MX2021003176A - Liquid immersion cooling platform. - Google Patents
Liquid immersion cooling platform.Info
- Publication number
- MX2021003176A MX2021003176A MX2021003176A MX2021003176A MX2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A
- Authority
- MX
- Mexico
- Prior art keywords
- pressure
- liquid phase
- dielectric fluid
- immersion cooling
- liquid immersion
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created. A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862768633P | 2018-11-16 | 2018-11-16 | |
US16/283,181 US10477726B1 (en) | 2018-09-19 | 2019-02-22 | Liquid immersion cooling platform |
US201962815682P | 2019-03-08 | 2019-03-08 | |
US201962875222P | 2019-07-17 | 2019-07-17 | |
US201962897457P | 2019-09-09 | 2019-09-09 | |
US16/576,405 US10653043B2 (en) | 2018-09-19 | 2019-09-19 | Vapor management system for a liquid immersion cooling system |
US16/576,239 US10624237B2 (en) | 2018-09-19 | 2019-09-19 | Liquid immersion cooling vessel and components thereof |
US16/576,363 US10969842B2 (en) | 2018-09-19 | 2019-09-19 | Chassis for a liquid immersion cooling system |
US16/576,309 US10694643B2 (en) | 2018-09-19 | 2019-09-19 | Ballast blocks for a liquid immersion cooling system |
PCT/US2019/051924 WO2020061305A1 (en) | 2018-09-19 | 2019-09-19 | Liquid immersion cooling platform |
US16/576,191 US11129298B2 (en) | 2018-09-19 | 2019-09-19 | Process for liquid immersion cooling |
US16/576,285 US10617032B1 (en) | 2018-09-19 | 2019-09-19 | Robot for a liquid immersion cooling system |
PCT/US2019/060759 WO2020102090A1 (en) | 2018-11-16 | 2019-11-11 | Liquid immersion cooling platform |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021003176A true MX2021003176A (en) | 2021-08-11 |
Family
ID=70732132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021003176A MX2021003176A (en) | 2018-11-16 | 2019-11-11 | Liquid immersion cooling platform. |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP3881658A4 (en) |
JP (1) | JP2022504024A (en) |
KR (1) | KR20210119384A (en) |
CN (1) | CN113647204A (en) |
AU (1) | AU2019378713A1 (en) |
CA (2) | CA3113668A1 (en) |
MX (1) | MX2021003176A (en) |
WO (1) | WO2020102090A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11357131B1 (en) * | 2021-08-03 | 2022-06-07 | Tmgcore, Inc. | Fluid breakdown detection systems and processes useful for liquid immersion cooling |
WO2021096858A1 (en) | 2019-11-11 | 2021-05-20 | TMGCore, LLC | External robotic system for liquid immersion cooling platform |
CN111921468A (en) * | 2020-08-05 | 2020-11-13 | 重庆大学 | Intelligent homogeneous reaction kettle system for new material synthesis and control method |
US12035508B2 (en) | 2020-12-29 | 2024-07-09 | Modine LLC | Liquid immersion cooling platform and components thereof |
EP4313362A1 (en) | 2021-03-22 | 2024-02-07 | TMGcore, LLC | Processes and systems for monitoring filter materials |
US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
CA3153037A1 (en) | 2021-04-01 | 2022-10-01 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
EP4068926A1 (en) * | 2021-04-01 | 2022-10-05 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
WO2022261470A1 (en) * | 2021-06-10 | 2022-12-15 | TMGCore, INC | Liquid immersion cooling platform and components thereof |
US12010820B2 (en) * | 2021-09-15 | 2024-06-11 | Modine LLC | Liquid immersion cooling platform and components thereof |
TWI803982B (en) * | 2021-09-17 | 2023-06-01 | 英業達股份有限公司 | Cooling system and operation method thereof |
WO2024089552A1 (en) * | 2022-10-25 | 2024-05-02 | 3M Innovative Properties Company | Fiber optic feedthrough for immersion cooling with condensate prevention |
Family Cites Families (24)
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US3952182A (en) * | 1974-01-25 | 1976-04-20 | Flanders Robert D | Instantaneous electric fluid heater |
JPH05190715A (en) * | 1992-01-17 | 1993-07-30 | Toshiba Corp | Boiling cooler |
JP2569284B2 (en) * | 1994-09-19 | 1997-01-08 | 株式会社日立製作所 | Semiconductor cooling device |
US7128142B2 (en) * | 2004-08-24 | 2006-10-31 | Halliburton Energy Services, Inc. | Apparatus and methods for improved fluid displacement in subterranean formations |
WO2006075493A1 (en) * | 2004-12-22 | 2006-07-20 | Tokyo University Of Science Educational Foundation Administrative Organization | Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
JP2008244182A (en) * | 2007-03-28 | 2008-10-09 | Kaneka Corp | High-intensity light emitting organic el light-emitting device |
US8844612B2 (en) * | 2008-10-29 | 2014-09-30 | Advantest Corporation | Thermal controller for electronic devices |
NL2005207A (en) * | 2009-09-28 | 2011-03-29 | Asml Netherlands Bv | Heat pipe, lithographic apparatus and device manufacturing method. |
US8184436B2 (en) * | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
US20140211412A1 (en) * | 2011-08-05 | 2014-07-31 | Green Revolution Cooling, Inc. | Hard drive cooling for fluid submersion cooling systems |
US9351429B2 (en) * | 2013-02-01 | 2016-05-24 | Dell Products, L.P. | Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks |
US9921622B2 (en) * | 2013-02-01 | 2018-03-20 | Dell Products, L.P. | Stand alone immersion tank data center with contained cooling |
US9335802B2 (en) * | 2013-02-01 | 2016-05-10 | Dell Products, L.P. | System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid |
WO2014182724A1 (en) * | 2013-05-06 | 2014-11-13 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
DE102014102720B4 (en) * | 2014-02-28 | 2017-03-23 | Ushio Denki Kabushiki Kaisha | Arrangement for cooling a plasma-based radiation source with a metallic cooling liquid and method for starting up such a cooling arrangement |
CN104240908B (en) * | 2014-09-10 | 2016-03-30 | 深圳供电局有限公司 | evaporative cooling power transformer |
CN105762437B (en) * | 2014-12-17 | 2019-04-02 | 北京长城华冠汽车科技股份有限公司 | Immersion type battery box temperature control system |
GB2542844B (en) * | 2015-10-01 | 2021-06-16 | Iceotope Group Ltd | An immersion cooling system |
US10405459B2 (en) * | 2016-08-04 | 2019-09-03 | Hamilton Sundstrand Corporation | Actuated immersion cooled electronic assemblies |
JP2017050548A (en) * | 2016-10-13 | 2017-03-09 | 株式会社ExaScaler | Cooling system for electronic apparatus |
US10605477B2 (en) * | 2017-01-20 | 2020-03-31 | Johnson Controls Technology Company | HVAC system with free cooling optimization based on coolant flowrate |
IL269230B2 (en) * | 2017-03-09 | 2023-09-01 | Zuta Car Ltd | Systems and methods for thermal regulation |
CN107564593B (en) * | 2017-08-09 | 2019-06-18 | 华北电力大学 | A kind of pressure vessel outside cooling test system and method |
-
2019
- 2019-11-11 CA CA3113668A patent/CA3113668A1/en active Pending
- 2019-11-11 JP JP2021516360A patent/JP2022504024A/en active Pending
- 2019-11-11 AU AU2019378713A patent/AU2019378713A1/en active Pending
- 2019-11-11 WO PCT/US2019/060759 patent/WO2020102090A1/en unknown
- 2019-11-11 CN CN201980089348.3A patent/CN113647204A/en active Pending
- 2019-11-11 MX MX2021003176A patent/MX2021003176A/en unknown
- 2019-11-11 CA CA3128868A patent/CA3128868A1/en active Pending
- 2019-11-11 KR KR1020217018317A patent/KR20210119384A/en not_active Application Discontinuation
- 2019-11-11 EP EP19883541.5A patent/EP3881658A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3881658A1 (en) | 2021-09-22 |
AU2019378713A1 (en) | 2021-06-03 |
JP2022504024A (en) | 2022-01-13 |
KR20210119384A (en) | 2021-10-05 |
CA3128868A1 (en) | 2020-05-22 |
CN113647204A (en) | 2021-11-12 |
CA3113668A1 (en) | 2020-05-22 |
EP3881658A4 (en) | 2022-09-14 |
WO2020102090A1 (en) | 2020-05-22 |
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