KR980005945A - 와이어 본딩 방법 및 그 장치 - Google Patents

와이어 본딩 방법 및 그 장치 Download PDF

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Publication number
KR980005945A
KR980005945A KR1019970027584A KR19970027584A KR980005945A KR 980005945 A KR980005945 A KR 980005945A KR 1019970027584 A KR1019970027584 A KR 1019970027584A KR 19970027584 A KR19970027584 A KR 19970027584A KR 980005945 A KR980005945 A KR 980005945A
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KR
South Korea
Prior art keywords
wire bonding
wire
semiconductor
semiconductor pellets
row
Prior art date
Application number
KR1019970027584A
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English (en)
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KR100273881B1 (ko
Inventor
모또히사 모리
Original Assignee
가네꼬 히사시
닛뽕덴끼 가부시끼가이샤
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Publication of KR980005945A publication Critical patent/KR980005945A/ko
Application granted granted Critical
Publication of KR100273881B1 publication Critical patent/KR100273881B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

복수열 배열된 반도체 펠릿을 인식 카메라로 인식하여 와이어 본딩할 때에 생기는 본딩 헤드의 리턴에 의한 로스 시간을 없애 생산성을 향상시킨다. 반도체 펠릿 (8) 을 화상 인식하는 인식 카메라 (18), (19) 를 와이어 본딩 헤드부의 본딩 툴 (17) 의 양 사이드 측에 각각 부착, 와이어 본딩 헤드부의 일방향의 이동 및 그와 역방향 이동의 양자에서, 반도체 펠릿의 와이어 본딩 중에 다른 반도체 펠릿의 인식을 행한다.

Description

와이어 본딩 방법 및 그 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 5 는 본 발명의 제 1 실시의 형태의 와이어 본딩 헤드부의 이동을 나타내는 도면.
제5a도는 평면도.
제5b도는 측면도이다.

Claims (3)

  1. 장척의 리드 프레임 상에 다이 본딩되어, 일정 피치로 배열되고, 또한 그 배열이 복수열로 되어 있는 다수의 반도체 펠릿의 각각의 전극과 상기 리드프레임의 리드를 배선하는 와이어 본딩 방법에 있어서, 반도체 펠릿을 화상인식하는 인식 카메라를 와이어 본딩 헤드부의 본딩 툴의 이동방향의 전방측 및 후방측에 각각, 그 본딩 툴로부터 소정의 피치 수만큼 이간한 위치에 부착하여 상기 와이어 본딩 헤드부의 일방향의 이동 및 그와 역방향 이동의 양자에서, 반도체 펠릿의 와이어 본딩 중에 다른 반도체 펠릿의 인식을 행하는 것을 특징으로 하는 와이어 본딩 방법.
  2. 제 1 항에 있어서, 상기 본딩 툴에 의해 와이어 본딩되어 있는 반도체 펠릿이 속하는 열과는 다른 열의 반도체 펠릿을 상기 인식 카메라의 일방에서 인식하는 것을 특징으로 하는 와이어 본딩 방법.
  3. 제 2 항에 있어서, 상기 다른 열은 와이어 본딩되어 있는 반도체 펠릿이 속하는 열의 다음 열인 것을 특징으로 하는 와이어 본딩 방법,
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970027584A 1996-06-27 1997-06-26 와이어본딩방법 KR100273881B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8167383A JP2751922B2 (ja) 1996-06-27 1996-06-27 ワイヤボンディング方法及びその装置
JP96-167383 1996-06-27

Publications (2)

Publication Number Publication Date
KR980005945A true KR980005945A (ko) 1998-03-30
KR100273881B1 KR100273881B1 (ko) 2001-01-15

Family

ID=15848698

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970027584A KR100273881B1 (ko) 1996-06-27 1997-06-26 와이어본딩방법

Country Status (2)

Country Link
JP (1) JP2751922B2 (ko)
KR (1) KR100273881B1 (ko)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04372142A (ja) * 1991-06-21 1992-12-25 Mitsubishi Electric Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
KR100273881B1 (ko) 2001-01-15
JP2751922B2 (ja) 1998-05-18
JPH1012656A (ja) 1998-01-16

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