MX2011006750A - Metodo para producir capas autoestables delgadas de materiales de estado solido con superficies estructuradas. - Google Patents

Metodo para producir capas autoestables delgadas de materiales de estado solido con superficies estructuradas.

Info

Publication number
MX2011006750A
MX2011006750A MX2011006750A MX2011006750A MX2011006750A MX 2011006750 A MX2011006750 A MX 2011006750A MX 2011006750 A MX2011006750 A MX 2011006750A MX 2011006750 A MX2011006750 A MX 2011006750A MX 2011006750 A MX2011006750 A MX 2011006750A
Authority
MX
Mexico
Prior art keywords
solid state
free
producing thin
structured surfaces
state material
Prior art date
Application number
MX2011006750A
Other languages
English (en)
Inventor
Lukas Lichtensteiger
Original Assignee
Siltectra Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltectra Gmbh filed Critical Siltectra Gmbh
Publication of MX2011006750A publication Critical patent/MX2011006750A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00634—Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/038—Processes for manufacturing substrate-free structures not provided for in B81C2201/034 - B81C2201/036
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Micromachines (AREA)
  • Printing Methods (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Photovoltaic Devices (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Laser Beam Processing (AREA)

Abstract

Se describe un método de impresión que comprende los pasos de: proporcionar un material de estado sólido que tiene al menos una superficie expuesta; aplicar una capa auxiliar a la superficie expuesta para forma una estructura compuesta, la capa auxiliar tiene un patrón de desgaste; someter la estructura compuesta a condiciones que facilitan la fractura del material de estado sólido a lo largo de un plano a una profundidad en el mismo; y remover la capa auxiliar, y con esto, una capa del material de estado sólido que termina a la profundidad de fractura, una superficie expuesta de la capa removida de material de estado sólido tiene una topología superficial que corresponde con el patrón de desgaste.
MX2011006750A 2008-12-23 2009-12-18 Metodo para producir capas autoestables delgadas de materiales de estado solido con superficies estructuradas. MX2011006750A (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14046608P 2008-12-23 2008-12-23
US17544709P 2009-05-04 2009-05-04
US17610509P 2009-05-06 2009-05-06
PCT/EP2009/067539 WO2010072675A2 (en) 2008-12-23 2009-12-18 Method for producing thin, free-standing layers of solid state materials with structured surfaces

Publications (1)

Publication Number Publication Date
MX2011006750A true MX2011006750A (es) 2011-09-06

Family

ID=42288178

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2011006750A MX2011006750A (es) 2008-12-23 2009-12-18 Metodo para producir capas autoestables delgadas de materiales de estado solido con superficies estructuradas.

Country Status (12)

Country Link
US (1) US8877077B2 (es)
EP (3) EP2620409B1 (es)
JP (1) JP5762973B2 (es)
KR (1) KR101527627B1 (es)
CN (1) CN102325717B (es)
AU (1) AU2009331646A1 (es)
BR (1) BRPI0923536A2 (es)
CA (1) CA2747840A1 (es)
ES (1) ES2418142T3 (es)
MX (1) MX2011006750A (es)
RU (1) RU2011130872A (es)
WO (1) WO2010072675A2 (es)

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Also Published As

Publication number Publication date
AU2009331646A8 (en) 2011-08-04
EP2620409B1 (en) 2017-03-01
KR101527627B1 (ko) 2015-06-10
CN102325717B (zh) 2015-11-25
EP2620409A1 (en) 2013-07-31
CA2747840A1 (en) 2010-07-01
RU2011130872A (ru) 2013-01-27
EP2620408A1 (en) 2013-07-31
JP5762973B2 (ja) 2015-08-12
KR20110110781A (ko) 2011-10-07
CN102325717A (zh) 2012-01-18
WO2010072675A3 (en) 2011-04-14
JP2012513312A (ja) 2012-06-14
EP2620408B1 (en) 2016-03-09
US8877077B2 (en) 2014-11-04
AU2009331646A2 (en) 2011-09-15
EP2379440A2 (en) 2011-10-26
WO2010072675A2 (en) 2010-07-01
ES2418142T3 (es) 2013-08-12
AU2009331646A1 (en) 2011-07-28
BRPI0923536A2 (pt) 2016-01-26
EP2379440B1 (en) 2013-04-17
US20110259936A1 (en) 2011-10-27

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