PL3840024T3 - Moduł do chemicznej obróbki podłoża - Google Patents

Moduł do chemicznej obróbki podłoża

Info

Publication number
PL3840024T3
PL3840024T3 PL19218508T PL19218508T PL3840024T3 PL 3840024 T3 PL3840024 T3 PL 3840024T3 PL 19218508 T PL19218508 T PL 19218508T PL 19218508 T PL19218508 T PL 19218508T PL 3840024 T3 PL3840024 T3 PL 3840024T3
Authority
PL
Poland
Prior art keywords
module
substrate
chemical treatment
chemical
treatment
Prior art date
Application number
PL19218508T
Other languages
English (en)
Inventor
Andreas Gleissner
Herbert Ötzlinger
Oliver Knoll
Raoul Schröder
Original Assignee
Semsysco Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semsysco Gmbh filed Critical Semsysco Gmbh
Publication of PL3840024T3 publication Critical patent/PL3840024T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
PL19218508T 2019-12-20 2019-12-20 Moduł do chemicznej obróbki podłoża PL3840024T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19218508.0A EP3840024B1 (en) 2019-12-20 2019-12-20 Module for chemically processing a substrate

Publications (1)

Publication Number Publication Date
PL3840024T3 true PL3840024T3 (pl) 2022-05-09

Family

ID=69411088

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19218508T PL3840024T3 (pl) 2019-12-20 2019-12-20 Moduł do chemicznej obróbki podłoża

Country Status (10)

Country Link
US (1) US11938522B2 (pl)
EP (2) EP4016597A1 (pl)
JP (2) JP7760489B2 (pl)
KR (1) KR20220051004A (pl)
CN (1) CN114144869A (pl)
MY (1) MY195775A (pl)
PL (1) PL3840024T3 (pl)
PT (1) PT3840024T (pl)
TW (1) TWI819302B (pl)
WO (1) WO2021121949A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114318285B (zh) * 2021-12-31 2022-10-18 广东省新兴激光等离子体技术研究院 真空镀膜设备及其镀膜方法
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate
DE102023211090A1 (de) * 2023-11-08 2025-05-08 Semsysco Gmbh Ein verschlusssystem für eine behandlungskammer

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6227788U (pl) * 1985-08-06 1987-02-19
US6240938B1 (en) * 1996-05-29 2001-06-05 Steag Microtech Gmbh Device for treating substrates in a fluid container
JP2000308857A (ja) * 1999-04-27 2000-11-07 Tokyo Electron Ltd 液処理方法及び液処理装置
US6457199B1 (en) * 2000-10-12 2002-10-01 Lam Research Corporation Substrate processing in an immersion, scrub and dry system
US6532974B2 (en) * 2001-04-06 2003-03-18 Akrion Llc Process tank with pressurized mist generation
US6726848B2 (en) * 2001-12-07 2004-04-27 Scp Global Technologies, Inc. Apparatus and method for single substrate processing
US20080000495A1 (en) * 2001-12-07 2008-01-03 Eric Hansen Apparatus and method for single substrate processing
JP3948960B2 (ja) * 2002-01-16 2007-07-25 東京エレクトロン株式会社 超音波洗浄装置
US7156927B2 (en) * 2002-04-03 2007-01-02 Fsi International, Inc. Transition flow treatment process and apparatus
US6875289B2 (en) * 2002-09-13 2005-04-05 Fsi International, Inc. Semiconductor wafer cleaning systems and methods
KR20040041763A (ko) * 2002-11-11 2004-05-20 삼성전자주식회사 반도체 웨이퍼 세정시스템 및 그 방법
JP2006093334A (ja) * 2004-09-22 2006-04-06 Ses Co Ltd 基板処理装置
US7775219B2 (en) * 2006-12-29 2010-08-17 Applied Materials, Inc. Process chamber lid and controlled exhaust
US20080163890A1 (en) * 2007-01-10 2008-07-10 Applied Materials, Inc. Tunable megasonics cavitation process using multiple transducers for cleaning nanometer particles without structure damage
JP2009125734A (ja) 2007-11-28 2009-06-11 Nidec Sankyo Corp 洗浄装置
JP2010125375A (ja) 2008-11-27 2010-06-10 Nidec Sankyo Corp 洗浄装置
KR20100066010A (ko) * 2008-12-09 2010-06-17 세메스 주식회사 기판 세정 건조 장치 및 방법
JP2011165694A (ja) 2010-02-04 2011-08-25 Sumco Corp ウェーハの超音波洗浄方法および超音波洗浄装置
JP5923300B2 (ja) * 2011-12-28 2016-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6040092B2 (ja) * 2013-04-23 2016-12-07 株式会社荏原製作所 基板めっき装置及び基板めっき方法
JP2015185632A (ja) * 2014-03-24 2015-10-22 株式会社荏原製作所 基板処理装置
SG11202001663XA (en) * 2017-09-08 2020-03-30 Acm Research Shanghai Inc Method and apparatus for cleaning semiconductor wafer

Also Published As

Publication number Publication date
CN114144869A (zh) 2022-03-04
PT3840024T (pt) 2022-04-12
US11938522B2 (en) 2024-03-26
EP3840024A1 (en) 2021-06-23
US20230226578A1 (en) 2023-07-20
TWI819302B (zh) 2023-10-21
WO2021121949A1 (en) 2021-06-24
EP3840024B1 (en) 2022-02-16
EP4016597A1 (en) 2022-06-22
JP2025124795A (ja) 2025-08-26
MY195775A (en) 2023-02-13
TW202224054A (zh) 2022-06-16
KR20220051004A (ko) 2022-04-25
JP7760489B2 (ja) 2025-10-27
JP2022546224A (ja) 2022-11-04

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