022-08-16 Tmgcore Llc External robotic system for liquid immersion cooling platform.
CN111921468A (en) * 2020-08-05 2020-11-13 重庆大学 Intelligent homogeneous reaction kettle system for new material synthesis and control method
US12035508B2 (en) 2020-12-29 2024-07-09 Modine LLC Liquid immersion cooling platform and components thereof
US11486845B2 (en) 2021-03-22 2022-11-01 Tmgcore, Inc. Processes and systems for monitoring filter materials
EP4068921B1 (en) * 2021-04-01 2024-07-17 Ovh Immersion cooling systems for electronic components
US11729950B2 (en) 2021-04-01 2023-08-15 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
EP4068930B1 (en) 2021-04-01 2024-03-13 Ovh A rack system for housing an electronic device
US11924998B2 (en) 2021-04-01 2024-03-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
JP2024539585A (en) * 2021-06-10 2024-10-29 モディーン エルエルシー Immersion cooling platform and components thereof
US12010820B2 (en) * 2021-09-15 2024-06-11 Modine LLC Liquid immersion cooling platform and components thereof
TWI803982B (en) * 2021-09-17 2023-06-01 英業達股份有限公司 Cooling system and operation method thereof
WO2024089552A1 (en) * 2022-10-25 2024-05-02 3M Innovative Properties Company Fiber optic feedthrough for immersion cooling with condensate prevention

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US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
US3952182A (en) * 1974-01-25 1976-04-20 Flanders Robert D Instantaneous electric fluid heater
JPH05190715A (en) * 1992-01-17 1993-07-30 Toshiba Corp Boiling cooler
JP2569284B2 (en) * 1994-09-19 1997-01-08 株式会社日立製作所 Semiconductor cooling device
US7128142B2 (en) * 2004-08-24 2006-10-31 Halliburton Energy Services, Inc. Apparatus and methods for improved fluid displacement in subterranean formations
WO2006075493A1 (en) * 2004-12-22 2006-07-20 Tokyo University Of Science Educational Foundation Administrative Organization Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
JP2008244182A (en) * 2007-03-28 2008-10-09 Kaneka Corp High-intensity light emitting organic el light-emitting device
JP4792546B2 (en) * 2008-10-29 2011-10-12 株式会社アドバンテスト Temperature control device for electronic parts
NL2005207A (en) 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US8184436B2 (en) * 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
EP2740339A4 (en) * 2011-08-05 2015-08-12 Green Revolution Cooling Inc Hard drive cooling for fluid submersion cooling systems
US9921622B2 (en) * 2013-02-01 2018-03-20 Dell Products, L.P. Stand alone immersion tank data center with contained cooling
US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
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DE102014102720B4 (en) * 2014-02-28 2017-03-23 Ushio Denki Kabushiki Kaisha Arrangement for cooling a plasma-based radiation source with a metallic cooling liquid and method for starting up such a cooling arrangement
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Also Published As

Publication number Publication date
EP3881658A4 (en) 2022-09-14
KR20210119384A (en) 2021-10-05
AU2019378713A1 (en) 2021-06-03
WO2020102090A1 (en) 2020-05-22
CA3128868A1 (en) 2020-05-22
EP3881658A1 (en) 2021-09-22
MX2021003176A (en) 2021-08-11
CN113647204A (en) 2021-11-12
JP2022504024A (en) 2022-01-13

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