MX2010007519A - Arreglo y metodo para manejar componentes electronicos. - Google Patents

Arreglo y metodo para manejar componentes electronicos.

Info

Publication number
MX2010007519A
MX2010007519A MX2010007519A MX2010007519A MX2010007519A MX 2010007519 A MX2010007519 A MX 2010007519A MX 2010007519 A MX2010007519 A MX 2010007519A MX 2010007519 A MX2010007519 A MX 2010007519A MX 2010007519 A MX2010007519 A MX 2010007519A
Authority
MX
Mexico
Prior art keywords
processing
electronic components
arrangement
processing unit
stations
Prior art date
Application number
MX2010007519A
Other languages
English (en)
Inventor
Gerard Grau
Raphael Eigeldinger
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39494219&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2010007519(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Publication of MX2010007519A publication Critical patent/MX2010007519A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Control Of Electric Motors In General (AREA)
  • Specific Conveyance Elements (AREA)
  • Automatic Assembly (AREA)
  • Control By Computers (AREA)
  • Programmable Controllers (AREA)
  • General Factory Administration (AREA)
  • Control Of Conveyors (AREA)

Abstract

El arreglo (1) para procesar componentes electrónicos, comprende: - una pluralidad de estaciones de procesamiento (3) para procesar componentes electrónicos, al menos algunas estaciones de procesamiento comprenden un accionador eléctrico (8); - un transportador (2), tal como una torreta, para transportar componentes de una estación de procesamiento a la siguiente; - una unidad de procesamiento central (5) para dirigir las estaciones de procesamiento; en donde - al menos algunas de las estaciones de procesamiento (3) comprenden una unidad de procesamiento local (7) para generar señales de comando (74) para los accionadores eléctricos (8), - porque la unidad de procesamiento central (5) se conecta a las unidades de procesamiento local (7) sobre una barra colectora electrónica (6), - y porque las instrucciones de comando digital (75) se transfieren en la barra colector electrónica (6) entre la unidad de procesamiento central (5) y las unidades de procesamiento local (7).
MX2010007519A 2008-01-16 2009-01-14 Arreglo y metodo para manejar componentes electronicos. MX2010007519A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08150324.5A EP2081034B1 (en) 2008-01-16 2008-01-16 Arrangement and method for handling electronic components
PCT/EP2009/050359 WO2009090187A1 (en) 2008-01-16 2009-01-14 Arrangement and method for handling electronic components

Publications (1)

Publication Number Publication Date
MX2010007519A true MX2010007519A (es) 2010-08-25

Family

ID=39494219

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010007519A MX2010007519A (es) 2008-01-16 2009-01-14 Arreglo y metodo para manejar componentes electronicos.

Country Status (10)

Country Link
US (1) US8280543B2 (es)
EP (1) EP2081034B1 (es)
JP (2) JP6001237B2 (es)
KR (1) KR101516270B1 (es)
CN (2) CN105899065B (es)
MA (1) MA32021B1 (es)
MX (1) MX2010007519A (es)
MY (1) MY152487A (es)
TW (1) TWI435668B (es)
WO (1) WO2009090187A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7162035B1 (en) 2000-05-24 2007-01-09 Tracer Detection Technology Corp. Authentication method and system
US8171567B1 (en) 2002-09-04 2012-05-01 Tracer Detection Technology Corp. Authentication method and system
US7995196B1 (en) 2008-04-23 2011-08-09 Tracer Detection Technology Corp. Authentication method and system
JP2011098808A (ja) * 2009-11-05 2011-05-19 Nikon Corp 基板カートリッジ、基板処理装置、基板処理システム、基板処理方法、制御装置及び表示素子の製造方法
EP2482309A1 (en) 2011-02-01 2012-08-01 OSRAM Opto Semiconductors GmbH Arrangement for processing optoelectronic devices
AT511065B1 (de) 2011-06-09 2012-09-15 Rosendahl Masch Gmbh Verfahren und vorrichtung zum prüfen von batterieplatten-paketen
US9319815B2 (en) 2011-07-14 2016-04-19 Vivint, Inc. Managing audio output through an intermediary
WO2013176537A1 (en) * 2012-05-24 2013-11-28 Exis Tech Sdn Bhd A semiconductor components delivery system associated with a turret type testing apparatus
TWI676357B (zh) * 2015-06-05 2019-11-01 美商蘭姆研究公司 配方組之執行同步系統與方法
US10743451B2 (en) * 2016-07-04 2020-08-11 Fuji Corporation Electronic component supply device
US11079994B2 (en) * 2016-11-29 2021-08-03 Fuji Corporation Mounting apparatus
DE102017220698A1 (de) * 2017-11-20 2019-05-23 Robert Bosch Gmbh Verfahren zum Konfigurieren eines elektronischen Bauteils

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354268A (en) * 1980-04-03 1982-10-12 Santek, Inc. Intelligent test head for automatic test system
JP2627992B2 (ja) * 1991-03-12 1997-07-09 東京電子交易株式会社 半導体デバイスの静電破壊試験装置
JPH06180349A (ja) * 1992-12-15 1994-06-28 Fujitsu Ltd 実力評価試験装置
JPH07228444A (ja) * 1994-02-15 1995-08-29 Hitachi Ltd エレベーターの監視装置及び制御装置
JP3472404B2 (ja) * 1996-03-15 2003-12-02 富士機械製造株式会社 電子部品供給装置
US6094642A (en) 1997-10-24 2000-07-25 Federal Express Corporation Integrated data collection and transmission system and method of tracking package data
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
US6993456B2 (en) * 1999-09-30 2006-01-31 Rockwell Automation Technologies, Inc. Mechanical-electrical template based method and apparatus
JP3523819B2 (ja) * 1999-12-10 2004-04-26 東京エレクトロン株式会社 基板処理装置
JP2002092183A (ja) * 2000-09-14 2002-03-29 Olympus Optical Co Ltd 医療機器管理システム
JP4554852B2 (ja) * 2001-09-05 2010-09-29 Ｎｅｃエンジニアリング株式会社 電子部品測定装置
JP2003084809A (ja) * 2001-09-11 2003-03-19 Techno Soft Systemnics:Kk 初期設定システム、初期設定装置およびコントローラ
AU2003221328A1 (en) * 2002-03-07 2003-09-16 Yamaha Motor Co., Ltd. Electronic part inspection device
JP2003315414A (ja) * 2002-04-19 2003-11-06 Hitachi Ltd 半導体試験装置及び試験方法
CH695871A5 (fr) * 2002-11-07 2006-09-29 Ismeca Semiconductor Holding Dispositif et procédé pour le test de composants électroniques.
MXPA05007833A (es) * 2003-01-24 2005-10-18 Siemens Ag Lecho transportador integrado.
KR20050106507A (ko) * 2003-03-07 2005-11-09 이스메카 세미컨덕터 홀딩 에스.아. 튜브로부터 전자 부품들을 추출하기 위한 방법 및 장치
JP4503954B2 (ja) * 2003-08-21 2010-07-14 株式会社日立ハイテクインスツルメンツ 基板位置決め装置及び基板位置決め方法
MY140086A (en) * 2004-07-23 2009-11-30 Advantest Corp Electronic device test apparatus and method of configuring electronic device test apparatus
JP4997713B2 (ja) * 2005-04-13 2012-08-08 株式会社大真空 圧電振動板の周波数測定方法および圧電振動板の周波数分類方法および圧電振動板の周波数測定装置および圧電振動板の周波数分類装置。
JP4775005B2 (ja) * 2006-01-26 2011-09-21 セイコーエプソン株式会社 搬送物の搬送方法、搬送物の搬送プログラム、搬送装置の位置調整装置及びｉｃハンドラー

Also Published As

Publication number Publication date
EP2081034B1 (en) 2014-03-12
JP2011514507A (ja) 2011-05-06
KR101516270B1 (ko) 2015-05-04
CN101952734A (zh) 2011-01-19
MY152487A (en) 2014-10-15
US20100280647A1 (en) 2010-11-04
TW200935995A (en) 2009-08-16
CN105899065B (zh) 2020-05-12
KR20100110327A (ko) 2010-10-12
JP6111288B2 (ja) 2017-04-05
TWI435668B (zh) 2014-04-21
MA32021B1 (fr) 2011-01-03
US8280543B2 (en) 2012-10-02
WO2009090187A1 (en) 2009-07-23
JP2015180886A (ja) 2015-10-15
CN105899065A (zh) 2016-08-24
EP2081034A1 (en) 2009-07-22
JP6001237B2 (ja) 2016-10-05

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