JP2022504024A - 液浸冷却プラットフォーム - Google Patents
液浸冷却プラットフォーム Download PDFInfo
- Publication number
- JP2022504024A JP2022504024A JP2021516360A JP2021516360A JP2022504024A JP 2022504024 A JP2022504024 A JP 2022504024A JP 2021516360 A JP2021516360 A JP 2021516360A JP 2021516360 A JP2021516360 A JP 2021516360A JP 2022504024 A JP2022504024 A JP 2022504024A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- chassis
- fluid
- components
- dielectric fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 238000007654 immersion Methods 0.000 title abstract description 62
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- DJXNLVJQMJNEMN-UHFFFAOYSA-N 2-[difluoro(methoxy)methyl]-1,1,1,2,3,3,3-heptafluoropropane Chemical compound COC(F)(F)C(F)(C(F)(F)F)C(F)(F)F DJXNLVJQMJNEMN-UHFFFAOYSA-N 0.000 description 2
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- 241000238634 Libellulidae Species 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- OIWCYIUQAVBPGV-DAQGAKHBSA-N {1-O-hexadecanoyl-2-O-[(Z)-octadec-9-enoyl]-sn-glycero-3-phospho}serine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP(O)(=O)OC[C@H](N)C(O)=O)OC(=O)CCCCCCC\C=C/CCCCCCCC OIWCYIUQAVBPGV-DAQGAKHBSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (25)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862768633P | 2018-11-16 | 2018-11-16 | |
| US62/768,633 | 2018-11-16 | ||
| US16/283,181 US10477726B1 (en) | 2018-09-19 | 2019-02-22 | Liquid immersion cooling platform |
| US16/283,181 | 2019-02-22 | ||
| US201962815682P | 2019-03-08 | 2019-03-08 | |
| US62/815,682 | 2019-03-08 | ||
| US201962875222P | 2019-07-17 | 2019-07-17 | |
| US62/875,222 | 2019-07-17 | ||
| US201962897457P | 2019-09-09 | 2019-09-09 | |
| US62/897,457 | 2019-09-09 | ||
| US16/576,285 US10617032B1 (en) | 2018-09-19 | 2019-09-19 | Robot for a liquid immersion cooling system |
| USPCT/US2019/051924 | 2019-09-19 | ||
| US16/576,191 | 2019-09-19 | ||
| US16/576,309 | 2019-09-19 | ||
| US16/576,239 | 2019-09-19 | ||
| US16/576,239 US10624237B2 (en) | 2018-09-19 | 2019-09-19 | Liquid immersion cooling vessel and components thereof |
| US16/576,405 | 2019-09-19 | ||
| US16/576,363 US10969842B2 (en) | 2018-09-19 | 2019-09-19 | Chassis for a liquid immersion cooling system |
| US16/576,285 | 2019-09-19 | ||
| US16/576,309 US10694643B2 (en) | 2018-09-19 | 2019-09-19 | Ballast blocks for a liquid immersion cooling system |
| US16/576,191 US11129298B2 (en) | 2018-09-19 | 2019-09-19 | Process for liquid immersion cooling |
| PCT/US2019/051924 WO2020061305A1 (fr) | 2018-09-19 | 2019-09-19 | Plate-forme de refroidissement par immersion dans un liquide |
| US16/576,363 | 2019-09-19 | ||
| US16/576,405 US10653043B2 (en) | 2018-09-19 | 2019-09-19 | Vapor management system for a liquid immersion cooling system |
| PCT/US2019/060759 WO2020102090A1 (fr) | 2018-11-16 | 2019-11-11 | Plate-forme de refroidissement par immersion dans un liquide |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2022504024A true JP2022504024A (ja) | 2022-01-13 |
Family
ID=70732132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021516360A Pending JP2022504024A (ja) | 2018-11-16 | 2019-11-11 | 液浸冷却プラットフォーム |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP3881658A4 (fr) |
| JP (1) | JP2022504024A (fr) |
| KR (1) | KR20210119384A (fr) |
| CN (1) | CN113647204A (fr) |
| AU (1) | AU2019378713A1 (fr) |
| CA (2) | CA3128868A1 (fr) |
| MX (1) | MX2021003176A (fr) |
| WO (1) | WO2020102090A1 (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11357131B1 (en) * | 2021-08-03 | 2022-06-07 | Tmgcore, Inc. | Fluid breakdown detection systems and processes useful for liquid immersion cooling |
| CN111921468A (zh) * | 2020-08-05 | 2020-11-13 | 重庆大学 | 一种新材料合成智能均相反应釜系统及控制方法 |
| TW202306627A (zh) * | 2021-03-22 | 2023-02-16 | 美商Ｔｍｇ科爾有限責任公司 | 用於監測過濾材料的過程及系統 |
| CA3151725A1 (fr) | 2021-04-01 | 2022-10-01 | Ovh | Systeme de refroidissement par immersion avec double circulation de liquide de refroidissement dielectrique |
| CA3153037A1 (fr) | 2021-04-01 | 2022-10-01 | Ovh | Systeme hybride de refroidissement par immersion pour les ensembles electroniques montes sur bati |
| EP4068928B1 (fr) * | 2021-04-01 | 2024-01-31 | Ovh | Dispositif de refroidissement |
| EP4352590A1 (fr) * | 2021-06-10 | 2024-04-17 | Modine LLC | Plateforme de refroidissement par immersion dans un liquide et ses composants |
| US20230080447A1 (en) * | 2021-09-15 | 2023-03-16 | Tmgcore, Inc. | Liquid immersion cooling platform and components thereof |
| TWI803982B (zh) * | 2021-09-17 | 2023-06-01 | 英業達股份有限公司 | 冷卻系統及其操作方法 |
| WO2024089552A1 (fr) * | 2022-10-25 | 2024-05-02 | 3M Innovative Properties Company | Traversée de fibre optique pour refroidissement par immersion avec prévention de condensat |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3952182A (en) * | 1974-01-25 | 1976-04-20 | Flanders Robert D | Instantaneous electric fluid heater |
| US7128142B2 (en) * | 2004-08-24 | 2006-10-31 | Halliburton Energy Services, Inc. | Apparatus and methods for improved fluid displacement in subterranean formations |
| US8061414B2 (en) * | 2004-12-22 | 2011-11-22 | Tokyo University Of Science Educational Foundation Administrative Organization | Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof |
| US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| US8844612B2 (en) * | 2008-10-29 | 2014-09-30 | Advantest Corporation | Thermal controller for electronic devices |
| NL2005207A (en) | 2009-09-28 | 2011-03-29 | Asml Netherlands Bv | Heat pipe, lithographic apparatus and device manufacturing method. |
| US8184436B2 (en) * | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
| CN104115578A (zh) * | 2011-08-05 | 2014-10-22 | 绿色革命冷却股份有限公司 | 流体浸没式冷却系统的硬驱动器散热 |
| US9335802B2 (en) * | 2013-02-01 | 2016-05-10 | Dell Products, L.P. | System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid |
| US9351429B2 (en) * | 2013-02-01 | 2016-05-24 | Dell Products, L.P. | Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks |
| US9921622B2 (en) * | 2013-02-01 | 2018-03-20 | Dell Products, L.P. | Stand alone immersion tank data center with contained cooling |
| US9504190B2 (en) * | 2013-05-06 | 2016-11-22 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
| DE102014102720B4 (de) * | 2014-02-28 | 2017-03-23 | Ushio Denki Kabushiki Kaisha | Anordnung zum Kühlen einer plasmabasierten Strahlungsquelle mit einer metallischen Kühlflüssigkeit und Verfahren zur Inbetriebnahme einer solchen Kühlanordnung |
| CN105762437B (zh) * | 2014-12-17 | 2019-04-02 | 北京长城华冠汽车科技股份有限公司 | 浸液式电池箱温度控制系统 |
| GB2542844B (en) * | 2015-10-01 | 2021-06-16 | Iceotope Group Ltd | An immersion cooling system |
| US10405459B2 (en) | 2016-08-04 | 2019-09-03 | Hamilton Sundstrand Corporation | Actuated immersion cooled electronic assemblies |
| JP2017050548A (ja) * | 2016-10-13 | 2017-03-09 | 株式会社ＥｘａＳｃａｌｅｒ | 電子機器の冷却システム |
| US10605477B2 (en) * | 2017-01-20 | 2020-03-31 | Johnson Controls Technology Company | HVAC system with free cooling optimization based on coolant flowrate |
| IL269230B2 (en) | 2017-03-09 | 2023-09-01 | Zuta Car Ltd | Thermal regulation systems and methods |
| CN107564593B (zh) * | 2017-08-09 | 2019-06-18 | 华北电力大学 | 一种压力容器外部冷却试验系统和方法 |
-
2019
- 2019-11-11 AU AU2019378713A patent/AU2019378713A1/en active Pending
- 2019-11-11 CN CN201980089348.3A patent/CN113647204A/zh active Pending
- 2019-11-11 CA CA3128868A patent/CA3128868A1/fr active Pending
- 2019-11-11 MX MX2021003176A patent/MX2021003176A/es unknown
- 2019-11-11 JP JP2021516360A patent/JP2022504024A/ja active Pending
- 2019-11-11 KR KR1020217018317A patent/KR20210119384A/ko active Search and Examination
- 2019-11-11 CA CA3113668A patent/CA3113668A1/fr active Pending
- 2019-11-11 EP EP19883541.5A patent/EP3881658A4/fr active Pending
- 2019-11-11 WO PCT/US2019/060759 patent/WO2020102090A1/fr unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA3128868A1 (fr) | 2020-05-22 |
| MX2021003176A (es) | 2021-08-11 |
| EP3881658A4 (fr) | 2022-09-14 |
| CA3113668A1 (fr) | 2020-05-22 |
| EP3881658A1 (fr) | 2021-09-22 |
| WO2020102090A1 (fr) | 2020-05-22 |
| AU2019378713A1 (en) | 2021-06-03 |
| CN113647204A (zh) | 2021-11-12 |
| KR20210119384A (ko) | 2021-10-05 |
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