MA54532A - Presse de frittage pour frittage de composants électroniques sur un substrat - Google Patents

Presse de frittage pour frittage de composants électroniques sur un substrat

Info

Publication number
MA54532A
MA54532A MA054532A MA54532A MA54532A MA 54532 A MA54532 A MA 54532A MA 054532 A MA054532 A MA 054532A MA 54532 A MA54532 A MA 54532A MA 54532 A MA54532 A MA 54532A
Authority
MA
Morocco
Prior art keywords
sintering
substrate
electronic components
press
sintering press
Prior art date
Application number
MA054532A
Other languages
English (en)
Inventor
Nicola Schivalocchi
Original Assignee
Amx Automatrix S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amx Automatrix S R L filed Critical Amx Automatrix S R L
Publication of MA54532A publication Critical patent/MA54532A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/34—Heating or cooling presses or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B30B15/067—Press rams with means for equalizing the pressure exerted by a plurality of press rams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/7531—Shape of other parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75982—Shape
    • H01L2224/75984—Shape of other portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83053—Bonding environment
    • H01L2224/83095—Temperature settings
    • H01L2224/83096—Transient conditions
    • H01L2224/83097—Heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Press Drives And Press Lines (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MA054532A 2018-12-20 2019-12-17 Presse de frittage pour frittage de composants électroniques sur un substrat MA54532A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102018000020275A IT201800020275A1 (it) 2018-12-20 2018-12-20 Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato

Publications (1)

Publication Number Publication Date
MA54532A true MA54532A (fr) 2022-03-30

Family

ID=66166285

Family Applications (1)

Application Number Title Priority Date Filing Date
MA054532A MA54532A (fr) 2018-12-20 2019-12-17 Presse de frittage pour frittage de composants électroniques sur un substrat

Country Status (8)

Country Link
US (1) US11820095B2 (fr)
EP (1) EP3900024A1 (fr)
JP (1) JP7444479B2 (fr)
KR (1) KR20210107649A (fr)
CN (1) CN113169093A (fr)
IT (1) IT201800020275A1 (fr)
MA (1) MA54532A (fr)
WO (1) WO2020128832A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT17830U1 (de) * 2021-10-18 2023-04-15 Iag Ind Automatisierungsgesellschaft M B H Presswerkzeug zum Verpressen von Compoundmischungen
US20230280218A1 (en) * 2022-03-01 2023-09-07 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device
WO2024042155A1 (fr) * 2022-08-25 2024-02-29 Pink Gmbh Thermosysteme Dispositif et procédé de frittage
CN115394689B (zh) * 2022-09-05 2023-09-01 江苏富乐华功率半导体研究院有限公司 一种功率半导体器件热压烧结装置
DE102022130928B3 (de) 2022-11-22 2024-04-18 Semikron Danfoss GmbH Verfahren zum Drucksintern, Unterwerkzeug für eine Sinterpresse und Sinterpresse mit einem solchen Unterwerkzeug

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619896A (en) * 1969-02-27 1971-11-16 Nasa Thermal compression bonding of interconnectors
US4087037A (en) * 1976-07-09 1978-05-02 Mcdonnell Douglas Corporation Method of and tools for producing superplastically formed and diffusion bonded structures
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
JP2695352B2 (ja) * 1992-07-27 1997-12-24 株式会社日立製作所 多層セラミック基板の製造装置
KR100357881B1 (ko) * 1999-03-09 2002-10-25 앰코 테크놀로지 코리아 주식회사 반도체 장치의 제조장비 및 그 제어방법
JP3737331B2 (ja) * 1999-03-31 2006-01-18 Ｓｐｓシンテックス株式会社 粉体の自動充填方法及び装置
TW569062B (en) * 2001-12-25 2004-01-01 Toshiba Corp Thermal bonding device and method
KR100518978B1 (ko) * 2003-07-23 2005-10-06 주식회사 탑 엔지니어링 플립칩 본더장치
JP4206320B2 (ja) * 2003-09-19 2009-01-07 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
DE102004008450B4 (de) * 2004-02-16 2008-12-11 Prettl, Rolf Verfahren und Vorrichtung zum Herstellen eines Verbundbauteiles
KR100622524B1 (ko) * 2005-03-08 2006-09-13 진인태 열간금속판재 소성유동 고상접합장치 및 접합방법
US7748595B2 (en) * 2005-03-08 2010-07-06 In Tai Jin Apparatus and method for hot bonding metal plates
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
US8652260B2 (en) * 2008-08-08 2014-02-18 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for holding semiconductor wafers
TWI564106B (zh) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 接合裝置以及接合方法
JP5892682B2 (ja) * 2011-04-27 2016-03-23 アピックヤマダ株式会社 接合方法
JP5659427B2 (ja) * 2011-06-28 2015-01-28 アピックヤマダ株式会社 平行昇降機構および半導体製造装置
JP5189194B2 (ja) * 2011-09-05 2013-04-24 ミカドテクノス株式会社 真空加熱接合装置及び真空加熱接合方法
JP2013081971A (ja) 2011-10-06 2013-05-09 Sumitomo Bakelite Co Ltd 加圧加熱装置、及び、電子部品の製造方法
TWI466253B (zh) * 2012-10-08 2014-12-21 Ind Tech Res Inst 雙相介金屬接點結構及其製作方法
JP5906392B2 (ja) * 2012-12-28 2016-04-20 パナソニックＩｐマネジメント株式会社 圧着装置
JP5592554B1 (ja) * 2013-12-18 2014-09-17 武延 本郷 冷間圧接装置、コイル製造装置、コイルおよびその製造方法
CN106471611A (zh) * 2015-03-31 2017-03-01 新电元工业株式会社 接合装置、接合方法以及加压单元
JP2017026505A (ja) * 2015-07-24 2017-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN105033440A (zh) * 2015-08-10 2015-11-11 苏州听毅华自动化设备有限公司 一种工件压接成型装置
CN106003783B (zh) * 2016-07-04 2018-01-02 安徽东海机床制造有限公司 一种大吨位回转移动液压机
IT201700000191A1 (it) * 2017-01-02 2018-07-02 Amx Automatrix S R L Pressa e metodo di sinterizzazione di componenti elettronici su un substrato
CN110621503B (zh) * 2017-02-08 2022-09-16 Gkn烧结金属工程有限公司 具有偏移补偿的工具组
IT202000023641A1 (it) * 2020-10-07 2022-04-07 St Microelectronics Srl Elemento di bloccaggio dei piedini di connessione di piastrine semiconduttrici, in particolare per moduli di potenza per applicazioni automobilistiche, e metodo di assemblaggio
CN113305411A (zh) * 2021-04-25 2021-08-27 樊雄佳 一种用于新材料焊接的真空扩散焊

Also Published As

Publication number Publication date
CN113169093A (zh) 2021-07-23
JP2022510801A (ja) 2022-01-28
KR20210107649A (ko) 2021-09-01
IT201800020275A1 (it) 2020-06-20
JP7444479B2 (ja) 2024-03-06
US11820095B2 (en) 2023-11-21
EP3900024A1 (fr) 2021-10-27
US20220001637A1 (en) 2022-01-06
WO2020128832A1 (fr) 2020-06-25

Similar Documents

Publication Publication Date Title
MA54532A (fr) Presse de frittage pour frittage de composants électroniques sur un substrat
SG11202103273WA (en) Method for forming molybdenum films on a substrate
EP4235766A3 (fr) Structure d'emballage de semi-conducteur et son procédé de formation
EP3818775A4 (fr) Dispositif électronique de gestion de porteuse et procédé de fonctionnement associé
GB2608902B (en) Multilayer piezolelectric substrate
MA54524A (fr) Presse de frittage pour de frittage de composants électroniques sur un substrat
MY192578A (en) Molding system for applying a uniform clamping pressure onto a substrate
WO2015135725A3 (fr) Module électronique ainsi que procédé et dispositif de fabrication d'un module électronique
FR3058258B1 (fr) Procede de fabrication de plots d'assemblage sur un support pour l'auto-assemblage d'un circuit electronique sur le support
PL3840024T3 (pl) Moduł do chemicznej obróbki podłoża
EP3867729A4 (fr) Gestion thermique pour dispositifs électroniques modulaires
FR3068502B1 (fr) Procede de realisation d'elements de micro-images sur un substrat
GB2576315B (en) A case for a mobile electronic device
PL3768654T3 (pl) Podłoże miedziano-ceramiczne
EP3648555A4 (fr) Procédé de fabrication d'un ensemble couche céramique-métal, procédé de fabrication d'une carte de circuit imprimé céramique, et plaque de matériau de base céramique reliée à une plaque métallique
PT3539792T (pt) Método para o fabrico de estruturas num substrato
ITUA20164817A1 (it) Substrato circuitizzato con componenti elettronici montati su sua porzione trasversale
GB2589800B (en) Printed circuit board substrate comprising a coated boron nitride
EP3740340A4 (fr) Procédé de durcissement de pâte à souder sur un substrat thermiquement fragile
IL275842A (en) Composite-interfacing biomaterial accelerant substrate
PL3888428T3 (pl) Niskonakładowy sposób osadzania lutu lub kleju we wzór do tworzenia zespołów elektronicznych
SG11202003223WA (en) Press part for supporting a mould part for encapsulating electronic components mounted on a carrier and a press comprising the press part
EP3712944A4 (fr) Ensemble puce et ensemble moule pour sa fabrication, caméra et dispositif électronique
EP3684045A4 (fr) Module de caméra, et composant photosensible, dispositif électronique, moule de formation et son procédé de fabrication
EP3637965A4 (fr) Carte pour monter un composant électronique et son procédé de fabrication