MX2021003176A - Liquid immersion cooling platform. - Google Patents

Liquid immersion cooling platform.

Info

Publication number
MX2021003176A
MX2021003176A MX2021003176A MX2021003176A MX2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A MX 2021003176 A MX2021003176 A MX 2021003176A
Authority
MX
Mexico
Prior art keywords
pressure
liquid phase
dielectric fluid
immersion cooling
liquid immersion
Prior art date
Application number
MX2021003176A
Other languages
Spanish (es)
Inventor
John David Enright
Jacob Mertel
Original Assignee
Tmgcore Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/283,181 external-priority patent/US10477726B1/en
Priority claimed from US16/576,405 external-priority patent/US10653043B2/en
Priority claimed from US16/576,239 external-priority patent/US10624237B2/en
Priority claimed from US16/576,363 external-priority patent/US10969842B2/en
Priority claimed from US16/576,309 external-priority patent/US10694643B2/en
Priority claimed from PCT/US2019/051924 external-priority patent/WO2020061305A1/en
Priority claimed from US16/576,191 external-priority patent/US11129298B2/en
Priority claimed from US16/576,285 external-priority patent/US10617032B1/en
Application filed by Tmgcore Llc filed Critical Tmgcore Llc
Publication of MX2021003176A publication Critical patent/MX2021003176A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created. A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
MX2021003176A 2018-11-16 2019-11-11 Liquid immersion cooling platform. MX2021003176A (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US201862768633P 2018-11-16 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US201962815682P 2019-03-08 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US201962897457P 2019-09-09 2019-09-09
US16/576,405 US10653043B2 (en) 2018-09-19 2019-09-19 Vapor management system for a liquid immersion cooling system
US16/576,239 US10624237B2 (en) 2018-09-19 2019-09-19 Liquid immersion cooling vessel and components thereof
US16/576,363 US10969842B2 (en) 2018-09-19 2019-09-19 Chassis for a liquid immersion cooling system
US16/576,309 US10694643B2 (en) 2018-09-19 2019-09-19 Ballast blocks for a liquid immersion cooling system
PCT/US2019/051924 WO2020061305A1 (en) 2018-09-19 2019-09-19 Liquid immersion cooling platform
US16/576,191 US11129298B2 (en) 2018-09-19 2019-09-19 Process for liquid immersion cooling
US16/576,285 US10617032B1 (en) 2018-09-19 2019-09-19 Robot for a liquid immersion cooling system
PCT/US2019/060759 WO2020102090A1 (en) 2018-11-16 2019-11-11 Liquid immersion cooling platform

Publications (1)

Publication Number Publication Date
MX2021003176A true MX2021003176A (en) 2021-08-11

Family

ID=70732132

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021003176A MX2021003176A (en) 2018-11-16 2019-11-11 Liquid immersion cooling platform.

Country Status (8)

Country Link
EP (1) EP3881658A4 (en)
JP (1) JP2022504024A (en)
KR (1) KR20210119384A (en)
CN (1) CN113647204A (en)
AU (1) AU2019378713A1 (en)
CA (2) CA3113668A1 (en)
MX (1) MX2021003176A (en)
WO (1) WO2020102090A1 (en)

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US11357131B1 (en) * 2021-08-03 2022-06-07 Tmgcore, Inc. Fluid breakdown detection systems and processes useful for liquid immersion cooling
WO2021096858A1 (en) 2019-11-11 2021-05-20 TMGCore, LLC External robotic system for liquid immersion cooling platform
CN111921468A (en) * 2020-08-05 2020-11-13 重庆大学 Intelligent homogeneous reaction kettle system for new material synthesis and control method
US12035508B2 (en) 2020-12-29 2024-07-09 Modine LLC Liquid immersion cooling platform and components thereof
EP4313362A1 (en) 2021-03-22 2024-02-07 TMGcore, LLC Processes and systems for monitoring filter materials
US11729950B2 (en) 2021-04-01 2023-08-15 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
CA3153037A1 (en) 2021-04-01 2022-10-01 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
EP4068926A1 (en) * 2021-04-01 2022-10-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
WO2022261470A1 (en) * 2021-06-10 2022-12-15 TMGCore, INC Liquid immersion cooling platform and components thereof
US12010820B2 (en) * 2021-09-15 2024-06-11 Modine LLC Liquid immersion cooling platform and components thereof
TWI803982B (en) * 2021-09-17 2023-06-01 英業達股份有限公司 Cooling system and operation method thereof
WO2024089552A1 (en) * 2022-10-25 2024-05-02 3M Innovative Properties Company Fiber optic feedthrough for immersion cooling with condensate prevention

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US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
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Also Published As

Publication number Publication date
EP3881658A1 (en) 2021-09-22
AU2019378713A1 (en) 2021-06-03
JP2022504024A (en) 2022-01-13
KR20210119384A (en) 2021-10-05
CA3128868A1 (en) 2020-05-22
CN113647204A (en) 2021-11-12
CA3113668A1 (en) 2020-05-22
EP3881658A4 (en) 2022-09-14
WO2020102090A1 (en) 2020-05-22

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