MX165299B - Aplicacion sin fundente de un revestimiento que comprende metal - Google Patents

Aplicacion sin fundente de un revestimiento que comprende metal

Info

Publication number
MX165299B
MX165299B MX014812A MX1481289A MX165299B MX 165299 B MX165299 B MX 165299B MX 014812 A MX014812 A MX 014812A MX 1481289 A MX1481289 A MX 1481289A MX 165299 B MX165299 B MX 165299B
Authority
MX
Mexico
Prior art keywords
metal
bath
application
uncontinued
wettable
Prior art date
Application number
MX014812A
Other languages
English (en)
Inventor
Mark Stephen Nowotarski
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of MX165299B publication Critical patent/MX165299B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
    • C23C2/0222—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating in a reactive atmosphere, e.g. oxidising or reducing atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/06—Zinc or cadmium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
    • C23C2/29—Cooling or quenching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemically Coating (AREA)
  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)
  • Laminated Bodies (AREA)

Abstract

La presente invención se refiere a un método para unir entre sí por lo menos dos superficies que comprenden metal, que comprende las etapas de: (a) proporcionar por lo menos dos superficies que comprenden metal esencialmente exentas del fundente, para ser unidas, en donde dicha superficie que comprende metal es una superficie humectable o una superficie que se hace humectable por contacto con un baño que comprende metal; (b) proporcionar un baño que comprende un revestimiento que comprende metal, capaz de formar por lo menos un compuesto dañino al humectado de dicha superficie humectable, en donde por lo menos una porción de dicho baño está protegida de la formación de este compuesto, utilizando un ambiente que es inerte con respecto a por lo menos el material de revestimiento que comprende metal, durante el período de su aplicación; y (c) poner en contacto las superficies que comprenden metal que van a unirse con el citado baño en un lugar dentro de dicho baño que está esencialmente exento de fundente y que se protege por dicho ambiente inerte, y en dicho dicha temperatura ambiental es suficientemente baja, de manera que no se hace daño a dichas superficies que comprenden metal y no se hace daño a otros materiales adyacentes a dichas superficies que comprenden metal.
MX014812A 1988-02-08 1989-02-07 Aplicacion sin fundente de un revestimiento que comprende metal MX165299B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/154,081 US4821947A (en) 1988-02-08 1988-02-08 Fluxless application of a metal-comprising coating

Publications (1)

Publication Number Publication Date
MX165299B true MX165299B (es) 1992-11-04

Family

ID=22549922

Family Applications (1)

Application Number Title Priority Date Filing Date
MX014812A MX165299B (es) 1988-02-08 1989-02-07 Aplicacion sin fundente de un revestimiento que comprende metal

Country Status (10)

Country Link
US (1) US4821947A (es)
EP (1) EP0330867B1 (es)
JP (1) JPH02147161A (es)
KR (1) KR930007144B1 (es)
AT (1) ATE91936T1 (es)
BR (1) BR8900513A (es)
CA (1) CA1337037C (es)
DE (1) DE68907745T2 (es)
ES (1) ES2042816T3 (es)
MX (1) MX165299B (es)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
BR9006515A (pt) * 1989-12-26 1991-10-01 Union Carbide Ind Gases Tech Revestimento e juncao de solda sem fundente
US5255840A (en) * 1989-12-26 1993-10-26 Praxair Technology, Inc. Fluxless solder coating and joining
US5121875A (en) * 1991-02-22 1992-06-16 Union Carbide Industrial Gases Technology Corporation Wave soldering in a protective atmosphere enclosure over a solder pot
US5176307A (en) * 1991-02-22 1993-01-05 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
GB9118115D0 (en) * 1991-08-22 1991-10-09 Multicore Solders Ltd Lead-based solder alloy and its use in soft soldering
WO1993008949A1 (fr) * 1991-10-28 1993-05-13 Jacqueline Brizais Installation de soudage a la vague
US5158224A (en) * 1992-02-24 1992-10-27 Robotic Process Systems, Inc. Soldering machine having a vertical transfer oven
GB2281309B (en) * 1993-08-27 1997-04-23 Boc Group Plc A method of galvanising
NL9301935A (nl) * 1993-11-08 1995-06-01 Soltec Bv Soldeermachine met aangepaste soldeertoren.
US5499754A (en) * 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
US5411200A (en) * 1994-02-28 1995-05-02 American Air Liquide, Inc. Process and apparatus for the wave soldering of circuit boards
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5615825A (en) * 1995-05-12 1997-04-01 Mcnc Fluorinated fluxless soldering
US6013381A (en) * 1996-12-06 2000-01-11 Mcnc Fluorinated fluxless soldering
US6758387B1 (en) * 1999-10-20 2004-07-06 Senju Metal Industry Co., Ltd. Solder coated material and method for its manufacture
DE19955659A1 (de) * 1999-11-19 2001-05-31 Messer Griesheim Gmbh Verfahren und Vorrichtung zum flussmittelfreien Löten mit reaktivgasangereicherten Metallschmelzen
KR100748613B1 (ko) * 2007-02-20 2007-08-10 김진택 다중변환 주파수를 이용한 전자유량 측정시스템.
EP1967312A1 (de) * 2007-03-06 2008-09-10 Siemens Aktiengesellschaft Verfahren zur Lötreparatur eines Bauteils unter Vakuum und einem eingestellten Sauerstoffpartialdruck

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
DE2346993C2 (de) * 1973-09-18 1975-03-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Lotbad zum fluBmittelfreien Verzinnen mittels Ultraschall
SU563240A1 (ru) * 1974-08-09 1977-06-30 Предприятие П/Я Г-4645 Устройство дл ультразвуковой пайки и лужени изделий волной припо
US3993236A (en) * 1975-09-08 1976-11-23 Blackstone Corporation Methods and apparatus for soldering
JPS5395854A (en) * 1977-02-02 1978-08-22 Asahi Glass Co Ltd Method and apparatus for soldering with no flux
JPS579011U (es) * 1980-05-31 1982-01-18
US4530457A (en) * 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
US4568012A (en) * 1982-01-14 1986-02-04 Toshiba Seiki Co., Ltd. Soldering apparatus
JPS5927771A (ja) * 1982-08-09 1984-02-14 Hitachi Ltd 半田付け装置
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
JPS6182965A (ja) * 1984-09-28 1986-04-26 Ginya Ishii 噴流はんだ装置のはんだ酸化防止方法
US4610391A (en) * 1984-12-18 1986-09-09 Union Carbide Corporation Process for wave soldering
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
JPS61286058A (ja) * 1985-06-11 1986-12-16 Meisho Kk 噴流式半田槽
US4646958A (en) * 1985-10-31 1987-03-03 International Business Machines Corp. Fluxless soldering process using a silane atmosphere
DD246718A1 (de) * 1986-03-18 1987-06-17 Univ Schiller Jena Verfahren zum rueckstandsarmen weichloeten von metallen
JPS62275568A (ja) * 1986-05-22 1987-11-30 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置

Also Published As

Publication number Publication date
DE68907745D1 (de) 1993-09-02
EP0330867B1 (en) 1993-07-28
ES2042816T3 (es) 1993-12-16
EP0330867A1 (en) 1989-09-06
CA1337037C (en) 1995-09-19
JPH02147161A (ja) 1990-06-06
BR8900513A (pt) 1989-10-03
ATE91936T1 (de) 1993-08-15
KR890013207A (ko) 1989-09-22
US4821947A (en) 1989-04-18
KR930007144B1 (ko) 1993-07-30
DE68907745T2 (de) 1993-11-11

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