MA57940B1 - Encre à base de cuivre pour une impression fine à conductivité élevée - Google Patents

Encre à base de cuivre pour une impression fine à conductivité élevée

Info

Publication number
MA57940B1
MA57940B1 MA57940A MA57940A MA57940B1 MA 57940 B1 MA57940 B1 MA 57940B1 MA 57940 A MA57940 A MA 57940A MA 57940 A MA57940 A MA 57940A MA 57940 B1 MA57940 B1 MA 57940B1
Authority
MA
Morocco
Prior art keywords
copper
ink
substrate
sintered
based ink
Prior art date
Application number
MA57940A
Other languages
English (en)
Inventor
Bhavana Deore
Chantal Paquet
Patrick Roland Lucien Malenfant
Original Assignee
Nat Res Council Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Res Council Canada filed Critical Nat Res Council Canada
Publication of MA57940B1 publication Critical patent/MA57940B1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/104—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne une encre à base de cuivre qui contient de l'acétate de cuivre, du 3-diméthylamino-1,2-propanediol et un sel d'argent. L'encre peut être appliquée sur un substrat et décomposée sur le substrat pour former un revêtement à base de cuivre conducteur sur le substrat. L'encre fournit des traces d'épaisseur micrométrique et peut être imprimée par sérigraphie et frittée thermiquement en présence d'une quantité allant jusqu'à environ 500 ppm d'oxygène ou photo-frittée dans l'air pour produire des éléments à base de cuivre hautement conducteurs. Les traces de cuivre frittées produites à partir de l'encre présentent une stabilité à l'air améliorée, et présentent une résistivité de la couche améliorée pour des lignes imprimées par sérigraphie d'une largeur de 5 à 20 mil avec une excellente résolution.
MA57940A 2017-12-22 2018-12-20 Encre à base de cuivre pour une impression fine à conductivité élevée MA57940B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762609410P 2017-12-22 2017-12-22
PCT/IB2018/060453 WO2019123384A1 (fr) 2017-12-22 2018-12-20 Encre à base de cuivre pour une impression fine à conductivité élevée

Publications (1)

Publication Number Publication Date
MA57940B1 true MA57940B1 (fr) 2022-10-31

Family

ID=66993201

Family Applications (1)

Application Number Title Priority Date Filing Date
MA57940A MA57940B1 (fr) 2017-12-22 2018-12-20 Encre à base de cuivre pour une impression fine à conductivité élevée

Country Status (9)

Country Link
US (1) US11891532B2 (fr)
EP (1) EP3728492B1 (fr)
JP (1) JP7182631B2 (fr)
KR (1) KR20200101386A (fr)
CN (1) CN111630119B (fr)
CA (1) CA3085837A1 (fr)
MA (1) MA57940B1 (fr)
TW (1) TWI783103B (fr)
WO (1) WO2019123384A1 (fr)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2619289B2 (ja) 1989-06-20 1997-06-11 三井金属鉱業株式会社 銅導電性組成物
JP2660937B2 (ja) 1990-07-16 1997-10-08 三井金属鉱業株式会社 銅導電性組成物
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
JP4799881B2 (ja) * 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
US7691294B2 (en) 2005-03-04 2010-04-06 Inktec Co., Ltd. Conductive inks and manufacturing method thereof
KR100690360B1 (ko) * 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
US9833836B2 (en) * 2008-06-23 2017-12-05 Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. Core-shell metallic nanoparticles, methods of production thereof, and ink compositions containing same
JP5521207B2 (ja) 2009-01-28 2014-06-11 東ソー株式会社 導電膜形成用組成物及びその製造方法、並びに導電膜の形成方法
JP2011034750A (ja) * 2009-07-31 2011-02-17 Tosoh Corp 導電膜形成用組成物、及び導電膜形成法
EP2820093A2 (fr) * 2012-02-29 2015-01-07 Yissum Research Development Company of the Hebrew University of Jerusalem Ltd. Encres contenant des nanoparticules précurseurs métalliques
JP5923351B2 (ja) * 2012-03-16 2016-05-24 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
CN103897494B (zh) * 2012-12-27 2017-10-27 Jsr株式会社 铜膜形成用组合物、铜膜形成方法、铜膜、配线基板以及电子设备
KR20140108113A (ko) * 2013-02-28 2014-09-05 제이에스알 가부시끼가이샤 금속막 형성 방법, 상기 방법에 이용하는 도전성 잉크, 다층 배선 기판, 반도체 기판, 및 커패시터 셀
JP2014196384A (ja) * 2013-03-29 2014-10-16 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP6156991B2 (ja) * 2013-07-25 2017-07-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
JP6254025B2 (ja) * 2014-03-12 2017-12-27 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
WO2015152625A1 (fr) * 2014-04-01 2015-10-08 전자부품연구원 Composition d'encre de frittage par la lumière, carte de câblage l'utilisant et son procédé de fabrication
WO2015198022A1 (fr) * 2014-06-23 2015-12-30 Alpha Metals, Inc. Particules nanométriques et micrométriques métalliques multicouches
US20160057866A1 (en) * 2014-08-19 2016-02-25 Jsr Corporation Metal film forming method and conductive ink used in said method
US9809489B2 (en) 2014-09-12 2017-11-07 Jsr Corporation Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
CN105694596A (zh) * 2016-04-08 2016-06-22 苏州捷德瑞精密机械有限公司 一种低银铜基导电油墨及其制备方法
CN106147405A (zh) * 2016-07-06 2016-11-23 复旦大学 铜导电油墨及铜导电油墨、铜导电薄膜的制备方法

Also Published As

Publication number Publication date
WO2019123384A1 (fr) 2019-06-27
US20210079247A1 (en) 2021-03-18
EP3728492B1 (fr) 2022-08-17
JP7182631B2 (ja) 2022-12-02
US11891532B2 (en) 2024-02-06
CN111630119A (zh) 2020-09-04
CN111630119B (zh) 2022-10-25
EP3728492A4 (fr) 2021-09-22
JP2021507967A (ja) 2021-02-25
KR20200101386A (ko) 2020-08-27
TWI783103B (zh) 2022-11-11
TW201934681A (zh) 2019-09-01
CA3085837A1 (fr) 2019-06-27
EP3728492A1 (fr) 2020-10-28

Similar Documents

Publication Publication Date Title
Lim et al. Solvent effect of inkjet printed source/drain electrodes on electrical properties of polymer thin-film transistors
EP2475234A3 (fr) Substrat pour carte de circuit imprimé, carte de circuit imprimé et ses procédés de fabrication
JP2006245231A5 (fr)
JP2010519780A5 (fr)
JP6481784B2 (ja) デバイス製造方法
WO2011084666A3 (fr) Trous d'interconnexion métalliques super remplis pour dispositifs à semi-conducteurs
JP2006164950A5 (fr)
TWI510372B (zh) 電極、含其之電子裝置及其製造方法
JP2005314802A5 (fr)
WO2008099932A1 (fr) Film conducteur transparent et procédé de production de celui-ci
JP2013247225A5 (fr)
MA57940B1 (fr) Encre à base de cuivre pour une impression fine à conductivité élevée
US20160255721A1 (en) Printed circuit board precursor
JP2006032939A5 (fr)
JP2016096246A5 (ja) フレキシブルプリント配線板のソルダーレジスト形成方法、及びプリント配線板
JP2006165595A5 (fr)
ATE518250T1 (de) Metallbasis-nanodraht-transistor
JP2016031889A5 (fr)
TW201817291A (zh) 可伸縮電路板及其製作方法
JP2006331714A5 (fr)
BR0315903A (pt) Método para a formação de uma boa superfìcie de contato sobre uma barra de suporte de alumìnio e uma barra de suporte
WO2007133926A3 (fr) Connecteur pelliculé pour lampe
CN104022754A (zh) 一种新型石英晶振片
TW200737558A (en) Method of forming a phase-changeable structure
JP2011069938A5 (fr)