KR970707199A - 붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs) - Google Patents
붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs) Download PDFInfo
- Publication number
- KR970707199A KR970707199A KR1019970702607A KR19970702607A KR970707199A KR 970707199 A KR970707199 A KR 970707199A KR 1019970702607 A KR1019970702607 A KR 1019970702607A KR 19970702607 A KR19970702607 A KR 19970702607A KR 970707199 A KR970707199 A KR 970707199A
- Authority
- KR
- South Korea
- Prior art keywords
- boric acid
- epoxy resin
- catalyst
- phr
- acid compound
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/19—Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9421407.9 | 1994-10-21 | ||
GB9421407A GB9421407D0 (en) | 1994-10-21 | 1994-10-21 | Curable epoxy resin accelerated by boric acid and its analogs |
PCT/US1995/013360 WO1996012752A2 (en) | 1994-10-21 | 1995-10-13 | Curable epoxy resin accelerated by boric acid and its analogs |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970707199A true KR970707199A (ko) | 1997-12-01 |
Family
ID=10763298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970702607A KR970707199A (ko) | 1994-10-21 | 1995-10-13 | 붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs) |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0787162A2 (ja) |
JP (1) | JPH10507481A (ja) |
KR (1) | KR970707199A (ja) |
BR (1) | BR9509395A (ja) |
GB (1) | GB9421407D0 (ja) |
TW (1) | TW294700B (ja) |
WO (1) | WO1996012752A2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9421405D0 (en) | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
KR100431440B1 (ko) * | 2001-05-04 | 2004-05-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 |
KR100431439B1 (ko) * | 2001-05-08 | 2004-05-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 |
US20080039595A1 (en) * | 2006-06-07 | 2008-02-14 | Joseph Gan | Oligomeric halogenated chain extenders for preparing epoxy resins |
US7919567B2 (en) | 2006-06-07 | 2011-04-05 | Dow Global Technologies Llc | Oligomeric halogenated chain extenders for preparing epoxy resins |
SG172872A1 (en) * | 2009-01-06 | 2011-08-29 | Dow Global Technologies Llc | Metal stabilizers for epoxy resins and advancement process |
DE102009027826A1 (de) | 2009-04-29 | 2010-11-04 | Evonik Degussa Gmbh | Katalyse von Epoxidharzformulierungen |
CN103492483A (zh) * | 2011-05-02 | 2014-01-01 | 陶氏环球技术有限责任公司 | 环氧树脂中的硼酸三甲酯 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6050371B2 (ja) * | 1981-10-30 | 1985-11-08 | 株式会社東芝 | エポキシ樹脂組成物 |
JPH02103224A (ja) * | 1988-10-12 | 1990-04-16 | Three Bond Co Ltd | エポキシ樹脂用潜在性硬化剤 |
JPH0340459A (ja) * | 1989-07-07 | 1991-02-21 | Nitto Denko Corp | 半導体装置 |
SG43193A1 (en) * | 1990-05-21 | 1997-10-17 | Dow Chemical Co | Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom |
JPH04284652A (ja) * | 1991-03-13 | 1992-10-09 | Nitto Denko Corp | 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物ならびにその製法 |
-
1994
- 1994-10-21 GB GB9421407A patent/GB9421407D0/en active Pending
-
1995
- 1995-10-13 EP EP95937501A patent/EP0787162A2/en not_active Ceased
- 1995-10-13 WO PCT/US1995/013360 patent/WO1996012752A2/en not_active Application Discontinuation
- 1995-10-13 KR KR1019970702607A patent/KR970707199A/ko not_active Application Discontinuation
- 1995-10-13 JP JP8513519A patent/JPH10507481A/ja active Pending
- 1995-10-13 BR BR9509395A patent/BR9509395A/pt not_active Application Discontinuation
- 1995-10-19 TW TW084111048A patent/TW294700B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW294700B (ja) | 1997-01-01 |
EP0787162A2 (en) | 1997-08-06 |
WO1996012752A2 (en) | 1996-05-02 |
WO1996012752A3 (en) | 1996-07-18 |
GB9421407D0 (en) | 1994-12-07 |
BR9509395A (pt) | 1997-09-30 |
JPH10507481A (ja) | 1998-07-21 |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |