LU90134B1 - Déposition chimique en phase vapeur de nitrure de titane assistée par plasma en utilisant de l'ammoniac - Google Patents

Déposition chimique en phase vapeur de nitrure de titane assistée par plasma en utilisant de l'ammoniac Download PDF

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Publication number
LU90134B1
LU90134B1 LU90134A LU90134A LU90134B1 LU 90134 B1 LU90134 B1 LU 90134B1 LU 90134 A LU90134 A LU 90134A LU 90134 A LU90134 A LU 90134A LU 90134 B1 LU90134 B1 LU 90134B1
Authority
LU
Luxembourg
Prior art keywords
ammonia
plasma
vapor deposition
chemical vapor
titanium nitride
Prior art date
Application number
LU90134A
Other languages
English (en)
Inventor
Joseph T Hillman
Robert F Foster
Rikhit Arora
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Application granted granted Critical
Publication of LU90134B1 publication Critical patent/LU90134B1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45557—Pulsed pressure or control pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
LU90134A 1995-03-10 1997-09-10 Déposition chimique en phase vapeur de nitrure de titane assistée par plasma en utilisant de l'ammoniac LU90134B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/401,859 US5610106A (en) 1995-03-10 1995-03-10 Plasma enhanced chemical vapor deposition of titanium nitride using ammonia
PCT/US1995/015427 WO1996028586A1 (fr) 1995-03-10 1995-11-27 Depot active au plasma, en phase gazeuse et par procede chimique, de nitrure de titane au moyen d'ammoniac

Publications (1)

Publication Number Publication Date
LU90134B1 true LU90134B1 (fr) 1997-11-27

Family

ID=23589517

Family Applications (1)

Application Number Title Priority Date Filing Date
LU90134A LU90134B1 (fr) 1995-03-10 1997-09-10 Déposition chimique en phase vapeur de nitrure de titane assistée par plasma en utilisant de l'ammoniac

Country Status (9)

Country Link
US (1) US5610106A (fr)
JP (1) JPH11501987A (fr)
KR (1) KR100356264B1 (fr)
AU (1) AU4463596A (fr)
CH (1) CH689640A5 (fr)
DE (1) DE19581936T1 (fr)
LU (1) LU90134B1 (fr)
TW (1) TW369675B (fr)
WO (1) WO1996028586A1 (fr)

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US6037252A (en) * 1997-11-05 2000-03-14 Tokyo Electron Limited Method of titanium nitride contact plug formation
US5997649A (en) * 1998-04-09 1999-12-07 Tokyo Electron Limited Stacked showerhead assembly for delivering gases and RF power to a reaction chamber
US6635569B1 (en) * 1998-04-20 2003-10-21 Tokyo Electron Limited Method of passivating and stabilizing a Ti-PECVD process chamber and combined Ti-PECVD/TiN-CVD processing method and apparatus
US6022800A (en) * 1998-04-29 2000-02-08 Worldwide Semiconductor Manufacturing Corporation Method of forming barrier layer for tungsten plugs in interlayer dielectrics
US6289842B1 (en) 1998-06-22 2001-09-18 Structured Materials Industries Inc. Plasma enhanced chemical vapor deposition system
US6302057B1 (en) 1998-09-15 2001-10-16 Tokyo Electron Limited Apparatus and method for electrically isolating an electrode in a PECVD process chamber
US6364954B2 (en) 1998-12-14 2002-04-02 Applied Materials, Inc. High temperature chemical vapor deposition chamber
US6221174B1 (en) 1999-02-11 2001-04-24 Applied Materials, Inc. Method of performing titanium/titanium nitride integration
GB2347686B (en) * 1999-03-08 2003-06-11 Trikon Holdings Ltd Gas delivery system
US6555183B2 (en) 1999-06-11 2003-04-29 Applied Materials, Inc. Plasma treatment of a titanium nitride film formed by chemical vapor deposition
US6548402B2 (en) 1999-06-11 2003-04-15 Applied Materials, Inc. Method of depositing a thick titanium nitride film
US6328871B1 (en) * 1999-08-16 2001-12-11 Applied Materials, Inc. Barrier layer for electroplating processes
US6436819B1 (en) 2000-02-01 2002-08-20 Applied Materials, Inc. Nitrogen treatment of a metal nitride/metal stack
US6436820B1 (en) 2000-02-03 2002-08-20 Applied Materials, Inc Method for the CVD deposition of a low residual halogen content multi-layered titanium nitride film having a combined thickness greater than 1000 Å
US6399490B1 (en) 2000-06-29 2002-06-04 International Business Machines Corporation Highly conformal titanium nitride deposition process for high aspect ratio structures
US6403478B1 (en) 2000-08-31 2002-06-11 Chartered Semiconductor Manufacturing Company Low pre-heat pressure CVD TiN process
US6508919B1 (en) * 2000-11-28 2003-01-21 Tokyo Electron Limited Optimized liners for dual damascene metal wiring
US7563715B2 (en) 2005-12-05 2009-07-21 Asm International N.V. Method of producing thin films
US9139906B2 (en) * 2001-03-06 2015-09-22 Asm America, Inc. Doping with ALD technology
TWI253478B (en) * 2001-11-14 2006-04-21 Mitsubishi Heavy Ind Ltd Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
US6750146B2 (en) * 2002-04-03 2004-06-15 United Microelectronics Corp. Method for forming barrier layer
US6858524B2 (en) * 2002-12-03 2005-02-22 Asm International, Nv Method of depositing barrier layer for metal gates
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KR100568256B1 (ko) * 2003-12-11 2006-04-07 삼성전자주식회사 반도체 소자 제조 장비의 세정 방법
KR100615602B1 (ko) 2004-09-15 2006-08-25 삼성전자주식회사 매끄러운 표면을 갖는 타이타늄 나이트라이드 막의 형성방법들 및 이를 이용한 반도체 장치의 형성방법들
JP5020230B2 (ja) * 2006-02-24 2012-09-05 東京エレクトロン株式会社 Ｔｉ系膜の成膜方法および記憶媒体
KR101427142B1 (ko) * 2006-10-05 2014-08-07 에이에스엠 아메리카, 인코포레이티드 금속 규산염 막의 원자층 증착
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Also Published As

Publication number Publication date
WO1996028586A1 (fr) 1996-09-19
KR19980702877A (ko) 1998-08-05
DE19581936T1 (de) 1998-04-16
AU4463596A (en) 1996-10-02
KR100356264B1 (ko) 2002-11-18
CH689640A5 (de) 1999-07-30
TW369675B (en) 1999-09-11
JPH11501987A (ja) 1999-02-16
US5610106A (en) 1997-03-11

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