GB9421407D0 - Curable epoxy resin accelerated by boric acid and its analogs - Google Patents

Curable epoxy resin accelerated by boric acid and its analogs

Info

Publication number
GB9421407D0
GB9421407D0 GB9421407A GB9421407A GB9421407D0 GB 9421407 D0 GB9421407 D0 GB 9421407D0 GB 9421407 A GB9421407 A GB 9421407A GB 9421407 A GB9421407 A GB 9421407A GB 9421407 D0 GB9421407 D0 GB 9421407D0
Authority
GB
United Kingdom
Prior art keywords
analogs
epoxy resin
boric acid
curable epoxy
accelerated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB9421407A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Priority to GB9421407A priority Critical patent/GB9421407D0/en
Publication of GB9421407D0 publication Critical patent/GB9421407D0/en
Priority to CN95196349A priority patent/CN1164245A/zh
Priority to PCT/US1995/013360 priority patent/WO1996012752A2/en
Priority to JP8513519A priority patent/JPH10507481A/ja
Priority to EP95937501A priority patent/EP0787162A2/en
Priority to BR9509395A priority patent/BR9509395A/pt
Priority to KR1019970702607A priority patent/KR970707199A/ko
Priority to TW084111048A priority patent/TW294700B/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
GB9421407A 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs Pending GB9421407D0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB9421407A GB9421407D0 (en) 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs
CN95196349A CN1164245A (zh) 1994-10-21 1995-10-13 用硼酸或其类似物加速固化的可固化环氧树脂
PCT/US1995/013360 WO1996012752A2 (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs
JP8513519A JPH10507481A (ja) 1994-10-21 1995-10-13 硼酸及びその同族体により促進された硬化性エポキシ樹脂
EP95937501A EP0787162A2 (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs
BR9509395A BR9509395A (pt) 1994-10-21 1995-10-13 Processo para curar uma composição curável
KR1019970702607A KR970707199A (ko) 1994-10-21 1995-10-13 붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs)
TW084111048A TW294700B (ja) 1994-10-21 1995-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9421407A GB9421407D0 (en) 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs

Publications (1)

Publication Number Publication Date
GB9421407D0 true GB9421407D0 (en) 1994-12-07

Family

ID=10763298

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9421407A Pending GB9421407D0 (en) 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs

Country Status (7)

Country Link
EP (1) EP0787162A2 (ja)
JP (1) JPH10507481A (ja)
KR (1) KR970707199A (ja)
BR (1) BR9509395A (ja)
GB (1) GB9421407D0 (ja)
TW (1) TW294700B (ja)
WO (1) WO1996012752A2 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100431440B1 (ko) * 2001-05-04 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
KR100431439B1 (ko) * 2001-05-08 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
US7919567B2 (en) 2006-06-07 2011-04-05 Dow Global Technologies Llc Oligomeric halogenated chain extenders for preparing epoxy resins
US20080039595A1 (en) * 2006-06-07 2008-02-14 Joseph Gan Oligomeric halogenated chain extenders for preparing epoxy resins
EP2385962B1 (en) * 2009-01-06 2015-09-02 Dow Global Technologies LLC Metal stabilizers for epoxy resins and advancement process
DE102009027826A1 (de) * 2009-04-29 2010-11-04 Evonik Degussa Gmbh Katalyse von Epoxidharzformulierungen
SG194558A1 (en) * 2011-05-02 2013-12-30 Dow Global Technologies Llc Trimethyl borate in epoxy resins

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050371B2 (ja) * 1981-10-30 1985-11-08 株式会社東芝 エポキシ樹脂組成物
JPH02103224A (ja) * 1988-10-12 1990-04-16 Three Bond Co Ltd エポキシ樹脂用潜在性硬化剤
JPH0340459A (ja) * 1989-07-07 1991-02-21 Nitto Denko Corp 半導体装置
DE69133280T2 (de) * 1990-05-21 2004-05-06 Dow Global Technologies, Inc., Midland Latente Katalysatoren, Härtungsinhibierte Epoxyharzzusammensetzungen und daraus hergestellte Laminate
JPH04284652A (ja) * 1991-03-13 1992-10-09 Nitto Denko Corp 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物ならびにその製法

Also Published As

Publication number Publication date
BR9509395A (pt) 1997-09-30
EP0787162A2 (en) 1997-08-06
TW294700B (ja) 1997-01-01
JPH10507481A (ja) 1998-07-21
WO1996012752A3 (en) 1996-07-18
WO1996012752A2 (en) 1996-05-02
KR970707199A (ko) 1997-12-01

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